Tetsuro Sato

Person

Ageo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Resin composition comprising coated metal oxide particles, resin-at...
- Patent number 12,139,592
- Issue date Nov 12, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Toshihiro Hosoi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor package manufacturing method, and adhesive sheet used...
- Patent number 11,935,865
- Issue date Mar 19, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Toshimi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin layered product, dielectric layer, metal foil with resin, cap...
- Patent number 11,890,853
- Issue date Feb 6, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Yoshihiro Yoneda
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor package manufacturing method
- Patent number 11,876,070
- Issue date Jan 16, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Toshimi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer circuit board manufacturing method
- Patent number 11,527,415
- Issue date Dec 13, 2022
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer circuit board manufacturing method
- Patent number 11,525,073
- Issue date Dec 13, 2022
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition, metal foil provided with resin layer, metal clad...
- Patent number 11,419,210
- Issue date Aug 16, 2022
- Mitsui Mining & Smelting Co., Ltd.
- Toshifumi Matsushima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper foil with ultra thin adhesive layer, and a method for manufa...
- Patent number 8,815,387
- Issue date Aug 26, 2014
- Mitsu Minning & Smelting Co., Ltd.
- Tetsuro Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Porous metal foil and production method therefor
- Patent number 8,497,026
- Issue date Jul 30, 2013
- Mitsui Mining & Smelting Co., Ltd.
- Tetsuhiro Matsunaga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition for forming insulating layer of printed wiring board
- Patent number 8,431,224
- Issue date Apr 30, 2013
- Mitsui Mining & Smelting Co., Ltd.
- Tetsuro Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrodeposited copper foil with carrier foil with a primer resin...
- Patent number 8,304,091
- Issue date Nov 6, 2012
- Mitsui Mining & Smelting Co., Ltd.
- Tetsuhiro Matsunaga
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Method of manufacturing copper foil with insulating layer, copper f...
- Patent number 7,927,453
- Issue date Apr 19, 2011
- Mitsui Mining & Smelting Co., Ltd.
- Tetsuro Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayered printed wiring board and manufacturing method thereof
- Patent number 7,485,361
- Issue date Feb 3, 2009
- Mitsui Mining & Smelting Co., Ltd.
- Kensuke Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for preparing copper foil with insulating layer and copper f...
- Patent number 7,163,600
- Issue date Jan 16, 2007
- Mitsui Mining & Smelting Co., Ltd.
- Tetsuro Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Prepreg production method and prepeg production device and prepreg...
- Patent number 7,144,472
- Issue date Dec 5, 2006
- Mitsui Mining & Smelting Co., Ltd.
- Tetsuro Sato
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
DIELECTRIC FILLER CONTAINING RESIN FOR USE IN FORMATION OF BUILT-IN...
- Patent number 6,905,757
- Issue date Jun 14, 2005
- Mitsui Mining & Smelting Co., Ltd.
- Toshifumi Matsushima
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin-coated copper foil, and printed wiring board using resin-coat...
- Patent number 6,831,129
- Issue date Dec 14, 2004
- Mitsui Mining & Smelting Co. Ltd.
- Tetsuro Sato
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
RESIN COMPOUND FOR FABRICATING INTERLAYER DIELECTRIC OF PRINTED WIR...
- Patent number 6,716,530
- Issue date Apr 6, 2004
- Mitsui Mining & Smelting Co., Ltd.
- Tetsuro Sato
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin-coated composite foil, production and use thereof
- Patent number 6,652,962
- Issue date Nov 25, 2003
- Mitsui Mining & Smelting Co. Ltd.
- Tetsuro Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board and process for manufacturing the same
- Patent number 5,800,722
- Issue date Sep 1, 1998
- Mitsui Mining and Smelting Co., Ltd.
- Hiroaki Tsuyoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
RESIN COMPOSITION, RESIN-ATTACHED METAL FOIL, METAL-CLAD LAMINATED...
- Publication number 20230365784
- Publication date Nov 16, 2023
- Mitsui Mining and Smelting Co., Ltd.
- Toshihiro HOSOI
- B32 - LAYERED PRODUCTS
Information Patent Application
RESIN LAYERED PRODUCT, DIELECTRIC LAYER, METAL FOIL WITH RESIN, CAP...
- Publication number 20230107922
- Publication date Apr 6, 2023
- Mitsui Mining and Smelting Co., Ltd.
- Yoshihiro YONEDA
- B32 - LAYERED PRODUCTS
Information Patent Application
RESIN COMPOSITION, COPPER FOIL WITH RESIN, DIELECTRIC LAYER, COPPER...
- Publication number 20220162418
- Publication date May 26, 2022
- Mitsui Mining and Smelting Co., Ltd.
