Claims
- 1. A semiconductor package, comprising:
- a leadframe comprised of a heatsink having a generally planar top surface and a bottom surface;
- at least one isolated portion formed on the generally panar top surface of the heatsink for bonding a connection means there to and wherein the isolated portion is elevated from the generally planar top surface of the heatsink and has a size and configuration adjacent the connection means to prevent movement of a mold compound perpendicular to the generally planar top surface of the heatsink locally around the connection means; and
- further comprising an indentation formed in the bottom planar surface below the isolated portion.
- 2. A semiconductor package, comprising:
- a leadframe comprised of a heatsink having a generally is planar top surface and a bottom surface;
- a pad formed on the heatsink for bonding a wire thereto, wherein the pad is elevated from the generally planar top surface of the heatsink and wherein the pad has a width narrow enough and a configuration adjacent the wire to prevent the movement of a mold compound perpendicular to the generally planar top surface of the leadframe locally around the wire; and
- further comprising an indentation formed in the bottom planar surface below the pad.
- 3. The semiconductor package, comprising:
- a leadframe comprised of a heatsink having a generally planar top surface for bonding a semiconductor die thereto and a bottom surface;
- a semiconductor die bonded to the heatsink;
- an isolated bonding pad formed on the heatsink, wherein the isolated bonding pad is elevated from the generally planar top surface of the heatsink and isolated from the rest of the heatsink;
- a wire bonded to at least the isolated bonding pad;
- a mold compound formed around the wire, wherein the isolated bonding pad is small enough and is configured adjacent the wire to prevent the movement of the mold compound perpendicular to the generally planar top surface of the heatsink locally around the wire to prevent lifting of the wire from the isolated bonding pad; and
- further comprising an indentation formed in the bottom planar surface below the isolated bonding pad.
Parent Case Info
This application is a continuation of prior application Ser. No. 07/620,871, filed Dec. 3. 1990, now abandoned.
US Referenced Citations (3)
Number |
Name |
Date |
Kind |
4107727 |
Ikezawa et al. |
Aug 1978 |
|
4990720 |
Kaufman |
Feb 1991 |
|
4994897 |
Golubic et al. |
Feb 1991 |
|
Continuations (1)
|
Number |
Date |
Country |
Parent |
620871 |
Dec 1990 |
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