Thomas Goebel

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Fishkill, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming support structures for semiconductor devices
- Patent number 7,858,448
- Issue date Dec 28, 2010
- Infineon Technologies AG
- Thomas Goebel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor integrated in a structure surrounding a die
- Patent number 7,795,615
- Issue date Sep 14, 2010
- Infineon Technologies AG
- Thomas Goebel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support structures for semiconductor devices
- Patent number 7,626,268
- Issue date Dec 1, 2009
- Infineon Technologies AG
- Thomas Goebel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration scheme for metal gap fill, with fixed abrasive CMP
- Patent number 6,943,114
- Issue date Sep 13, 2005
- Infineon Technologies AG
- Peter Wrschka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of eliminating back-end rerouting in ball grid array packaging
- Patent number 6,720,212
- Issue date Apr 13, 2004
- Infineon Technologies AG
- Werner Robl
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of Forming Support Structures for Semiconductor Devices
- Publication number 20100022085
- Publication date Jan 28, 2010
- Thomas Goebel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capacitor integrated in a structure surrounding a die
- Publication number 20070102787
- Publication date May 10, 2007
- Thomas Goebel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Support structures for semiconductor devices
- Publication number 20070080464
- Publication date Apr 12, 2007
- Thomas Goebel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integration scheme for metal gap fill, with fixed abrasive CMP
- Publication number 20040248399
- Publication date Dec 9, 2004
- Infineon Technologies North America Corp.
- Peter Wrschka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of eliminating back-end rerouting in ball grid array packaging
- Publication number 20030183913
- Publication date Oct 2, 2003
- Infineon Technologies North America Corp.
- Werner Robl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integration scheme for metal gap fill with HDP and fixed abrasive CMP
- Publication number 20030186551
- Publication date Oct 2, 2003
- Infineon Technologies North America Corp.
- Peter Wrschka
- H01 - BASIC ELECTRIC ELEMENTS