- Toshihiro HOSOI
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR PACKAGE MANUFACTURING METHOD
- Publication number 20210327847
- Publication date Oct 21, 2021
- Mitsui Mining and Smelting Co., Ltd.
- Toshimi NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE MANUFACTURING METHOD, AND ADHESIVE SHEET USED...
- Publication number 20210327848
- Publication date Oct 21, 2021
- Mitsui Mining and Smelting Co., Ltd.
- Toshimi NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CIRCUIT BOARD MANUFACTURING METHOD
- Publication number 20190378728
- Publication date Dec 12, 2019
- Mitsui Mining and Smelting Co., Ltd.
- Yoshinori MATSUURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CIRCUIT BOARD MANUFACTURING METHOD
- Publication number 20190378727
- Publication date Dec 12, 2019
- Mitsui Mining and Smelting Co., Ltd.
- Yoshinori MATSUURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE SHEET AND METHOD FOR PEELING SAME
- Publication number 20190292415
- Publication date Sep 26, 2019
- Mitsui Mining and Smelting Co., Ltd.
- Tetsuro SATO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
RESIN COMPOSITION, METAL FOIL PROVIDED WITH RESIN LAYER, METAL CLAD...
- Publication number 20150140296
- Publication date May 21, 2015
- Mitsui Mining and Smelting Co., Ltd.
- Toshifumi Matsushima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POROUS METAL FOIL AND PRODUCTION METHOD THEREFOR
- Publication number 20110318600
- Publication date Dec 29, 2011
- Mitsui Mining & Smelting Co., Ltd.
- Tetsuhiro Matsunaga
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
RESIN COMPOSITION FOR FORMING INSULATING LAYER OF PRINTED WIRING BOARD
- Publication number 20100108368
- Publication date May 6, 2010
- Mitsui Mining and Smelting Co., Ltd.
- Tetsuro Sato
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SURFACE-TREATED COPPER FOIL, SURFACE-TREATED COPPER FOIL WITH VERY...
- Publication number 20100068511
- Publication date Mar 18, 2010
- Mitsui Mining and Smelting Co., Ltd.
- Tetsuhiro Matsunaga
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Metal Composite Laminate for Producing Flexible Wiring Board and Fl...
- Publication number 20090317591
- Publication date Dec 24, 2009
- Mitsui Mining and Smelting Co., Ltd.
- Tetsuro Sato
- B32 - LAYERED PRODUCTS
Information Patent Application
Flexible Printed Wiring Board and Semiconductor Device
- Publication number 20080174016
- Publication date Jul 24, 2008
- Mitsui Mining and Smelting Co., Ltd.
- Tetsuro Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrodeposited Copper Foil with Carrier Foil with a Primer Resin...
- Publication number 20080107865
- Publication date May 8, 2008
- Mitsui Mining and Smelting Co., Ltd.
- Tetsuhiro Matsunaga
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper Foil with Ultra Thin Adhesive Layer, and a Method for Manufa...
- Publication number 20070243402
- Publication date Oct 18, 2007
- Mitsui Mining and Smelting Co., Ltd.
- Tetsuro Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayered printed wiring board and manufacturing method thereof
- Publication number 20070102804
- Publication date May 10, 2007
- Mitsui Mining and Smelting Co., Ltd.
- Kensuke Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing copper foil with insulating layer, copper f...
- Publication number 20070062640
- Publication date Mar 22, 2007
- Mitsui Mining and Smelting Co., Ltd.
- Tetsuro Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Resin layer-coated copper foil and multilayer printed wiring board...
- Publication number 20060166005
- Publication date Jul 27, 2006
- Mitsui Mining and Smelting Co., Ltd.
- Tetsuro Sato
- B32 - LAYERED PRODUCTS
Information Patent Application
Method for preparing copper foil with insulating layer and cooper f...
- Publication number 20040188134
- Publication date Sep 30, 2004
- Tetsuro Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Resin containing dielectric filler for formation of built-in capact...
- Publication number 20040147658
- Publication date Jul 29, 2004
- Toshifumi Matsushima
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Double-sided copper clad laminate and method for manufacturing the...
- Publication number 20040101696
- Publication date May 27, 2004
- Kazuhiro Yamazaki
- B32 - LAYERED PRODUCTS
Information Patent Application
Prepreg production method and prepeg production device and prepreg...
- Publication number 20040062858
- Publication date Apr 1, 2004
- Tetsuro Sato
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Resin-coated copper foil, and printed wiring board using resin-coat...
- Publication number 20030087101
- Publication date May 8, 2003
- Tetsuro Sato
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Resin compound for fabricating interlayer dielectric of printed wir...
- Publication number 20020106516
- Publication date Aug 8, 2002
- MITSUI MINING AND SMELTING CO., LTD
- Tetsuro Sato
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Tetsuro Sato

