Thomas L. SOUNART

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Capacitors in through glass vias
- Patent number 12,349,282
- Issue date Jul 1, 2025
- Intel Corporation
- Benjamin Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low leakage thin film capacitors using titanium oxide dielectric wi...
- Patent number 12,255,225
- Issue date Mar 18, 2025
- Intel Corporation
- Thomas Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor smoothing apparatus and method
- Patent number 12,119,435
- Issue date Oct 15, 2024
- Intel Corporation
- Khaled Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
III-N multichip modules and methods of fabrication
- Patent number 11,908,687
- Issue date Feb 20, 2024
- Intel Corporation
- Khaled Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate integrated thin film capacitors using amorphous high-k di...
- Patent number 11,804,455
- Issue date Oct 31, 2023
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In situ package integrated thin film capacitors for power delivery
- Patent number 11,756,948
- Issue date Sep 12, 2023
- Intel Corporation
- Thomas Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate integrated thin film capacitors using amorphous high-k di...
- Patent number 11,495,552
- Issue date Nov 8, 2022
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inorganic piezoelectric materials formed on fibers and applications...
- Patent number 11,421,376
- Issue date Aug 23, 2022
- Intel Corporation
- Shawna M. Liff
- D06 - TREATMENT OF TEXTILES OR THE LIKE LAUNDERING FLEXIBLE MATERIALS NOT OTH...
Information Patent Grant
Microelectronic assemblies having substrate-integrated perovskite l...
- Patent number 11,302,618
- Issue date Apr 12, 2022
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package integrated security features
- Patent number 11,223,524
- Issue date Jan 11, 2022
- Intel Corporation
- Shawna M. Liff
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
III-N multichip modules and methods of fabrication
- Patent number 11,211,245
- Issue date Dec 28, 2021
- Intel Corporation
- Khaled Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adaptable displays using piezoelectric actuators
- Patent number 11,016,288
- Issue date May 25, 2021
- Intel Corporation
- Sasha N. Oster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Piezo actuators for optical beam steering applications
- Patent number 10,969,576
- Issue date Apr 6, 2021
- Intel Corporation
- Aleksandar Aleksov
- G02 - OPTICS
Information Patent Grant
Process for creating piezo-electric mirrors in package
- Patent number 10,969,574
- Issue date Apr 6, 2021
- Intel Corporation
- Sasha N. Oster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices designed with ultra-high-k dielectric capac...
- Patent number 10,937,594
- Issue date Mar 2, 2021
- Intel Corporation
- Thomas L. Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Piezoelectric package-integrated current sensing devices
- Patent number 10,921,349
- Issue date Feb 16, 2021
- Intel Corporation
- Georgios C. Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Piezoelectric package-integrated sensing devices
- Patent number 10,840,430
- Issue date Nov 17, 2020
- Intel Corporation
- Feras Eid
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Piezoelectrically actuated mirrors for optical communications
- Patent number 10,816,733
- Issue date Oct 27, 2020
- Intel Corporation
- Sasha N. Oster
- G02 - OPTICS
Information Patent Grant
Piezoelectric package-integrated acoustic transducer devices
- Patent number 10,721,568
- Issue date Jul 21, 2020
- Intel Corporation
- Georgios C. Dogiamis
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Piezoelectric driven switches integrated in organic, flexible displays
- Patent number 10,658,566
- Issue date May 19, 2020
- Intel Corporation
- Shawna M. Liff
- G02 - OPTICS
Information Patent Grant
Alignment of single and multi-mode optical fibers using piezoelectr...
- Patent number 10,649,158
- Issue date May 12, 2020
- Intel Corporation
- Johanna M. Swan
- G02 - OPTICS
Information Patent Grant
Piezoelectric package-integrated motor
- Patent number 10,644,616
- Issue date May 5, 2020
- Intel Corporation
- Shawna M. Liff
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Piezoelectric package-integrated temperature sensing devices
- Patent number 10,634,566
- Issue date Apr 28, 2020
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Actuatable and adaptable metamaterials integrated in package
- Patent number 10,594,029
- Issue date Mar 17, 2020
- Intel Corporation
- Shawna M. Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated sensor and homologous calibration structure for resonant...
- Patent number 10,386,204
- Issue date Aug 20, 2019
- Intel Corporation
- Sasha Oster
- G01 - MEASURING TESTING
Information Patent Grant
Microelectronic devices designed with ultra-high-k dielectric capac...
- Patent number 10,251,272
- Issue date Apr 2, 2019
- Intel Corporation
- Aleksandar Aleksov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package integrated security features
- Patent number 10,116,504
- Issue date Oct 30, 2018
- Intel Corporation
- Shawna M. Liff
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Piezoelectric package-integrated synthetic jet devices
- Patent number 9,902,152
- Issue date Feb 27, 2018
- Intel Corporation
- Feras Eid
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Patents Applicationslast 30 patents

