Tetsuo Matsuda

Person

Gunma-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 11,011,609
- Issue date May 18, 2021
- Kabushiki Kaisha Toshiba
- Kenya Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,947,751
- Issue date Apr 17, 2018
- Kabushiki Kaisha Toshiba
- Kenya Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing of same
- Patent number 8,810,032
- Issue date Aug 19, 2014
- Kabushiki Kaisha Toshiba
- Tomomi Imamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including first and second semiconductor regio...
- Patent number 8,431,992
- Issue date Apr 30, 2013
- Kabushiki Kaisha Toshiba
- Kenichi Tokano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing of same
- Patent number 8,415,247
- Issue date Apr 9, 2013
- Kabushiki Kaisha Toshiba
- Tomomi Imamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing of same
- Patent number 8,067,310
- Issue date Nov 29, 2011
- Kabushiki Kaisha Toshiba
- Tomomi Imamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having trenches filled with a semiconductor ha...
- Patent number 7,936,015
- Issue date May 3, 2011
- Kabushiki Kaisha Toshiba
- Kenichi Tokano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with tapered trenches and impurity concentrati...
- Patent number 7,898,031
- Issue date Mar 1, 2011
- Kabushiki Kaisha Toshiba
- Kenichi Tokano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device with epitaxially-filled trenches
- Patent number 7,595,530
- Issue date Sep 29, 2009
- Kabushiki Kaisha Toshiba
- Kenichi Tokano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating method
- Patent number 7,575,664
- Issue date Aug 18, 2009
- Kabushiki Kaisha Toshiba
- Tetsuo Matsuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,420,245
- Issue date Sep 2, 2008
- Kabushiki Kaisha Toshiba
- Atsuko Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of performing electrolytic treatment on a conductive layer o...
- Patent number 7,387,717
- Issue date Jun 17, 2008
- Ebara Corporation
- Junji Kunisawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing electronic device
- Patent number 7,214,305
- Issue date May 8, 2007
- Kabushiki Kaisha Toshiba
- Tetsuo Matsuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device manufacturing method
- Patent number 6,998,342
- Issue date Feb 14, 2006
- Kabushiki Kaisha Toshiba
- Tetsuo Matsuda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating method and plating apparatus
- Patent number 6,913,681
- Issue date Jul 5, 2005
- Kabushiki Kaisha Toshiba
- Tetsuo Matsuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device including two-step pol...
- Patent number 6,897,143
- Issue date May 24, 2005
- Kabushiki Kaisha Toshiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 6,787,827
- Issue date Sep 7, 2004
- Kabushiki Kaisha Toshiba
- Seiji Inumiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroplating apparatus and electroplating method
- Patent number 6,767,437
- Issue date Jul 27, 2004
- Kabushiki Kaisha Toshiba
- Tetsuo Matsuda
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electronic device manufacturing method
- Patent number 6,764,585
- Issue date Jul 20, 2004
- Kabushiki Kaisha Toshiba
- Tetsuo Matsuda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming a plating film, and device for forming the same
- Patent number 6,750,143
- Issue date Jun 15, 2004
- Kabushiki Kaisha Toshiba
- Tadashi Iijima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating method and plating apparatus
- Patent number 6,746,589
- Issue date Jun 8, 2004
- Ebara Corporation
- Koji Mishima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plating substrate with copper
- Patent number 6,638,411
- Issue date Oct 28, 2003
- Ebara Corporation
- Koji Mishima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plating apparatus
- Patent number 6,632,335
- Issue date Oct 14, 2003
- Ebara Corporation
- Junji Kunisawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 6,632,476
- Issue date Oct 14, 2003
- Kabushiki Kaisha Toshiba
- Hiroko Nakamura
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Semiconductor device having a damascene type wiring layer
- Patent number 6,611,060
- Issue date Aug 26, 2003
- Kabushiki Kaisha Toshiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making multi-level wiring in a semiconductor device
- Patent number 6,579,785
- Issue date Jun 17, 2003
- Kabushiki Kaisha Toshiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Eddy current loss measuring sensor, thickness measuring system, thi...
- Patent number 6,563,308
- Issue date May 13, 2003
- Kabushiki Kaisha Toshiba
- Osamu Nagano
- G01 - MEASURING TESTING
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 6,518,177
- Issue date Feb 11, 2003
- Kabushiki Kaisha Toshiba
- Takashi Kawanoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film formation method
- Patent number 6,403,481
- Issue date Jun 11, 2002
- Kabushiki Kaisha Toshiba
- Tetsuo Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor devices
- Patent number 6,403,997
- Issue date Jun 11, 2002
- Kabushiki Kaisha Toshiba
- Seiji Inumiya
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180226473
- Publication date Aug 9, 2018
- Kabushiki Kaisha Toshiba
- Kenya KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180083110
- Publication date Mar 22, 2018
- Kabushiki Kaisha Toshiba
- Kenya KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING OF SAME
- Publication number 20130187281
- Publication date Jul 25, 2013
- Kabushiki Kaisha Toshiba
- Tomomi IMAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20130009241
- Publication date Jan 10, 2013
- Kabushiki Kaisha Toshiba
- Tetsuo Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING METAL FILM, AND METH...
- Publication number 20120313162
- Publication date Dec 13, 2012
- Kabushiki Kaisha Toshiba
- Tetsuo Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20120217575
- Publication date Aug 30, 2012
- Kabushiki Kaisha Toshiba
- Tetsuo Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR GROUP MEMBER AND SEMICONDUCTOR...
- Publication number 20120112308
- Publication date May 10, 2012
- Kabushiki Kaisha Toshiba
- Tetsuo Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20110133278
- Publication date Jun 9, 2011
- Kabushiki Kaisha Toshiba
- Kenichi Tokano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100258854
- Publication date Oct 14, 2010
- KABUSHIKI KAISHA TOSHIBA
- Kenichi Tokano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING OF SAME
- Publication number 20100164095
- Publication date Jul 1, 2010
- Kabushiki Kaisha Toshiba
- Tomomi IMAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20090302373
- Publication date Dec 10, 2009
- KABUSHIKI KAISHA TOSHIBA
- Kenichi Tokano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATING APPARATUS
- Publication number 20080296165
- Publication date Dec 4, 2008
- Junji Kunisawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS
- Publication number 20080251385
- Publication date Oct 16, 2008
- Junji Kunisawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Semiconductor device
- Publication number 20060197152
- Publication date Sep 7, 2006
- KABUSHIKI KAISHA TOSHIBA
- Kenichi Tokano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and fabrication method of the same
- Publication number 20060043480
- Publication date Mar 2, 2006
- Kabushiki Kaisha Toshiba
- Masanobu Tsuchitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20060043481
- Publication date Mar 2, 2006
- Kabushiki Kaisha Toshiba
- Atsuko Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20060006458
- Publication date Jan 12, 2006
- Kabushiki Kaisha Toshiba
- Takako Motai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plating method
- Publication number 20050211560
- Publication date Sep 29, 2005
- Kabushiki Kaisha Toshiba
- Tetsuo Matsuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Apparatus and method for processing substrate
- Publication number 20050145482
- Publication date Jul 7, 2005
- Hidenao Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20040259297
- Publication date Dec 23, 2004
- Kabushiki Kaisha Toshiba
- Seiji Inumiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing electronic device
- Publication number 20040226827
- Publication date Nov 18, 2004
- Tetsuo Matsuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electronic device manufacturing method
- Publication number 20040203221
- Publication date Oct 14, 2004
- Kabushiki Kaisha Toshiba
- Tetsuo Matsuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating method and plating apparatus
- Publication number 20040195106
- Publication date Oct 7, 2004
- Koji Mishima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating apparatus
- Publication number 20040069646
- Publication date Apr 15, 2004
- Junji Kunisawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and apparatus for plating substrate with copper
- Publication number 20040050711
- Publication date Mar 18, 2004
- Koji Mishima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of manufacturing semiconductor device and semiconductor device
- Publication number 20040005774
- Publication date Jan 8, 2004
- Kabushiki Kaisha Toshiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20030214010
- Publication date Nov 20, 2003
- Kabushiki Kaisha Toshiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDDY CURRENT LOSS MEASURING SENSOR, THICKNESS MEASURING SYSTEM, THI...
- Publication number 20030067298
- Publication date Apr 10, 2003
- Kabushiki Kaisha Toshiba
- Osamu Nagano
- G01 - MEASURING TESTING
Information Patent Application
Electroless plating solution and method of forming wiring with the...
- Publication number 20030024431
- Publication date Feb 6, 2003
- Hiroaki Inoue
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20020117698
- Publication date Aug 29, 2002
- Kabushiki Kaisha Toshiba
- Seiji Inumiya
- H01 - BASIC ELECTRIC ELEMENTS

