Theodore R. Golubic

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Glendale, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package having isolated heatsink bonding pads
- Patent number 5,990,554
- Issue date Nov 23, 1999
- Motorola, Inc.
- Theodore R. Golubic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process and apparatus for forming and testing semiconductor package...
- Patent number 5,585,281
- Issue date Dec 17, 1996
- Motorola, Inc.
- Darrell Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Unitary silicon die module
- Patent number 5,473,192
- Issue date Dec 5, 1995
- Motorola, Inc.
- Theodore R. Golubic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-level semiconductor package
- Patent number 4,994,897
- Issue date Feb 19, 1991
- Motorola, Inc.
- Theodore R. Golubic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Positive stop, pick up tool
- Patent number 4,832,784
- Issue date May 23, 1989
- Motorola Inc.
- Theodore R. Golubic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional interconnected integrated circuit
- Patent number 4,801,992
- Issue date Jan 31, 1989
- Motorola Inc.
- Theodore R. Golubic
- H01 - BASIC ELECTRIC ELEMENTS