Teruo OKINA

Person

Yokkaichi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Three-dimensional memory device containing a pillar contact between...
- Patent number 12,108,597
- Issue date Oct 1, 2024
- SanDisk Technologies LLC
- Teruo Okina
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional memory device with separated source-side lines an...
- Patent number 11,889,684
- Issue date Jan 30, 2024
- SanDisk Technologies LLC
- Masanori Tsutsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including trench-isolated memory pl...
- Patent number 11,631,690
- Issue date Apr 18, 2023
- SanDisk Technologies LLC
- Teruo Okina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded three-dimensional memory devices and methods of making the s...
- Patent number 11,508,711
- Issue date Nov 22, 2022
- SanDisk Technologies LLC
- Takeki Ninomiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die including diffusion barrier layers embedding bond...
- Patent number 11,450,624
- Issue date Sep 20, 2022
- SanDisk Technologies LLC
- Noriaki Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die including diffusion barrier layers embedding bond...
- Patent number 11,444,039
- Issue date Sep 13, 2022
- SanDisk Technologies LLC
- Noriaki Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device with separated source-side lines an...
- Patent number 11,393,836
- Issue date Jul 19, 2022
- SanDisk Technologies LLC
- Masanori Tsutsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die containing dummy metallic pads and methods of for...
- Patent number 11,322,466
- Issue date May 3, 2022
- SanDisk Technologies LLC
- Teruo Okina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded three-dimensional memory devices and methods of making the s...
- Patent number 11,201,107
- Issue date Dec 14, 2021
- SanDisk Technologies LLC
- Teruo Okina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded three-dimensional memory devices and methods of making the s...
- Patent number 11,195,781
- Issue date Dec 7, 2021
- SanDisk Technologies LLC
- Teruo Okina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a three-dimensional memory device and a driver ci...
- Patent number 11,094,704
- Issue date Aug 17, 2021
- SanDisk Technologies LLC
- Yanli Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pads embedded in a dielectric diffusion barrier and having...
- Patent number 11,088,076
- Issue date Aug 10, 2021
- SanDisk Technologies LLC
- Teruo Okina
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES INCLUDING SELF-ALIGNED CHANNEL CAP...
- Publication number 20240407164
- Publication date Dec 5, 2024
- Western Digital Technologies, Inc.
- Naoto NORIZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING SCHOTTKY BARRIER SOURCE C...
- Publication number 20240332180
- Publication date Oct 3, 2024
- SANDISK TECHNOLOGIES LLC
- Teruo OKINA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A SOURCE STRUCTURE SURROU...
- Publication number 20240334697
- Publication date Oct 3, 2024
- SANDISK TECHNOLOGIES LLC
- Takaaki IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE CONTAINING CONSTRICTED CHANNEL ENDS AND METHODS OF MA...
- Publication number 20240215244
- Publication date Jun 27, 2024
- SANDISK TECHNOLOGIES LLC
- Hiroyuki TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING ETCH STOP METAL PLATES F...
- Publication number 20240040786
- Publication date Feb 1, 2024
- SANDISK TECHNOLOGIES LLC
- Yusuke YOSHIDA
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING ETCH STOP METAL PLATES F...
- Publication number 20240015959
- Publication date Jan 11, 2024
- SANDISK TECHNOLOGIES LLC
- Yusuke Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING A PILLAR CONTACT BETWEEN...
- Publication number 20230284443
- Publication date Sep 7, 2023
- SANDISK TECHNOLOGIES LLC
- Teruo OKINA
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING TRENCH-ISOLATED MEMORY PL...
- Publication number 20220189984
- Publication date Jun 16, 2022
- SANDISK TECHNOLOGIES LLC
- Teruo OKINA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH SEPARATED SOURCE-SIDE LINES AN...
- Publication number 20220157841
- Publication date May 19, 2022
- SANDISK TECHNOLOGIES LLC
- Masanori TSUTSUMI
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH SEPARATED SOURCE-SIDE LINES AN...
- Publication number 20220157842
- Publication date May 19, 2022
- SANDISK TECHNOLOGIES LLC
- Masanori TSUTSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE INCLUDING DIFFUSION BARRIER LAYERS EMBEDDING BOND...
- Publication number 20210375790
- Publication date Dec 2, 2021
- SANDISK TECHNOLOGIES LLC
- Noriaki ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE INCLUDING DIFFUSION BARRIER LAYERS EMBEDDING BOND...
- Publication number 20210375791
- Publication date Dec 2, 2021
- SANDISK TECHNOLOGIES LLC
- Noriaki ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE CONTAINING DUMMY METALLIC PADS AND METHODS OF FOR...
- Publication number 20210366855
- Publication date Nov 25, 2021
- SANDISK TECHNOLOGIES LLC
- Teruo OKINA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Pads Embedded in a Dielectric Diffusion Barrier and having...
- Publication number 20210202382
- Publication date Jul 1, 2021
- SANDISK TECHNOLOGIES LLC
- Teruo OKINA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A THREE-DIMENSIONAL MEMORY DEVICE AND A DRIVER CI...
- Publication number 20210134819
- Publication date May 6, 2021
- SANDISK TECHNOLOGIES LLC
- Yanli ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED THREE-DIMENSIONAL MEMORY DEVICES AND METHODS OF MAKING THE S...
- Publication number 20210091063
- Publication date Mar 25, 2021
- SANDISK TECHNOLOGIES LLC
- Takeki NINOMIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED THREE-DIMENSIONAL MEMORY DEVICES AND METHODS OF MAKING THE S...
- Publication number 20200258817
- Publication date Aug 13, 2020
- SANDISK TECHNOLOGIES LLC
- Teruo OKINA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED THREE-DIMENSIONAL MEMORY DEVICES AND METHODS OF MAKING THE S...
- Publication number 20200258816
- Publication date Aug 13, 2020
- SANDISK TECHNOLOGIES LLC
- Teruo OKINA
- H01 - BASIC ELECTRIC ELEMENTS