Tetsuo Matsuda

Person

Patents Grantslast 30 patents

Method of manufacturing a semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor device and method for manufacturing of same

Semiconductor device including first and second semiconductor regio...

Semiconductor device and method for manufacturing of same

Semiconductor device and method for manufacturing of same

Semiconductor device having trenches filled with a semiconductor ha...

Semiconductor device with tapered trenches and impurity concentrati...

Power semiconductor device with epitaxially-filled trenches

Plating method

Semiconductor device and method of manufacturing the same

Method of performing electrolytic treatment on a conductive layer o...

Method of manufacturing electronic device

Electronic device manufacturing method

Plating method and plating apparatus

Method of manufacturing semiconductor device including two-step pol...

Semiconductor device and method for manufacturing the same

Electroplating apparatus and electroplating method

Electronic device manufacturing method

Method for forming a plating film, and device for forming the same

Plating method and plating apparatus

Method and apparatus for plating substrate with copper

Plating apparatus

Substrate processing method and substrate processing apparatus

Semiconductor device having a damascene type wiring layer

Method of making multi-level wiring in a semiconductor device

Eddy current loss measuring sensor, thickness measuring system, thi...

Method of manufacturing a semiconductor device

Film formation method

Method for manufacturing semiconductor devices

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING OF SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING METAL FILM, AND METH...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, SEMICONDUCTOR GROUP MEMBER AND SEMICONDUCTOR...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING OF SAME

SEMICONDUCTOR DEVICE

PLATING APPARATUS

PLATING APPARATUS

Semiconductor device

Semiconductor device and fabrication method of the same

Semiconductor device and method of manufacturing the same

Semiconductor device and method for manufacturing the same

Plating method

Apparatus and method for processing substrate

Semiconductor device and method for manufacturing the same

Method of manufacturing electronic device

Electronic device manufacturing method

Plating method and plating apparatus

Plating apparatus

Method and apparatus for plating substrate with copper

Method of manufacturing semiconductor device and semiconductor device

Semiconductor device and method of manufacturing the same

EDDY CURRENT LOSS MEASURING SENSOR, THICKNESS MEASURING SYSTEM, THI...

Electroless plating solution and method of forming wiring with the...

Semiconductor device and method for manufacturing the same