Thomas A. Boyd

Person

North Plains, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Compression mounted technology (CMT) socket retention mechanisms to...
- Patent number 12,127,363
- Issue date Oct 22, 2024
- Intel Corporation
- Feifei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket load regulation utilizing CPU carriers with shim components
- Patent number 11,818,832
- Issue date Nov 14, 2023
- Intel Corporation
- Feroz Mohammad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanism combining fastener captivation and assembly tilt control...
- Patent number 11,557,529
- Issue date Jan 17, 2023
- Intel Corporation
- Thomas Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for detaching a microprocessor from a heat sink
- Patent number 11,296,009
- Issue date Apr 5, 2022
- Intel Corporation
- Rolf Laido
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Server microprocessor carrier with guiding alignment anti-tilt and...
- Patent number 11,291,115
- Issue date Mar 29, 2022
- Intel Corporation
- Shelby A. Ferguson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular thermal energy management designs for data center computing
- Patent number 11,032,941
- Issue date Jun 8, 2021
- Intel Corporation
- Minh Le
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connector for processor package
- Patent number 10,541,494
- Issue date Jan 21, 2020
- Intel Corporation
- Donald T. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device, socket, and spacer to alter socket profile
- Patent number 10,455,685
- Issue date Oct 22, 2019
- Intel Corporation
- Steven A. Klein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanical seal and reservoir for microelectronic packages
- Patent number 10,418,309
- Issue date Sep 17, 2019
- Intel Corporation
- Bijoyraj Sahu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rework grid array interposer with direct power
- Patent number 10,211,120
- Issue date Feb 19, 2019
- Intel Corporation
- Russell S. Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector port frame for processor package
- Patent number 10,109,940
- Issue date Oct 23, 2018
- Intel Corporation
- Thomas A. Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for installing integrated circuit devices on a substrate
- Patent number 10,057,994
- Issue date Aug 21, 2018
- Intel Corporation
- Thomas A. Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package alignment frame for local reflow
- Patent number 9,991,223
- Issue date Jun 5, 2018
- Intel Corporation
- Russell S. Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Linear edge connector with activator bar and contact load spring
- Patent number 9,859,636
- Issue date Jan 2, 2018
- Intel Corporation
- Thomas A. Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automatic height compensating and co-planar leveling heat removal a...
- Patent number 9,743,558
- Issue date Aug 22, 2017
- Intel Corporation
- Henry C. Bosak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for a microelectronic die, microelectronic assembly contain...
- Patent number 9,478,476
- Issue date Oct 25, 2016
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assembly for installing integrated circuit devices on a...
- Patent number 9,245,818
- Issue date Jan 26, 2016
- Intel Corporation
- Thomas A. Boyd
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adjustable guide mechanism for computer add in card retention
- Patent number 6,556,451
- Issue date Apr 29, 2003
- Intel Corporation
- Ricky R. Feightner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling duct for a computer cooling system with redundant air movin...
- Patent number 6,021,042
- Issue date Feb 1, 2000
- Intel Corporation
- Paul H. Anderson
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
COMPRESSION MOUNTED TECHNOLOGY (CMT) SOCKET RETENTION MECHANISMS TO...
- Publication number 20220102887
- Publication date Mar 31, 2022
- Intel Corporation
- Feifei CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPRESSION MOUNTED TECHNOLOGY (CMT) SOCKET SYSTEM RETENTION MECHAN...
- Publication number 20220102889
- Publication date Mar 31, 2022
- Intel Corporation
- Thomas BOYD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOCKET LOAD REGULATION UTILIZING CPU CARRIERS WITH SHIM COMPONENTS
- Publication number 20210307153
- Publication date Sep 30, 2021
- Intel Corporation
- Feroz MOHAMMAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANISM COMBINING FASTENER CAPTIVATION AND ASSEMBLY TILT CONTROL...
- Publication number 20190304870
- Publication date Oct 3, 2019
- Intel Corporation
- Thomas Boyd
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SERVER MICROPROCESSOR CARRIER WITH GUIDING ALIGNMENT ANTI-TILT AND...
- Publication number 20190306985
- Publication date Oct 3, 2019
- Shelby A. Ferguson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR DETACHING A MICROPROCESSOR FROM A HEAT SINK
- Publication number 20190304871
- Publication date Oct 3, 2019
- Intel Corporation
- Rolf Laido
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULAR THERMAL ENERGY MANAGEMENT DESIGNS FOR DATA CENTER COMPUTING
- Publication number 20190223324
- Publication date Jul 18, 2019
- Intel Corporation
- Minh Le
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTOR FOR PROCESSOR PACKAGE
- Publication number 20190052016
- Publication date Feb 14, 2019
- Intel Corporation
- Donald T. TRAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR PORT FRAME FOR PROCESSOR PACKAGE
- Publication number 20180166807
- Publication date Jun 14, 2018
- THOMAS A. BOYD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Linear edge connector with activator bar and contact load spring
- Publication number 20170187134
- Publication date Jun 29, 2017
- Intel Corporation
- Thomas A. Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Rework grid array interposer with direct power
- Publication number 20170186661
- Publication date Jun 29, 2017
- Intel Corporation
- Russell S. Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ALIGNMENT FRAME FOR LOCAL REFLOW
- Publication number 20170179067
- Publication date Jun 22, 2017
- Intel Corporation
- RUSSELL S. AOKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BULK SOLDER REMOVAL ON PROCESSOR PACKAGING
- Publication number 20170179066
- Publication date Jun 22, 2017
- Russell S. Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT CHIP ATTACHMENT USING LOCAL HEAT SOURCE
- Publication number 20160351526
- Publication date Dec 1, 2016
- Intel Corporation
- Thomas Alan Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ASSEMBLY FOR INSTALLING INTEGRATED CIRCUIT DEVICES ON A...
- Publication number 20160105974
- Publication date Apr 14, 2016
- Intel Corporation
- Thomas A. BOYD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOMATIC HEIGHT COMPENSATING AND CO-PLANAR LEVELING HEAT REMOVAL A...
- Publication number 20160106003
- Publication date Apr 14, 2016
- Intel Corporation
- Henry C. Bosak
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED ASSEMBLY FOR INSTALLING INTEGRATED CIRCUIT DEVICES ON A...
- Publication number 20140092547
- Publication date Apr 3, 2014
- Thomas A. BOYD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR A MICROELECTRONIC DIE, MICROELECTRONIC ASSEMBLY CONTAIN...
- Publication number 20130270691
- Publication date Oct 17, 2013
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS

