Thomas E. Miller

Person

Menlo Park, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of providing a printed circuit board with an edge connection...
- Patent number 7,712,210
- Issue date May 11, 2010
- Endicott Interconnect Technologies, Inc.
- Thomas R. Miller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a BGA package having decreased adhesion
- Patent number 7,615,477
- Issue date Nov 10, 2009
- International Business Machines Corporation
- John U. Knickerbocker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making circuitized substrate with solder paste connections
- Patent number 7,547,577
- Issue date Jun 16, 2009
- Endicott Interconnect Technologies, Inc.
- Norman A. Card
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a printed wiring board with conformally plated cir...
- Patent number 7,378,227
- Issue date May 27, 2008
- International Business Machines Corporation
- Edmond Otto Fey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and structure for an organic package with improved BGA life
- Patent number 7,148,566
- Issue date Dec 12, 2006
- International Business Machines Corporation
- John U. Knickerbocker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Joining member for Z-interconnect in electronic devices without con...
- Patent number 7,083,901
- Issue date Aug 1, 2006
- International Business Machines Corporation
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and structure for small pitch z-axis electrical interconnect...
- Patent number 6,955,849
- Issue date Oct 18, 2005
- International Business Machines Corporation
- Brian E. Curcio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuitized substrate and method of making same
- Patent number 6,905,589
- Issue date Jun 14, 2005
- Endicott Interconnect Technologies, Inc.
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Colloidal seed formulation for printed circuit board metallization
- Patent number 6,852,152
- Issue date Feb 8, 2005
- International Business Machines Corporation
- Raymond T. Galasco
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for producing an electronic package possessing controlled im...
- Patent number 6,845,557
- Issue date Jan 25, 2005
- International Business Machines Corporation
- Thomas R. Miller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board with conformally plated circuit traces
- Patent number 6,815,126
- Issue date Nov 9, 2004
- International Business Machines Corporation
- Edmond Otto Fey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and structure for small pitch z-axis electrical interconnect...
- Patent number 6,790,305
- Issue date Sep 14, 2004
- International Business Machines Corporation
- Brian E. Curcio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 6,740,819
- Issue date May 25, 2004
- International Business Machines Corporation
- Anilkumar C. Bhatt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper plated PTH barrels and methods for fabricating
- Patent number 6,630,743
- Issue date Oct 7, 2003
- International Business Machines Corporation
- Roy H. Magnuson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fine pitch circuitization with filled plated through holes
- Patent number 6,618,940
- Issue date Sep 16, 2003
- International Business Machines Corporation
- Kenneth J. Lubert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making a printed wiring board
- Patent number 6,608,757
- Issue date Aug 19, 2003
- International Business Machines Corporation
- Anilkumar C. Bhatt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board structure with z-axis interconnections
- Patent number 6,593,534
- Issue date Jul 15, 2003
- International Business Machines Corporation
- Gerald W. Jones
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fluid treatment device with vibrational energy means for treating s...
- Patent number 6,579,576
- Issue date Jun 17, 2003
- International Business Machines Corporation
- Thomas Lawrence Miller
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Structure for high speed printed wiring boards with multiple differ...
- Patent number 6,570,102
- Issue date May 27, 2003
- International Business Machines Corporation
- Thomas Richard Miller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for removal of undesirable conductive material on a circuit...
- Patent number 6,544,584
- Issue date Apr 8, 2003
- International Business Machines Corporation
- Edward Lee Arrington
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Protection of a plated through hole from chemical attack
- Patent number 6,537,608
- Issue date Mar 25, 2003
- International Business Machines Corporation
- Thomas R. Miller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite laminate circuit structure and methods of interconnecting...
- Patent number 6,479,093
- Issue date Nov 12, 2002
- International Business Machines Corporation
- John M. Lauffer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure for high speed printed wiring boards with multiple differ...
- Patent number 6,469,256
- Issue date Oct 22, 2002
- International Business Machines Corporation
- Thomas R. Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine pitch circuitization with unfilled plated through holes
- Patent number 6,467,160
- Issue date Oct 22, 2002
- International Business Machines Corporation
- Michael J. Cummings
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of uniformly depositing seed and a conductor and the resulta...
- Patent number 6,447,914
- Issue date Sep 10, 2002
- International Business Machines Corporation
- Anastasios P. Angelopoulos
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Manufacturing computer systems with fine line circuitized substrates
- Patent number 6,436,803
- Issue date Aug 20, 2002
- International Business Machines Corporation
- Anilkumar Chinuprasad Bhatt
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Composite laminate circuit structure and methods of interconnecting...
- Patent number 6,388,204
- Issue date May 14, 2002
- International Business Machines Corporation
- John M. Lauffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine pitch circuitization with filled plated through holes
- Patent number 6,291,779
- Issue date Sep 18, 2001
- International Business Machines Corporation
- Kenneth J. Lubert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing computer systems with fine line circuitized substrates
- Patent number 6,268,016
- Issue date Jul 31, 2001
- International Business Machines Corporation
- Anilkumar Chinuprasad Bhatt
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Circuitized semiconductor structure and method for producing such
- Patent number 6,265,075
- Issue date Jul 24, 2001
- International Business Machines Corporation
- David Anton Klueppel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Method of providing a printed circuit board with an edge connection...
- Publication number 20080301933
- Publication date Dec 11, 2008
- Endicott Interconnect Technologies, Inc.
- Thomas R. Miller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of making circuitized substrate with solder paste connections
- Publication number 20080110016
- Publication date May 15, 2008
- Endicott Interconnect Technologies, Inc.
- Norman A. Card
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Structure for an Organic Package with Improved BGA Life
- Publication number 20070099342
- Publication date May 3, 2007
- John U. Knickerbocker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of making a printed wiring board with conformally plated cir...
- Publication number 20050058945
- Publication date Mar 17, 2005
- International Business Machines Corporation
- Edmond Otto Fey
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Colloidal seed formation for printed circuit board metallization
- Publication number 20050042383
- Publication date Feb 24, 2005
- International Business Machines Corporation
- Raymond T. Galasco
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and structure for small pitch z-axis electrical interconnect...
- Publication number 20050008833
- Publication date Jan 13, 2005
- International Business Machines Corporation
- Brian E. Curcio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuitized substrate and method of making same
- Publication number 20040163964
- Publication date Aug 26, 2004
- Endicott Interconnect Technologies, Inc.
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and structure for small pitch z-axis electrical interconnect...
- Publication number 20040067347
- Publication date Apr 8, 2004
- International Business Machines Corporation
- Brian E. Curcio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Joining member for Z-interconnect in electronic devices without con...
- Publication number 20040063040
- Publication date Apr 1, 2004
- International Business Machines Corporation
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Colloidal seed formation for printed circuit board metallization
- Publication number 20040058071
- Publication date Mar 25, 2004
- International Business Machines Corporation
- Raymond T. Galasco
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Copper plated PTH barrels and methods for fabricating
- Publication number 20030209799
- Publication date Nov 13, 2003
- International Business Machines Corporation
- Roy H. Magnuson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board
- Publication number 20030188890
- Publication date Oct 9, 2003
- IBM Corporation
- Anilkumar C. Bhatt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board with conformally plated circuit traces
- Publication number 20030188886
- Publication date Oct 9, 2003
- International Business Machines Corporation
- Edmond Otto Fey
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper plated PTH barrels and methods for fabricating
- Publication number 20020195716
- Publication date Dec 26, 2002
- International Business Machines Corporation
- Roy H. Magnuson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure for high speed printed wiring boards with multiple differ...
- Publication number 20020189094
- Publication date Dec 19, 2002
- International Business Machines Corporation
- Thomas R. Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and structure for an organic package with improved BGA life
- Publication number 20020137256
- Publication date Sep 26, 2002
- International Business Machines Corporation
- John U. Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed wiring board structure with z-axis interconnections
- Publication number 20020131229
- Publication date Sep 19, 2002
- International Business Machines Corporation
- Gerald W. Jones
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Composite laminate circuit structure and methods of interconnecting...
- Publication number 20020098331
- Publication date Jul 25, 2002
- International Business Machines Corporation
- John M. Lauffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure for high speed printed wiring boards with multiple differ...
- Publication number 20020007966
- Publication date Jan 24, 2002
- International Business Machines Corporation
- Thomas Richard Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fine pitch circuitization with filled plated through holes
- Publication number 20010050183
- Publication date Dec 13, 2001
- Kenneth J. Lubert
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Manufacturing computer systems with fine line circuitized substrates
- Publication number 20010033889
- Publication date Oct 25, 2001
- Anilkumar Chinuprasad Bhatt
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Protection of a plated through hole from chemical attack
- Publication number 20010000884
- Publication date May 10, 2001
- Thomas R. Miller
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Thomas E. Miller

