Thai Kee Gan

Person

Melaka, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with wire bond joints
- Patent number 12,205,874
- Issue date Jan 21, 2025
- Infineon Technologies AG
- Mohd Kahar Bajuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and semiconductor arrangement having thermally conduct...
- Patent number 12,068,213
- Issue date Aug 20, 2024
- Infineon Technologies AG
- Thai Kee Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three level interconnect clip
- Patent number 12,057,376
- Issue date Aug 6, 2024
- Infineon Technologies AG
- Azlina Kassim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a chip carrier with a pad offset feature
- Patent number 11,984,392
- Issue date May 14, 2024
- Infineon Technologies AG
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with wire bond joints and related methods of...
- Patent number 11,842,953
- Issue date Dec 12, 2023
- Infineon Technologies AG
- Mohd Kahar Bajuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage semiconductor package with pin fit leads
- Patent number 11,652,078
- Issue date May 16, 2023
- Infineon Technologies AG
- Edmund Sales Cabatbat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including leads of different lengths
- Patent number 11,417,538
- Issue date Aug 16, 2022
- Infineon Technologies AG
- Thai Kee Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and lead frame design for enhanced creepage and clearance
- Patent number 11,348,866
- Issue date May 31, 2022
- Infineon Technologies Austria AG
- Thai Kee Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with space efficient lead and die pad design
- Patent number 11,069,600
- Issue date Jul 20, 2021
- Infineon Technologies AG
- Ke Yan Tean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frames including lead posts in different planes
- Patent number 11,011,456
- Issue date May 18, 2021
- Infineon Technologies AG
- Thai Kee Gan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LEADFRAME COMPRISING A LEAD WITH AN ELEVATION FOR INCREASING MECHAN...
- Publication number 20240347427
- Publication date Oct 17, 2024
- INFINEON TECHNOLOGIES AG
- Edward FÜRGUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE IN A SOURCE-DOWN CONFIGURATION BY USE OF VERT...
- Publication number 20240243092
- Publication date Jul 18, 2024
- Infineon Technologies Austria AG
- Edward Fürgut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Current Sensing
- Publication number 20240170374
- Publication date May 23, 2024
- Shu Hui Goh
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGE WITH WIRE BOND JOINTS
- Publication number 20240105564
- Publication date Mar 28, 2024
- INFINEON TECHNOLOGIES AG
- Mohd Kahar Bajuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240087995
- Publication date Mar 14, 2024
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH WIRE BOND JOINTS AND RELATED METHODS OF...
- Publication number 20220352056
- Publication date Nov 3, 2022
- Mohd Kahar Bajuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE SEMICONDUCTOR PACKAGE WITH PIN FIT LEADS
- Publication number 20220336401
- Publication date Oct 20, 2022
- Edmund Sales Cabatbat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE, SEMICONDUCTOR ARRANGEMENT, METHOD OF FORMING A CHIP P...
- Publication number 20220173006
- Publication date Jun 2, 2022
- Thai Kee Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three Level Interconnect Clip
- Publication number 20220139811
- Publication date May 5, 2022
- Azlina Kassim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING A U-SHAPED RAIL
- Publication number 20220108949
- Publication date Apr 7, 2022
- INFINEON TECHNOLOGIES AG
- Lee Shuang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A CHIP CARRIER WITH A PAD OFFSET FEATURE
- Publication number 20220102263
- Publication date Mar 31, 2022
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package and Lead Frame Design for Enhanced Creepage and Clearance
- Publication number 20210391246
- Publication date Dec 16, 2021
- Infineon Technologies Austria AG
- Thai Kee Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING LEADS OF DIFFERENT LENGTHS
- Publication number 20210366728
- Publication date Nov 25, 2021
- INFINEON TECHNOLOGIES AG
- Thai Kee Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAMES INCLUDING LEAD POSTS IN DIFFERENT PLANES
- Publication number 20210005541
- Publication date Jan 7, 2021
- INFINEON TECHNOLOGIES AG
- Thai Kee Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Space Efficient Lead and Die Pad Design
- Publication number 20200373228
- Publication date Nov 26, 2020
- Ke Yan Tean
- H01 - BASIC ELECTRIC ELEMENTS

Thai Kee Gan

Person

Patents Grantslast 30 patents

Semiconductor package with wire bond joints

Chip package and semiconductor arrangement having thermally conduct...

Three level interconnect clip

Semiconductor package having a chip carrier with a pad offset feature

Semiconductor package with wire bond joints and related methods of...

High voltage semiconductor package with pin fit leads

Semiconductor package including leads of different lengths

Package and lead frame design for enhanced creepage and clearance

Semiconductor package with space efficient lead and die pad design

Lead frames including lead posts in different planes

Patents Applicationslast 30 patents

LEADFRAME COMPRISING A LEAD WITH AN ELEVATION FOR INCREASING MECHAN...

SEMICONDUCTOR PACKAGE IN A SOURCE-DOWN CONFIGURATION BY USE OF VERT...

Semiconductor Package with Current Sensing

SEMICONDUCTOR PACKAGE WITH WIRE BOND JOINTS

POWER SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE WITH WIRE BOND JOINTS AND RELATED METHODS OF...

HIGH VOLTAGE SEMICONDUCTOR PACKAGE WITH PIN FIT LEADS

CHIP PACKAGE, SEMICONDUCTOR ARRANGEMENT, METHOD OF FORMING A CHIP P...

Three Level Interconnect Clip

SEMICONDUCTOR PACKAGES INCLUDING A U-SHAPED RAIL

SEMICONDUCTOR PACKAGE HAVING A CHIP CARRIER WITH A PAD OFFSET FEATURE

Package and Lead Frame Design for Enhanced Creepage and Clearance

SEMICONDUCTOR PACKAGE INCLUDING LEADS OF DIFFERENT LENGTHS

LEAD FRAMES INCLUDING LEAD POSTS IN DIFFERENT PLANES

Semiconductor Package with Space Efficient Lead and Die Pad Design