Information Patent Application
CONFIGURABLE CARRIER FOR TRANSFER AND SELF-ASSEMBLY OF MULTIPLE INT...
- Publication number 20250218847
- Publication date Jul 3, 2025
- Intel Corporation
- Veronica A. Strong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HANDLING ASSEMBLY, HANDLING SYSTEM AND METHOD
- Publication number 20250210392
- Publication date Jun 26, 2025
- Intel Corporation
- Bhaskar Jyoti KRISHNATREYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ASSEMBLY METHOD AND EQUIPMENT
- Publication number 20250192096
- Publication date Jun 12, 2025
- Intel Corporation
- Yi SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERHYDROPHOBIC SURFACES FOR LIQUID CONTAINMENT IN SELF-ALIGNMENT...
- Publication number 20250112185
- Publication date Apr 3, 2025
- Intel Corporation
- Thomas Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE-GRAIN INTEGRATION OF RADIO FREQUENCY ANTENNAS, INTERCONNECTS,...
- Publication number 20250112188
- Publication date Apr 3, 2025
- Intel Corporation
- Georgios C. Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNMENT ASSISTED ASSEMBLY OF MULTI-LEVEL DIE COMPLEXES
- Publication number 20250112199
- Publication date Apr 3, 2025
- Intel Corporation
- Thomas Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING OF THIN DIE STRUCTURES BY SELF-ALIGNMENT ASSISTED AS...
- Publication number 20250112200
- Publication date Apr 3, 2025
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARCHITECTURES FOR FACILITATING BONDING IN WAFER-LEVEL SELECTIVE TRA...
- Publication number 20250112077
- Publication date Apr 3, 2025
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC ASSEMBLIES WITH METAL PASSIVATION AT BOND INTERFACES
- Publication number 20250112127
- Publication date Apr 3, 2025
- Intel Corporation
- Kimin Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-ASSEMBLY WARPAGE COMPENSATION OF THIN DIE STRUCTURES
- Publication number 20250112173
- Publication date Apr 3, 2025
- Intel Corporation
- Kimin Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVAL OF DEFECTIVE DIES ON DONOR WAFERS FOR SELECTIVE LAYER TRANSFER
- Publication number 20250112067
- Publication date Apr 3, 2025
- Intel Corporation
- Thomas L. Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL COATINGS WITH SPATIALLY DEFINED SURFACE ENERGIES FOR DIE-...
- Publication number 20250112155
- Publication date Apr 3, 2025
- Intel Corporation
- Kimin Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURAL SUPPORT LAYER TO PROTECT SELECTIVE TRANSFER LAYER DURING...
- Publication number 20250112092
- Publication date Apr 3, 2025
- Intel Corportation
- Thomas L. Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC ASSEMBLIES WITH SELF-ALIGNMENT STRUCTURES HAVING ZERO MISALIGNMENT
- Publication number 20250112187
- Publication date Apr 3, 2025
- Intel Corporation
- Kimin Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE-GRAIN INTEGRATION OF GROUP III-V DEVICES
- Publication number 20250112210
- Publication date Apr 3, 2025
- Intel Corporation
- Han Wui Then
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNMENT ASSISTED ASSEMBLY ON A STRUCTURAL WAFER FOR HYBRID B...
- Publication number 20250112177
- Publication date Apr 3, 2025
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE LAYER TRANSFER WITH GLASS PANELS
- Publication number 20250112208
- Publication date Apr 3, 2025
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE DEBONDING STACK FOR SELECTIVE TRANSFER
- Publication number 20250108459
- Publication date Apr 3, 2025
- Intel Corporation
- Andrey Vyatskikh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING STRUCTURES HAVING NON-VERTICAL EDGES FOR SELF-ALIGNMENT ASS...
- Publication number 20250112181
- Publication date Apr 3, 2025
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TILT MITIGATION IN SELF-ALIGNMENT ASSISTED ASSEMBLY OF IC DIE
- Publication number 20250112186
- Publication date Apr 3, 2025
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF THERMAL MANAGEMENT DIES
- Publication number 20250112196
- Publication date Apr 3, 2025
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE LAYER TRANSFER PROCESS IMPROVEMENTS
- Publication number 20250112218
- Publication date Apr 3, 2025
- Intel Corporation
- Brandon M. Rawlings
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF OPTICAL AND OPTO-ELECTRONIC COMPONENTS
- Publication number 20250105053
- Publication date Mar 27, 2025
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITORS FOR USE WITH INTEGRATED CIRCUIT PACKAGES
- Publication number 20250105136
- Publication date Mar 27, 2025
- Intel Corporation
- Kimin Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BLANKET WAFER LASER PRE-EXPOSURE FOR FAST SELECTIVE LAYER TRANSFERS
- Publication number 20250105025
- Publication date Mar 27, 2025
- Intel Corporation
- Thomas L. Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE LAYER TRANSFER
- Publication number 20250105046
- Publication date Mar 27, 2025
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LAYER WITH DRY DEPOSITION LAYER
- Publication number 20250006671
- Publication date Jan 2, 2025
- Intel Corporation
- Marcel Arlan Wall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON NANOFIBER CAPACITOR APPARATUS AND RELATED METHODS
- Publication number 20250006781
- Publication date Jan 2, 2025
- Intel Corporation
- Thomas Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE EMBEDDED MULTI-LAYERED IN VIA CAPACITORS
- Publication number 20240222035
- Publication date Jul 4, 2024
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PACKAGE-INTEGRATED OXIDE CAPACITORS AND RELATED METHODS
- Publication number 20240222018
- Publication date Jul 4, 2024
- Intel Corporation
- Thomas Sounart
- H01 - BASIC ELECTRIC ELEMENTS