Teruo OKINA

Person

Patents Grantslast 30 patents

Three-dimensional memory device containing a pillar contact between...

Three-dimensional memory device with separated source-side lines an...

Three-dimensional memory device including trench-isolated memory pl...

Bonded three-dimensional memory devices and methods of making the s...

Semiconductor die including diffusion barrier layers embedding bond...

Semiconductor die including diffusion barrier layers embedding bond...

Three-dimensional memory device with separated source-side lines an...

Semiconductor die containing dummy metallic pads and methods of for...

Bonded three-dimensional memory devices and methods of making the s...

Bonded three-dimensional memory devices and methods of making the s...

Method of forming a three-dimensional memory device and a driver ci...

Bonding pads embedded in a dielectric diffusion barrier and having...

Patents Applicationslast 30 patents

THREE-DIMENSIONAL MEMORY DEVICES INCLUDING SELF-ALIGNED CHANNEL CAP...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING SCHOTTKY BARRIER SOURCE C...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A SOURCE STRUCTURE SURROU...

MEMORY DEVICE CONTAINING CONSTRICTED CHANNEL ENDS AND METHODS OF MA...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING ETCH STOP METAL PLATES F...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING ETCH STOP METAL PLATES F...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING A PILLAR CONTACT BETWEEN...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING TRENCH-ISOLATED MEMORY PL...

THREE-DIMENSIONAL MEMORY DEVICE WITH SEPARATED SOURCE-SIDE LINES AN...

THREE-DIMENSIONAL MEMORY DEVICE WITH SEPARATED SOURCE-SIDE LINES AN...

SEMICONDUCTOR DIE INCLUDING DIFFUSION BARRIER LAYERS EMBEDDING BOND...

SEMICONDUCTOR DIE INCLUDING DIFFUSION BARRIER LAYERS EMBEDDING BOND...

SEMICONDUCTOR DIE CONTAINING DUMMY METALLIC PADS AND METHODS OF FOR...

Bonding Pads Embedded in a Dielectric Diffusion Barrier and having...

METHOD OF FORMING A THREE-DIMENSIONAL MEMORY DEVICE AND A DRIVER CI...

BONDED THREE-DIMENSIONAL MEMORY DEVICES AND METHODS OF MAKING THE S...

BONDED THREE-DIMENSIONAL MEMORY DEVICES AND METHODS OF MAKING THE S...

BONDED THREE-DIMENSIONAL MEMORY DEVICES AND METHODS OF MAKING THE S...