Person

Patents Grantslast 30 patents

Method of providing a printed circuit board with an edge connection...

Method of fabricating a BGA package having decreased adhesion

Method of making circuitized substrate with solder paste connections

Method of making a printed wiring board with conformally plated cir...

Method and structure for an organic package with improved BGA life

Joining member for Z-interconnect in electronic devices without con...

Method and structure for small pitch z-axis electrical interconnect...

Circuitized substrate and method of making same

Colloidal seed formulation for printed circuit board metallization

Method for producing an electronic package possessing controlled im...

Printed wiring board with conformally plated circuit traces

Method and structure for small pitch z-axis electrical interconnect...

Printed wiring board

Copper plated PTH barrels and methods for fabricating

Fine pitch circuitization with filled plated through holes

Method for making a printed wiring board

Printed wiring board structure with z-axis interconnections

Fluid treatment device with vibrational energy means for treating s...

Structure for high speed printed wiring boards with multiple differ...

Process for removal of undesirable conductive material on a circuit...

Protection of a plated through hole from chemical attack

Composite laminate circuit structure and methods of interconnecting...

Structure for high speed printed wiring boards with multiple differ...

Fine pitch circuitization with unfilled plated through holes

Method of uniformly depositing seed and a conductor and the resulta...

Manufacturing computer systems with fine line circuitized substrates

Composite laminate circuit structure and methods of interconnecting...

Fine pitch circuitization with filled plated through holes

Manufacturing computer systems with fine line circuitized substrates

Circuitized semiconductor structure and method for producing such

Patents Applicationslast 30 patents

Method of providing a printed circuit board with an edge connection...

Method of making circuitized substrate with solder paste connections

Method and Structure for an Organic Package with Improved BGA Life

Method of making a printed wiring board with conformally plated cir...

Colloidal seed formation for printed circuit board metallization

Method and structure for small pitch z-axis electrical interconnect...

Circuitized substrate and method of making same

Method and structure for small pitch z-axis electrical interconnect...

Joining member for Z-interconnect in electronic devices without con...

Colloidal seed formation for printed circuit board metallization

Copper plated PTH barrels and methods for fabricating

Printed wiring board

Printed wiring board with conformally plated circuit traces

Copper plated PTH barrels and methods for fabricating

Structure for high speed printed wiring boards with multiple differ...

Method and structure for an organic package with improved BGA life

Printed wiring board structure with z-axis interconnections

Composite laminate circuit structure and methods of interconnecting...

Structure for high speed printed wiring boards with multiple differ...

Fine pitch circuitization with filled plated through holes

Manufacturing computer systems with fine line circuitized substrates

Protection of a plated through hole from chemical attack