Claims
- 1. A method for producing an electronic package possessing controlled impedance characteristics, said method comprising the steps of:
providing a first substrate consisting of a dielectric material; applying a first conductive layer on at least one surface of said substrate, said first conductive layer having a first thickness; plating a second conductive layer on said first conductive layer, said second conductive layer having a thickness greater than the thickness of said first conductive layer; and reducing the thickness of said second conductive layer to form a thickness which in combination with the first thickness of said first conductive layer is less than the initial thickness of said second conductive layer.
- 2. A method for processing an electronic package as claimed in claim 1, comprising laminating a second dielectric substrate to said first substrate so as cause said conductive layers to comprise an innerlayer intermediate said laminated substrate.
- 3. A method for producing an electronic package as claimed in claim 2, wherein the external surfaces of said laminated substrates are each provided with conductive layers, and etching said external conductive layers to predetermined thicknesses.
- 4. A method for producing an electronic package as claimed in claim 2 or 3, wherein holes are drilled into said laminate substrate, and conductive material is plated in said holes.
- 5. A method for producing an electronic package as claimed in claim 4, wherein said holes comprise selectively plated through holes, deep blind holes and buried holes forming vias in said laminated substrates.
- 6. A method for producing an electronic package as claimed in claim 5, wherein at least some of said holes are filled with a dielectric material or solder to prevent thinning of the plated conductive material in said holes during external etching and thinning of conductive material on external surfaces of said laminated substrates.
- 7. A method for producing an electronic package as claimed in claim 3, wherein at least one external surface of said conductive layers on said substrate is etched to form a personalized printed wiring pattern.
- 8. A method for producing an electronic package as claimed in claim 3, wherein a plurality of said laminated substrates are combined to form a multilayer electronic package.
- 9. A method for producing an electronic package as claimed in claim 1, wherein said electronic package comprises a printed wiring board.
- 10. An electronic package possessing controlled impedance characteristics, comprising:
a first substrate consisting of a dielectric material; a first conductive layer applied on at least one surface of said substrate, said first conductive layer having a first thickness; a second conductive layer plated on said first conductive layer, said second conductive layer having a thickness greater than the thickness of said first conductive layer; and the thickness of said second conductive layer being reduced to form a thickness which in combination with the first thickness of said first conductive layer is less than the initial thickness of said second conductive layer.
- 11. An electronic package as claimed in claim 10, wherein a second dielectric substrate is laminated to said first substrate so as cause said conductive layers to comprise an innerlayer intermediate said laminated substrate.
- 12. An electronic package as claimed in claim 11, wherein the external surfaces of said laminated substrates are each provided with conductive layers, and said external conductive layers being etched to predetermined thicknesses.
- 13. An electronic package as claimed in claim 11 or 12,
wherein holes are drilled into said laminate substrate, and conductive material is plated in said holes.
- 14. An electronic package as claimed in claim 13, wherein said holes comprise selectively plated through holes, deep blind holes and buried holes forming vias in said laminated substrates.
- 15. An electronic package as claimed in claim 14, wherein at least some of said holes are filled with a dielectric material or solder to prevent thinning of the plated conductive material in said holes during external etching and thinning of conductive material on external surfaces of said laminated substrates.
- 16. An electronic package as claimed in claim 12, wherein at least one external surface of said conductive layers on said substrate is etched to form a personalized printed wiring pattern.
- 17. An electronic package as claimed in claim 12, wherein a plurality of said laminated substrates are combined to form a multilayer electronic package.
- 18. An electronic package as claimed in claim 10, wherein said electronic package comprises a printed wiring board.
CROSS REFERENCE TO RELATED APPLICATION
[0001] The present application is a divisional of U.S. patent application Ser. No. 09/495,628 filed on Feb. 1, 2000.
Divisions (1)
|
Number |
Date |
Country |
Parent |
09495628 |
Feb 2000 |
US |
Child |
10225862 |
Aug 2002 |
US |