Tetsuya Kurosawa

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 10,490,485
- Issue date Nov 26, 2019
- Kabushiki Kaisha Toshiba
- Naohisa Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,026,677
- Issue date Jul 17, 2018
- Kabushiki Kaisha Toshiba
- Naohisa Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module having a light-transmissive insulating body
- Patent number 9,887,311
- Issue date Feb 6, 2018
- Kabushiki Kaisha Toshiba
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, and manufacturing method and manufacturing ap...
- Patent number 8,956,917
- Issue date Feb 17, 2015
- Kabushiki Kaisha Toshiba
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and adhesive sheet
- Patent number 8,294,282
- Issue date Oct 23, 2012
- Kabushiki Kaisha Toshiba
- Hidekazu Hayashi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for manufacturing a stacked semiconductor package, and stack...
- Patent number 7,932,162
- Issue date Apr 26, 2011
- Kabushiki Kaisha Toshiba
- Junya Sagara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having semiconductor chips stacked and mounted...
- Patent number 7,892,890
- Issue date Feb 22, 2011
- Kabushiki Kaisha Toshiba
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having semiconductor chips stacked and mounted...
- Patent number 7,675,153
- Issue date Mar 9, 2010
- Kabushiki Kaisha Toshiba
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer dividing method
- Patent number 7,642,113
- Issue date Jan 5, 2010
- Kabushiki Kaisha Toshiba
- Tetsuya Kurosawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,638,858
- Issue date Dec 29, 2009
- Kabushiki Kaisha Toshiba
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of and mechanism for peeling adhesive tape bonded to segment...
- Patent number 7,631,680
- Issue date Dec 15, 2009
- Kabushiki Kaisha Toshiba
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having a semiconductor element with a...
- Patent number 7,608,911
- Issue date Oct 27, 2009
- Kabushiki Kaisha Toshiba
- Takashi Imoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device package having a semic...
- Patent number 7,405,159
- Issue date Jul 29, 2008
- Kabushiki Kaisha Toshiba
- Takashi Imoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of and mechanism for peeling adhesive tape bonded to segment...
- Patent number 7,300,818
- Issue date Nov 27, 2007
- Kabushiki Kaisha Toshiba
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for cleaving a wafer through expansion resulti...
- Patent number 7,294,558
- Issue date Nov 13, 2007
- Kabushiki Kaisha Toshiba
- Noriko Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor manufacturing apparatus and method of manufacturing s...
- Patent number 7,223,319
- Issue date May 29, 2007
- Kabushiki Kaisha Toshiba
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,217,640
- Issue date May 15, 2007
- Kabushiki Kaisha Toshiba
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having a semiconductor element with resin
- Patent number 7,202,563
- Issue date Apr 10, 2007
- Kabushiki Kaisha Toshiba
- Takashi Imoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Peeling device and peeling method
- Patent number 7,172,673
- Issue date Feb 6, 2007
- Kabushiki Kaisha Toshiba
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing apparatus and semiconductor devi...
- Patent number 7,140,951
- Issue date Nov 28, 2006
- Kabushiki Kaisha Toshiba
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of and mechanism for peeling adhesive tape bonded to segment...
- Patent number 7,060,593
- Issue date Jun 13, 2006
- Kabushiki Kaisha Toshiba
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 7,060,532
- Issue date Jun 13, 2006
- Kabushiki Kaisha Toshiba
- Shinya Takyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device whose semiconductor chip has chamfered backsid...
- Patent number 6,933,211
- Issue date Aug 23, 2005
- Kabushiki Kaisha Toshiba
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device whose semiconductor chip has chamfered backsid...
- Patent number 6,933,606
- Issue date Aug 23, 2005
- Kabushiki Kaisha Toshiba
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method for reinforcing chip by u...
- Patent number 6,777,313
- Issue date Aug 17, 2004
- Kabushiki Kaisha Toshiba
- Shinya Takyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip pickup device and method of manufacturing semiconductor device
- Patent number 6,774,011
- Issue date Aug 10, 2004
- Kabushiki Kaisha Toshiba
- Takahito Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer dividing apparatus and semiconductor device man...
- Patent number 6,756,562
- Issue date Jun 29, 2004
- Kabushiki Kaisha Toshiba
- Tetsuya Kurosawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor manufacturing equipment
- Patent number 6,739,326
- Issue date May 25, 2004
- Kabushiki Kaisha Toshiba
- Tetsuya Kurosawa
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Semiconductor chip pickup device and pickup method
- Patent number 6,709,543
- Issue date Mar 23, 2004
- Kabushiki Kaisha Toshiba
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer splitting method using cleavage
