Thomas D. Nguyen

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Campbell, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for reducing He backside faults during wafer p...
- Patent number 6,899,109
- Issue date May 31, 2005
- Lam Research Corporation
- Thomas D. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for reducing He backside faults during wafer p...
- Patent number 6,733,594
- Issue date May 11, 2004
- Lam Research Corporation
- Thomas D. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for improving etching in a plasma processing chamber
- Patent number 6,410,451
- Issue date Jun 25, 2002
- Lam Research Corporation
- Thomas D. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanism for bow reduction and critical dimension control in etchi...
- Patent number 6,217,786
- Issue date Apr 17, 2001
- Lam Research Corporation
- Graham Hills
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for etching silicon dioxide using fluorocarbon gas chemistry
- Patent number 6,117,786
- Issue date Sep 12, 2000
- Lam Research Corporation
- Keyvan Khajehnouri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for selective plasma etch
- Patent number 6,090,304
- Issue date Jul 18, 2000
- Lam Research Corporation
- Helen H. Zhu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method and apparatus for reducing he backside faults during wafer p...
- Publication number 20020078976
- Publication date Jun 27, 2002
- Thomas D. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR IMPROVING ETCHING IN A PLASMA PROCESSING CHAMBER
- Publication number 20010044212
- Publication date Nov 22, 2001
- THOMAS D. NGUYEN
- H01 - BASIC ELECTRIC ELEMENTS