Person

Patents Grantslast 30 patents

Resin composition comprising coated metal oxide particles, resin-at...

Semiconductor package manufacturing method, and adhesive sheet used...

Resin layered product, dielectric layer, metal foil with resin, cap...

Semiconductor package manufacturing method

Multilayer circuit board manufacturing method

Multilayer circuit board manufacturing method

Resin composition, metal foil provided with resin layer, metal clad...

Copper foil with ultra thin adhesive layer, and a method for manufa...

Porous metal foil and production method therefor

Resin composition for forming insulating layer of printed wiring board

Electrodeposited copper foil with carrier foil with a primer resin...

Method of manufacturing copper foil with insulating layer, copper f...

Multilayered printed wiring board and manufacturing method thereof

Method for preparing copper foil with insulating layer and copper f...

Prepreg production method and prepeg production device and prepreg...

DIELECTRIC FILLER CONTAINING RESIN FOR USE IN FORMATION OF BUILT-IN...

Resin-coated copper foil, and printed wiring board using resin-coat...

RESIN COMPOUND FOR FABRICATING INTERLAYER DIELECTRIC OF PRINTED WIR...

Resin-coated composite foil, production and use thereof

Multilayer printed wiring board and process for manufacturing the same

Patents Applicationslast 30 patents

RESIN COMPOSITION, RESIN-ATTACHED METAL FOIL, METAL-CLAD LAMINATED...

RESIN LAYERED PRODUCT, DIELECTRIC LAYER, METAL FOIL WITH RESIN, CAP...

RESIN COMPOSITION, COPPER FOIL WITH RESIN, DIELECTRIC LAYER, COPPER...

SEMICONDUCTOR PACKAGE MANUFACTURING METHOD

SEMICONDUCTOR PACKAGE MANUFACTURING METHOD, AND ADHESIVE SHEET USED...

MULTILAYER CIRCUIT BOARD MANUFACTURING METHOD

MULTILAYER CIRCUIT BOARD MANUFACTURING METHOD

ADHESIVE SHEET AND METHOD FOR PEELING SAME

RESIN COMPOSITION, METAL FOIL PROVIDED WITH RESIN LAYER, METAL CLAD...

POROUS METAL FOIL AND PRODUCTION METHOD THEREFOR

RESIN COMPOSITION FOR FORMING INSULATING LAYER OF PRINTED WIRING BOARD

SURFACE-TREATED COPPER FOIL, SURFACE-TREATED COPPER FOIL WITH VERY...

Metal Composite Laminate for Producing Flexible Wiring Board and Fl...

Flexible Printed Wiring Board and Semiconductor Device

Electrodeposited Copper Foil with Carrier Foil with a Primer Resin...

Copper Foil with Ultra Thin Adhesive Layer, and a Method for Manufa...

Multilayered printed wiring board and manufacturing method thereof

Method of manufacturing copper foil with insulating layer, copper f...

Resin layer-coated copper foil and multilayer printed wiring board...

Method for preparing copper foil with insulating layer and cooper f...

Resin containing dielectric filler for formation of built-in capact...

Double-sided copper clad laminate and method for manufacturing the...

Prepreg production method and prepeg production device and prepreg...

Resin-coated copper foil, and printed wiring board using resin-coat...

Resin compound for fabricating interlayer dielectric of printed wir...