- Patent number 6,699,774
- Issue date Mar 2, 2004
- Kabushiki Kaisha Toshiba
- Shinya Takyu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180331019
- Publication date Nov 15, 2018
- Kabushiki Kaisha Toshiba
- Naohisa OKUMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170250124
- Publication date Aug 31, 2017
- Kabushiki Kaisha Toshiba
- Naohisa OKUMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE HAVING A LIGHT-TRANSMISSIVE INSULATING BODY
- Publication number 20170244003
- Publication date Aug 24, 2017
- Kabushiki Kaisha Toshiba
- Tetsuya KUROSAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20120235282
- Publication date Sep 20, 2012
- Kabushiki Kaisha Toshiba
- Akira TOMONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD AND MANUFACTURING AP...
- Publication number 20120187542
- Publication date Jul 26, 2012
- Kabushiki Kaisha Toshiba
- Tetsuya KUROSAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A STACKED SEMICONDUCTOR PACKAGE, AND STACK...
- Publication number 20110163459
- Publication date Jul 7, 2011
- Kabushiki Kaisha Toshiba
- Junya SAGARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ADHESIVE SHEET
- Publication number 20110068480
- Publication date Mar 24, 2011
- Hidekazu Hayashi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20100311224
- Publication date Dec 9, 2010
- Kabushiki Kaisha Toshiba
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING SEMICONDUCTOR CHIPS STACKED AND MOUNTED...
- Publication number 20100112755
- Publication date May 6, 2010
- Kabushiki Kaisha Toshiba
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A STACKED SEMICONDUCTOR PACKAGE, AND STACK...
- Publication number 20090096110
- Publication date Apr 16, 2009
- Kabushiki Kaisha Toshiba
- Junya SAGARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20080265443
- Publication date Oct 30, 2008
- KABUSHIKI KAISHA TOSHIBA,
- Takashi Imoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of and mechanism for peeling adhesive tape bonded to segment...
- Publication number 20070197002
- Publication date Aug 23, 2007
- Kabushiki Kaisha Toshiba
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20070196956
- Publication date Aug 23, 2007
- Kabushiki Kaisha Toshiba
- Takashi Imoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20070187802
- Publication date Aug 16, 2007
- Kabushiki Kaisha Toshiba
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer dividing method
- Publication number 20070105345
- Publication date May 10, 2007
- Tetsuya Kurosawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device having semiconductor chips stacked and mounted...
- Publication number 20060175697
- Publication date Aug 10, 2006
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of and mechanism for peeling adhesive tape bonded to segment...
- Publication number 20060019428
- Publication date Jan 26, 2006
- Kabushiki Kaisha Toshiba
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20050212145
- Publication date Sep 29, 2005
- Takashi Imoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Peeling device and peeling method
- Publication number 20050205204
- Publication date Sep 22, 2005
- Kabushiki Kaisha Toshiba
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for cleaving a wafer through expansion resulti...
- Publication number 20050196899
- Publication date Sep 8, 2005
- Noriko Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device whose semiconductor chip has chamfered backsid...
- Publication number 20050029628
- Publication date Feb 10, 2005
- Kabushiki Kaisha Toshiba
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer dividing apparatus and semiconductor device man...
- Publication number 20050023260
- Publication date Feb 3, 2005
- Shinya Takyu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing semiconductor device and manufacturing appa...
- Publication number 20050016678
- Publication date Jan 27, 2005
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor manufacturing apparatus and method of manufacturing s...
- Publication number 20050019980
- Publication date Jan 27, 2005
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20050006725
- Publication date Jan 13, 2005
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method of semiconductor device
- Publication number 20050003636
- Publication date Jan 6, 2005
- Shinya Takyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device manufacturing apparatus and semiconductor devi...
- Publication number 20040137699
- Publication date Jul 15, 2004
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device whose semiconductor chip has chamfered backsid...
- Publication number 20040130004
- Publication date Jul 8, 2004
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer splitting method using cleavage
- Publication number 20030129809
- Publication date Jul 10, 2003
- Shinya Takyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of and mechanism for peeling adhesive tape bonded to segment...
- Publication number 20030060021
- Publication date Mar 27, 2003
- Kabushiki Kaisha Toshiba
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS

