Thomas L. SOUNART

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor smoothing apparatus and method
- Patent number 12,119,435
- Issue date Oct 15, 2024
- Intel Corporation
- Khaled Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
III-N multichip modules and methods of fabrication
- Patent number 11,908,687
- Issue date Feb 20, 2024
- Intel Corporation
- Khaled Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate integrated thin film capacitors using amorphous high-k di...
- Patent number 11,804,455
- Issue date Oct 31, 2023
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In situ package integrated thin film capacitors for power delivery
- Patent number 11,756,948
- Issue date Sep 12, 2023
- Intel Corporation
- Thomas Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate integrated thin film capacitors using amorphous high-k di...
- Patent number 11,495,552
- Issue date Nov 8, 2022
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inorganic piezoelectric materials formed on fibers and applications...
- Patent number 11,421,376
- Issue date Aug 23, 2022
- Intel Corporation
- Shawna M. Liff
- D06 - TREATMENT OF TEXTILES OR THE LIKE LAUNDERING FLEXIBLE MATERIALS NOT OTH...
Information Patent Grant
Microelectronic assemblies having substrate-integrated perovskite l...
- Patent number 11,302,618
- Issue date Apr 12, 2022
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package integrated security features
- Patent number 11,223,524
- Issue date Jan 11, 2022
- Intel Corporation
- Shawna M. Liff
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
III-N multichip modules and methods of fabrication
- Patent number 11,211,245
- Issue date Dec 28, 2021
- Intel Corporation
- Khaled Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adaptable displays using piezoelectric actuators
- Patent number 11,016,288
- Issue date May 25, 2021
- Intel Corporation
- Sasha N. Oster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Piezo actuators for optical beam steering applications
- Patent number 10,969,576
- Issue date Apr 6, 2021
- Intel Corporation
- Aleksandar Aleksov
- G02 - OPTICS
Information Patent Grant
Process for creating piezo-electric mirrors in package
- Patent number 10,969,574
- Issue date Apr 6, 2021
- Intel Corporation
- Sasha N. Oster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices designed with ultra-high-k dielectric capac...
- Patent number 10,937,594
- Issue date Mar 2, 2021
- Intel Corporation
- Thomas L. Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Piezoelectric package-integrated current sensing devices
- Patent number 10,921,349
- Issue date Feb 16, 2021
- Intel Corporation
- Georgios C. Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Piezoelectric package-integrated sensing devices
- Patent number 10,840,430
- Issue date Nov 17, 2020
- Intel Corporation
- Feras Eid
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Piezoelectrically actuated mirrors for optical communications
- Patent number 10,816,733
- Issue date Oct 27, 2020
- Intel Corporation
- Sasha N. Oster
- G02 - OPTICS
Information Patent Grant
Piezoelectric package-integrated acoustic transducer devices
- Patent number 10,721,568
- Issue date Jul 21, 2020
- Intel Corporation
- Georgios C. Dogiamis
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Piezoelectric driven switches integrated in organic, flexible displays
- Patent number 10,658,566
- Issue date May 19, 2020
- Intel Corporation
- Shawna M. Liff
- G02 - OPTICS
Information Patent Grant
Alignment of single and multi-mode optical fibers using piezoelectr...
- Patent number 10,649,158
- Issue date May 12, 2020
- Intel Corporation
- Johanna M. Swan
- G02 - OPTICS
Information Patent Grant
Piezoelectric package-integrated motor
- Patent number 10,644,616
- Issue date May 5, 2020
- Intel Corporation
- Shawna M. Liff
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Piezoelectric package-integrated temperature sensing devices
- Patent number 10,634,566
- Issue date Apr 28, 2020
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Actuatable and adaptable metamaterials integrated in package
- Patent number 10,594,029
- Issue date Mar 17, 2020
- Intel Corporation
- Shawna M. Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated sensor and homologous calibration structure for resonant...
- Patent number 10,386,204
- Issue date Aug 20, 2019
- Intel Corporation
- Sasha Oster
- G01 - MEASURING TESTING
Information Patent Grant
Microelectronic devices designed with ultra-high-k dielectric capac...
- Patent number 10,251,272
- Issue date Apr 2, 2019
- Intel Corporation
- Aleksandar Aleksov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package integrated security features
- Patent number 10,116,504
- Issue date Oct 30, 2018
- Intel Corporation
- Shawna M. Liff
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Piezoelectric package-integrated synthetic jet devices
- Patent number 9,902,152
- Issue date Feb 27, 2018
- Intel Corporation
- Feras Eid
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR LAYER WITH DRY DEPOSITION LAYER
- Publication number 20250006671
- Publication date Jan 2, 2025
- Intel Corporation
- Marcel Arlan Wall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON NANOFIBER CAPACITOR APPARATUS AND RELATED METHODS
- Publication number 20250006781
- Publication date Jan 2, 2025
- Intel Corporation
- Thomas Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE EMBEDDED MULTI-LAYERED IN VIA CAPACITORS
- Publication number 20240222035
