TETSUYA HIRAOKA

Person

KANAGAWA, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring board comprising wirings arranged with crest and trough
- Patent number 8,653,381
- Issue date Feb 18, 2014
- Fujitsu Semiconductor Limited
- Tetsuya Hiraoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,048,719
- Issue date Nov 1, 2011
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device sealed with electrical insulation sealing member
- Patent number 7,528,460
- Issue date May 5, 2009
- Fujitsu Microelectronics Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deformable semiconductor device
- Patent number 7,138,723
- Issue date Nov 21, 2006
- Fujitsu Limited
- Kazuyuki Aiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi chip package structure having a plurality of semiconductor ch...
- Patent number 6,972,487
- Issue date Dec 6, 2005
- Fujitsu Limited
- Yoshiharu Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with stack of semiconductor chips
- Patent number 6,740,970
- Issue date May 25, 2004
- Fujitsu Limited
- Tetsuya Hiraoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 6,580,173
- Issue date Jun 17, 2003
- Fujitsu Limited
- Akira Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with connection terminals in the form of a gri...
- Patent number 6,459,161
- Issue date Oct 1, 2002
- NEC Corporation
- Masayoshi Hirata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,316,838
- Issue date Nov 13, 2001
- Fujitsu Limited
- Kaname Ozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of using a jig to align and mount terminal conductors to a...
- Patent number 5,403,776
- Issue date Apr 4, 1995
- Fujitsu Limited
- Kazuto Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having spherical terminals attached to the lea...
- Patent number 5,293,072
- Issue date Mar 8, 1994
- Fujitsu Limited
- Kazuto Tsuji
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD
- Publication number 20120241197
- Publication date Sep 27, 2012
- FUJITSU SEMICONDUCTOR LIMITED
- Tetsuya HIRAOKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20090191702
- Publication date Jul 30, 2009
- FUJITSU LIMITED
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20070170600
- Publication date Jul 26, 2007
- FUJITSU LIMITED
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, method for manufacturing the semiconductor de...
- Publication number 20060226529
- Publication date Oct 12, 2006
- FUJITSU LIMITED
- Yoshiharu Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, method for manufacturing the semiconductor de...
- Publication number 20050161794
- Publication date Jul 28, 2005
- FUJITSU LIMITED
- Yoshiharu Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20050082684
- Publication date Apr 21, 2005
- FUJITSU LIMITED
- Kazuyuki Aiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with stack of semiconductor chips
- Publication number 20020171136
- Publication date Nov 21, 2002
- FUJITSU LIMITED
- Tetsuya Hiraoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, method for manufacturing the semiconductor de...
- Publication number 20020140107
- Publication date Oct 3, 2002
- FUJITSU LIMITED
- Yoshiharu Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CONNECTION TERMINALS IN THE FORM OF A GRI...
- Publication number 20020105096
- Publication date Aug 8, 2002
- MASAYOSHI HIRATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method of semiconductor device
- Publication number 20010042908
- Publication date Nov 22, 2001
- Akira Okada
- H01 - BASIC ELECTRIC ELEMENTS

TETSUYA HIRAOKA

Person

Patents Grantslast 30 patents

Wiring board comprising wirings arranged with crest and trough

Semiconductor device and manufacturing method thereof

Semiconductor device sealed with electrical insulation sealing member

Deformable semiconductor device

Multi chip package structure having a plurality of semiconductor ch...

Semiconductor device with stack of semiconductor chips

Semiconductor device and manufacturing method of semiconductor device

Semiconductor device with connection terminals in the form of a gri...

Semiconductor device

Process of using a jig to align and mount terminal conductors to a...

Semiconductor device having spherical terminals attached to the lea...

Patents Applicationslast 30 patents

WIRING BOARD

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor device and manufacturing method thereof

Semiconductor device, method for manufacturing the semiconductor de...

Semiconductor device, method for manufacturing the semiconductor de...

Semiconductor device and method for manufacturing the same

Semiconductor device with stack of semiconductor chips

Semiconductor device, method for manufacturing the semiconductor de...

SEMICONDUCTOR DEVICE WITH CONNECTION TERMINALS IN THE FORM OF A GRI...

Semiconductor device and manufacturing method of semiconductor device