Tetsuya Kurosawa

Person

Patents Grantslast 30 patents

Semiconductor device

Semiconductor device

Semiconductor module having a light-transmissive insulating body

Semiconductor device, and manufacturing method and manufacturing ap...

Semiconductor device and adhesive sheet

Method for manufacturing a stacked semiconductor package, and stack...

Semiconductor device having semiconductor chips stacked and mounted...

Semiconductor device having semiconductor chips stacked and mounted...

Semiconductor wafer dividing method

Semiconductor device and manufacturing method thereof

Method of and mechanism for peeling adhesive tape bonded to segment...

Semiconductor device package having a semiconductor element with a...

Method of fabricating a semiconductor device package having a semic...

Method of and mechanism for peeling adhesive tape bonded to segment...

Method and apparatus for cleaving a wafer through expansion resulti...

Semiconductor manufacturing apparatus and method of manufacturing s...

Semiconductor device and manufacturing method thereof

Semiconductor device package having a semiconductor element with resin

Peeling device and peeling method

Semiconductor device manufacturing apparatus and semiconductor devi...

Method of and mechanism for peeling adhesive tape bonded to segment...

Manufacturing method of semiconductor device

Semiconductor device whose semiconductor chip has chamfered backsid...

Semiconductor device whose semiconductor chip has chamfered backsid...

Semiconductor device manufacturing method for reinforcing chip by u...

Chip pickup device and method of manufacturing semiconductor device

Semiconductor wafer dividing apparatus and semiconductor device man...

Semiconductor manufacturing equipment

Semiconductor chip pickup device and pickup method

Wafer splitting method using cleavage

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE HAVING A LIGHT-TRANSMISSIVE INSULATING BODY

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD AND MANUFACTURING AP...

METHOD FOR MANUFACTURING A STACKED SEMICONDUCTOR PACKAGE, AND STACK...

SEMICONDUCTOR DEVICE AND ADHESIVE SHEET

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE HAVING SEMICONDUCTOR CHIPS STACKED AND MOUNTED...

METHOD FOR MANUFACTURING A STACKED SEMICONDUCTOR PACKAGE, AND STACK...

Semiconductor device and method of manufacturing the same

Method of and mechanism for peeling adhesive tape bonded to segment...

Semiconductor device and method of manufacturing the same

Semiconductor device and manufacturing method thereof

Semiconductor wafer dividing method

Semiconductor device having semiconductor chips stacked and mounted...

Method of and mechanism for peeling adhesive tape bonded to segment...

Semiconductor device and method of manufacturing the same

Peeling device and peeling method

Method and apparatus for cleaving a wafer through expansion resulti...

Semiconductor device whose semiconductor chip has chamfered backsid...

Semiconductor wafer dividing apparatus and semiconductor device man...

Method of manufacturing semiconductor device and manufacturing appa...

Semiconductor manufacturing apparatus and method of manufacturing s...

Semiconductor device and manufacturing method thereof

Manufacturing method of semiconductor device

Semiconductor device manufacturing apparatus and semiconductor devi...

Semiconductor device whose semiconductor chip has chamfered backsid...

Wafer splitting method using cleavage

Method of and mechanism for peeling adhesive tape bonded to segment...