- Publication date Jul 4, 2024
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PACKAGE-INTEGRATED OXIDE CAPACITORS AND RELATED METHODS
- Publication number 20240222018
- Publication date Jul 4, 2024
- Intel Corporation
- Thomas Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM CAPACITORS (TFCS) IN ETCHED BACK DEEP VIA
- Publication number 20240213132
- Publication date Jun 27, 2024
- Intel Corporation
- Kristof DARMAWIKARTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM CAPACITOR (TFC) ARCHITECTURES FOR PACKAGE SUBSTRATES
- Publication number 20240213301
- Publication date Jun 27, 2024
- Intel Corporation
- Darko GRUJICIC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE WITH INTEGRATED CAPACITORS IN QUASI-MONOLITHIC...
- Publication number 20240063202
- Publication date Feb 22, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED STRUCTURAL MEMBER AND/OR BOND LAYER FOR MULTICHI...
- Publication number 20240063091
- Publication date Feb 22, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE INTEGRATED THIN FILM CAPACITORS USING AMORPHOUS HIGH-K DI...
- Publication number 20240014149
- Publication date Jan 11, 2024
- Intel Corporation
- Aleksandar ALEKSOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY METAL LAYERS IN ELECTRODE STACKS FOR TRANSITION METAL...
- Publication number 20230402499
- Publication date Dec 14, 2023
- Intel Corporation
- Thomas Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN SITU INDUCTOR STRUCTURE IN BUILDUP POWER PLANES
- Publication number 20230096368
- Publication date Mar 30, 2023
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL POWER DELIVERY STRUCTURES NEAR HIGH-SPEED SIGNAL TRACES
- Publication number 20230094979
- Publication date Mar 30, 2023
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING OF CONFORMAL POWER DELIVERY STRUCTURES
- Publication number 20230098020
- Publication date Mar 30, 2023
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL POWER DELIVERY STRUCTURES INCLUDING EMBEDDED PASSIVE DEVICES
- Publication number 20230095608
- Publication date Mar 30, 2023
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL POWER DELIVERY STRUCTURES
- Publication number 20230095654
- Publication date Mar 30, 2023
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS SUBSTRATES HAVING TRANSVERSE CAPACITORS FOR USE WITH SEMICOND...
- Publication number 20230095846
- Publication date Mar 30, 2023
- Intel Corporation
- Benjamin T. Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITORS IN THROUGH GLASS VIAS
- Publication number 20230091666
- Publication date Mar 23, 2023
- Intel Corporation
- Benjamin DUONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING INTEGRATED THIN FILM CAPACITORS
- Publication number 20220392855
- Publication date Dec 8, 2022
- Intel Corporation
- Kristof Kuwawi Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
III-N MULTICHIP MODULES AND METHODS OF FABRICATION
- Publication number 20220122842
- Publication date Apr 21, 2022
- Intel Corporation
- Khaled Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW LEAKAGE THIN FILM CAPACITORS USING TITANIUM OXIDE DIELECTRIC WI...
- Publication number 20220102483
- Publication date Mar 31, 2022
- Intel Corporation
- Thomas Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE ARCHITECTURES WITH IMPROVED THERMAL MANAGEMENT
- Publication number 20210375719
- Publication date Dec 2, 2021
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
III-N MULTICHIP MODULES AND METHODS OF FABRICATION
- Publication number 20210375620
- Publication date Dec 2, 2021
- Intel Corporation
- Khaled Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SMOOTHING APPARATUS AND METHOD
- Publication number 20210104650
- Publication date Apr 8, 2021
- Intel Corporation
- Khaled Ahmed
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
IN SITU PACKAGE INTEGRATED THIN FILM CAPACITORS FOR POWER DELIVERY
- Publication number 20200350303
- Publication date Nov 5, 2020
- Intel Corporation
- Thomas SOUNART
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-LED DISPLAYS INCLUDING SOLDER STRUCTURES AND METHODS
- Publication number 20200303611
- Publication date Sep 24, 2020
- Intel Corporation
- Thomas L. Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES DESIGNED WITH PACKAGE INTEGRATED VARIABLE C...
- Publication number 20200168402
- Publication date May 28, 2020
- Intel Corporation
- Feras EID
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED-INTEGRATED LITHIUM ION THIN FILM BATTERY AND METHODS FOR F...
- Publication number 20200136099
- Publication date Apr 30, 2020
- Intel Corporation
- Thomas L. SOUNART
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARCHITECTURES AND METHODS OF FABRICATING 3D STACKED PACKAGES
- Publication number 20200126921
- Publication date Apr 23, 2020
- Intel Corporation
- Vijay K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES DESIGNED WITH PACKAGE INTEGRATED TUNABLE FE...
- Publication number 20200075491
- Publication date Mar 5, 2020
- Intel Corporation
- Georgios C. DOGIAMIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIEZOELECTRICALLY ACTUATED MIRRORS FOR OPTICAL COMMUNICATIONS
- Publication number 20200064555
- Publication date Feb 27, 2020
- Intel Corporation
- Sasha N. OSTER
- G02 - OPTICS

Thomas L. SOUNART

Person

Patents Grantslast 30 patents

Semiconductor smoothing apparatus and method

III-N multichip modules and methods of fabrication

Substrate integrated thin film capacitors using amorphous high-k di...