Thomas A. Boyd

Person

Patents Grantslast 30 patents

Compression mounted technology (CMT) socket retention mechanisms to...

Socket load regulation utilizing CPU carriers with shim components

Mechanism combining fastener captivation and assembly tilt control...

Method and apparatus for detaching a microprocessor from a heat sink

Server microprocessor carrier with guiding alignment anti-tilt and...

Modular thermal energy management designs for data center computing

Connector for processor package

Electronic device, socket, and spacer to alter socket profile

Mechanical seal and reservoir for microelectronic packages

Rework grid array interposer with direct power

Connector port frame for processor package

Method for installing integrated circuit devices on a substrate

Semiconductor package alignment frame for local reflow

Linear edge connector with activator bar and contact load spring

Automatic height compensating and co-planar leveling heat removal a...

Package for a microelectronic die, microelectronic assembly contain...

Integrated assembly for installing integrated circuit devices on a...

Adjustable guide mechanism for computer add in card retention

Cooling duct for a computer cooling system with redundant air movin...

Patents Applicationslast 30 patents

COMPRESSION MOUNTED TECHNOLOGY (CMT) SOCKET RETENTION MECHANISMS TO...

COMPRESSION MOUNTED TECHNOLOGY (CMT) SOCKET SYSTEM RETENTION MECHAN...

SOCKET LOAD REGULATION UTILIZING CPU CARRIERS WITH SHIM COMPONENTS

MECHANISM COMBINING FASTENER CAPTIVATION AND ASSEMBLY TILT CONTROL...

SERVER MICROPROCESSOR CARRIER WITH GUIDING ALIGNMENT ANTI-TILT AND...

METHOD AND APPARATUS FOR DETACHING A MICROPROCESSOR FROM A HEAT SINK

MODULAR THERMAL ENERGY MANAGEMENT DESIGNS FOR DATA CENTER COMPUTING

CONNECTOR FOR PROCESSOR PACKAGE

CONNECTOR PORT FRAME FOR PROCESSOR PACKAGE

Linear edge connector with activator bar and contact load spring

Rework grid array interposer with direct power

SEMICONDUCTOR PACKAGE ALIGNMENT FRAME FOR LOCAL REFLOW

BULK SOLDER REMOVAL ON PROCESSOR PACKAGING

INTEGRATED CIRCUIT CHIP ATTACHMENT USING LOCAL HEAT SOURCE

INTEGRATED ASSEMBLY FOR INSTALLING INTEGRATED CIRCUIT DEVICES ON A...

AUTOMATIC HEIGHT COMPENSATING AND CO-PLANAR LEVELING HEAT REMOVAL A...

INTEGRATED ASSEMBLY FOR INSTALLING INTEGRATED CIRCUIT DEVICES ON A...

PACKAGE FOR A MICROELECTRONIC DIE, MICROELECTRONIC ASSEMBLY CONTAIN...