Thiagarajan Raman

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus including integrated pads and methods of manufacturing th...
- Patent number 11,824,025
- Issue date Nov 21, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnect structures with narrowed portions, and a...
- Patent number 11,676,932
- Issue date Jun 13, 2023
- Micron Technology, Inc.
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONNECTING SEMICONDUCTOR DIES THROUGH TRACES
- Publication number 20240079369
- Publication date Mar 7, 2024
- Micron Technology, Inc.
- Terrence B. McDaniel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES HAVING FACE-TO-FACE SUBASSEMBLIES,...
- Publication number 20240071891
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Thiagarajan Raman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES WITH COPLANAR INTERCONNECT STRUCTUR...
- Publication number 20240071914
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Thiagarajan Raman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS INCLUDING INTEGRATED PADS AND METHODS OF MANUFACTURING TH...
- Publication number 20240063156
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FUSION BONDING SEMICONDUCTOR DEVICES TO TEMPORARY CARRI...
- Publication number 20240063207
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR VERTICALLY ASSEMBLED SEMICONDUCTOR DIES
- Publication number 20240055400
- Publication date Feb 15, 2024
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE CONNECTIONS FOR RECESSED SEMICONDUCTOR DIES
- Publication number 20240055397
- Publication date Feb 15, 2024
- Micron Technology, Inc.
- Thiagarajan Raman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED SEMICONDUCTOR DEVICE
- Publication number 20240047396
- Publication date Feb 8, 2024
- Micron Technology, Inc.
- Thiagarajan Raman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS INCLUDING INTEGRATED PADS AND METHODS OF MANUFACTURING TH...
- Publication number 20230056579
- Publication date Feb 23, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERCONNECT STRUCTURES WITH NARROWED PORTIONS, AND A...
- Publication number 20210202430
- Publication date Jul 1, 2021
- Micron Technology, Inc.
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS

Thiagarajan Raman

Person

Patents Grantslast 30 patents

Apparatus including integrated pads and methods of manufacturing th...

Semiconductor interconnect structures with narrowed portions, and a...

Patents Applicationslast 30 patents

CONNECTING SEMICONDUCTOR DIES THROUGH TRACES

SEMICONDUCTOR DEVICE ASSEMBLIES HAVING FACE-TO-FACE SUBASSEMBLIES,...

SEMICONDUCTOR DEVICE ASSEMBLIES WITH COPLANAR INTERCONNECT STRUCTUR...

APPARATUS INCLUDING INTEGRATED PADS AND METHODS OF MANUFACTURING TH...

METHODS FOR FUSION BONDING SEMICONDUCTOR DEVICES TO TEMPORARY CARRI...

SUBSTRATE FOR VERTICALLY ASSEMBLED SEMICONDUCTOR DIES

THROUGH-SUBSTRATE CONNECTIONS FOR RECESSED SEMICONDUCTOR DIES

BONDED SEMICONDUCTOR DEVICE

APPARATUS INCLUDING INTEGRATED PADS AND METHODS OF MANUFACTURING TH...

SEMICONDUCTOR INTERCONNECT STRUCTURES WITH NARROWED PORTIONS, AND A...