In situ package integrated thin film capacitors for power delivery

Substrate integrated thin film capacitors using amorphous high-k di...

Inorganic piezoelectric materials formed on fibers and applications...

Microelectronic assemblies having substrate-integrated perovskite l...

Package integrated security features

III-N multichip modules and methods of fabrication

Adaptable displays using piezoelectric actuators

Piezo actuators for optical beam steering applications

Process for creating piezo-electric mirrors in package

Microelectronic devices designed with ultra-high-k dielectric capac...

Piezoelectric package-integrated current sensing devices

Piezoelectric package-integrated sensing devices

Piezoelectrically actuated mirrors for optical communications

Piezoelectric package-integrated acoustic transducer devices

Piezoelectric driven switches integrated in organic, flexible displays

Alignment of single and multi-mode optical fibers using piezoelectr...

Piezoelectric package-integrated motor

Piezoelectric package-integrated temperature sensing devices

Actuatable and adaptable metamaterials integrated in package

Integrated sensor and homologous calibration structure for resonant...

Microelectronic devices designed with ultra-high-k dielectric capac...

Package integrated security features

Piezoelectric package-integrated synthetic jet devices

Patents Applicationslast 30 patents

SEMICONDUCTOR LAYER WITH DRY DEPOSITION LAYER

CARBON NANOFIBER CAPACITOR APPARATUS AND RELATED METHODS

PACKAGE SUBSTRATE EMBEDDED MULTI-LAYERED IN VIA CAPACITORS

SUBSTRATE PACKAGE-INTEGRATED OXIDE CAPACITORS AND RELATED METHODS

THIN FILM CAPACITORS (TFCS) IN ETCHED BACK DEEP VIA

THIN FILM CAPACITOR (TFC) ARCHITECTURES FOR PACKAGE SUBSTRATES

PACKAGE ARCHITECTURE WITH INTEGRATED CAPACITORS IN QUASI-MONOLITHIC...

THERMALLY ENHANCED STRUCTURAL MEMBER AND/OR BOND LAYER FOR MULTICHI...

SUBSTRATE INTEGRATED THIN FILM CAPACITORS USING AMORPHOUS HIGH-K DI...

HIGH DENSITY METAL LAYERS IN ELECTRODE STACKS FOR TRANSITION METAL...

IN SITU INDUCTOR STRUCTURE IN BUILDUP POWER PLANES

CONFORMAL POWER DELIVERY STRUCTURES NEAR HIGH-SPEED SIGNAL TRACES

COOLING OF CONFORMAL POWER DELIVERY STRUCTURES

CONFORMAL POWER DELIVERY STRUCTURES INCLUDING EMBEDDED PASSIVE DEVICES

CONFORMAL POWER DELIVERY STRUCTURES

GLASS SUBSTRATES HAVING TRANSVERSE CAPACITORS FOR USE WITH SEMICOND...

CAPACITORS IN THROUGH GLASS VIAS

MICROELECTRONIC ASSEMBLIES HAVING INTEGRATED THIN FILM CAPACITORS

III-N MULTICHIP MODULES AND METHODS OF FABRICATION

LOW LEAKAGE THIN FILM CAPACITORS USING TITANIUM OXIDE DIELECTRIC WI...

STACKED DIE ARCHITECTURES WITH IMPROVED THERMAL MANAGEMENT

III-N MULTICHIP MODULES AND METHODS OF FABRICATION

SEMICONDUCTOR SMOOTHING APPARATUS AND METHOD

IN SITU PACKAGE INTEGRATED THIN FILM CAPACITORS FOR POWER DELIVERY

MICRO-LED DISPLAYS INCLUDING SOLDER STRUCTURES AND METHODS

MICROELECTRONIC DEVICES DESIGNED WITH PACKAGE INTEGRATED VARIABLE C...

PACKAGED-INTEGRATED LITHIUM ION THIN FILM BATTERY AND METHODS FOR F...

ARCHITECTURES AND METHODS OF FABRICATING 3D STACKED PACKAGES

MICROELECTRONIC DEVICES DESIGNED WITH PACKAGE INTEGRATED TUNABLE FE...

PIEZOELECTRICALLY ACTUATED MIRRORS FOR OPTICAL COMMUNICATIONS