Teruaki Nishinaka

Person

Saga, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Component mounting system
- Patent number 9,439,336
- Issue date Sep 6, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takahiro Yokomae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting system
- Patent number 9,332,681
- Issue date May 3, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Masayuki Mantani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate processing method, semiconductor chip manufacturing metho...
- Patent number 8,293,652
- Issue date Oct 23, 2012
- Panasonic Corporation
- Kiyoshi Arita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor chips and semiconductor wafer
- Patent number 7,989,803
- Issue date Aug 2, 2011
- Panasonic Corporation
- Kiyoshi Arita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting method
- Patent number 7,797,822
- Issue date Sep 21, 2010
- Panasonic Corporation
- Tadahiko Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method for semiconductor devices, and formation appar...
- Patent number 7,629,228
- Issue date Dec 8, 2009
- Panasonic Corporation
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor devices, arrangement determi...
- Patent number 7,488,668
- Issue date Feb 10, 2009
- Panasonic Corporation
- Kiyoshi Arita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mounting electronic parts on a flexible printed circuit b...
- Patent number 7,107,672
- Issue date Sep 19, 2006
- Matsushita Electric Industrial Co., Ltd.
- Yasuto Onitsuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for mounting soldering balls onto electrodes o...
- Patent number 6,013,899
- Issue date Jan 11, 2000
- Matsushita Electric Industrial Co., Ltd.
- Shigeru Eguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure of electronic parts and method of soldering electronic pa...
- Patent number 5,894,984
- Issue date Apr 20, 1999
- Matsushita Electric Industrial Co., Ltd.
- Tadahiko Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for packaging electronic device
- Patent number 5,779,958
- Issue date Jul 14, 1998
- Matsushita Electric Industrial Co., Ltd.
- Syoujirou Nishihara
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method and apparatus for mounting soldering balls onto electrodes o...
- Patent number 5,695,667
- Issue date Dec 9, 1997
- Matsushita Electric Industrial Co., Ltd.
- Shigeru Eguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for mounting soldering balls onto electrodes o...
- Patent number 5,655,704
- Issue date Aug 12, 1997
- Matsushita Electric Industrial Co., Ltd.
- Shoji Sakemi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of automatically mounting electronic connector onto an end o...
- Patent number 5,548,891
- Issue date Aug 27, 1996
- Matsushita Electric Industrial Co., Ltd.
- Shoji Sakemi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SET-UP ASSIST APPARATUS AND SET-UP ASSIST METHOD
- Publication number 20250056779
- Publication date Feb 13, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- Hiroaki KATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT REPLENISHMENT WORK ASSIST APPARATUS AND COMPONENT MOUNTIN...
- Publication number 20240357786
- Publication date Oct 24, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Hiroaki KATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTING SYSTEM
- Publication number 20150289426
- Publication date Oct 8, 2015
- Panasonic Intellectual Property Management Co., Ltd.
- Masayuki Mantani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT MOUNTING SYSTEM
- Publication number 20150135524
- Publication date May 21, 2015
- Panasonic Intellectual Property Management Co., Ltd.
- Takahiro YOKOMAE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE PROCESSING METHOD, SEMICONDUCTOR CHIP MANUFACTURING METHO...
- Publication number 20120015522
- Publication date Jan 19, 2012
- PANASONIC CORPORATION
- Kiyoshi Arita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT THERMO-COMPRESSION TOOL, AND ELECTRONIC COMPON...
- Publication number 20090126188
- Publication date May 21, 2009
- Tadahiko Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing Method For Semiconductor Chips And Semiconductor Wafer
- Publication number 20080128694
- Publication date Jun 5, 2008
- Kiyoshi Arita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method for semiconductor devices, and formation appar...
- Publication number 20060024924
- Publication date Feb 2, 2006
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method for semiconductor devices, arrangement determi...
- Publication number 20060019416
- Publication date Jan 26, 2006
- Kiyoshi Arita
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Transfer carrier for flexible printed circuit board and electronic...
- Publication number 20040027811
- Publication date Feb 12, 2004
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Yasuto Onitsuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Teruaki Nishinaka

Person

Patents Grantslast 30 patents

Component mounting system

Electronic component mounting system

Substrate processing method, semiconductor chip manufacturing metho...

Manufacturing method for semiconductor chips and semiconductor wafer

Electronic component mounting method

Manufacturing method for semiconductor devices, and formation appar...

Manufacturing method for semiconductor devices, arrangement determi...

Method of mounting electronic parts on a flexible printed circuit b...

Method and apparatus for mounting soldering balls onto electrodes o...

Structure of electronic parts and method of soldering electronic pa...

Method for packaging electronic device

Method and apparatus for mounting soldering balls onto electrodes o...

Method and apparatus for mounting soldering balls onto electrodes o...

Method of automatically mounting electronic connector onto an end o...

Patents Applicationslast 30 patents

SET-UP ASSIST APPARATUS AND SET-UP ASSIST METHOD

COMPONENT REPLENISHMENT WORK ASSIST APPARATUS AND COMPONENT MOUNTIN...

ELECTRONIC COMPONENT MOUNTING SYSTEM

COMPONENT MOUNTING SYSTEM

SUBSTRATE PROCESSING METHOD, SEMICONDUCTOR CHIP MANUFACTURING METHO...

ELECTRONIC COMPONENT THERMO-COMPRESSION TOOL, AND ELECTRONIC COMPON...

Manufacturing Method For Semiconductor Chips And Semiconductor Wafer

Manufacturing method for semiconductor devices, and formation appar...

Manufacturing method for semiconductor devices, arrangement determi...

Transfer carrier for flexible printed circuit board and electronic...