Thomas L. SOUNART

Person

Patents Grantslast 30 patents

Capacitors in through glass vias

Low leakage thin film capacitors using titanium oxide dielectric wi...

Semiconductor smoothing apparatus and method

III-N multichip modules and methods of fabrication

Substrate integrated thin film capacitors using amorphous high-k di...

In situ package integrated thin film capacitors for power delivery

Substrate integrated thin film capacitors using amorphous high-k di...

Inorganic piezoelectric materials formed on fibers and applications...

Microelectronic assemblies having substrate-integrated perovskite l...

Package integrated security features

III-N multichip modules and methods of fabrication

Adaptable displays using piezoelectric actuators

Piezo actuators for optical beam steering applications

Process for creating piezo-electric mirrors in package

Microelectronic devices designed with ultra-high-k dielectric capac...

Piezoelectric package-integrated current sensing devices

Piezoelectric package-integrated sensing devices

Piezoelectrically actuated mirrors for optical communications

Piezoelectric package-integrated acoustic transducer devices

Piezoelectric driven switches integrated in organic, flexible displays

Alignment of single and multi-mode optical fibers using piezoelectr...

Piezoelectric package-integrated motor

Piezoelectric package-integrated temperature sensing devices

Actuatable and adaptable metamaterials integrated in package

Integrated sensor and homologous calibration structure for resonant...

Microelectronic devices designed with ultra-high-k dielectric capac...

Package integrated security features

Piezoelectric package-integrated synthetic jet devices

Patents Applicationslast 30 patents

CONFIGURABLE CARRIER FOR TRANSFER AND SELF-ASSEMBLY OF MULTIPLE INT...

HANDLING ASSEMBLY, HANDLING SYSTEM AND METHOD

SELF-ASSEMBLY METHOD AND EQUIPMENT

SUPERHYDROPHOBIC SURFACES FOR LIQUID CONTAINMENT IN SELF-ALIGNMENT...

FINE-GRAIN INTEGRATION OF RADIO FREQUENCY ANTENNAS, INTERCONNECTS,...

SELF-ALIGNMENT ASSISTED ASSEMBLY OF MULTI-LEVEL DIE COMPLEXES

HYBRID BONDING OF THIN DIE STRUCTURES BY SELF-ALIGNMENT ASSISTED AS...

ARCHITECTURES FOR FACILITATING BONDING IN WAFER-LEVEL SELECTIVE TRA...

IC ASSEMBLIES WITH METAL PASSIVATION AT BOND INTERFACES

PRE-ASSEMBLY WARPAGE COMPENSATION OF THIN DIE STRUCTURES

REMOVAL OF DEFECTIVE DIES ON DONOR WAFERS FOR SELECTIVE LAYER TRANSFER

CONFORMAL COATINGS WITH SPATIALLY DEFINED SURFACE ENERGIES FOR DIE-...

STRUCTURAL SUPPORT LAYER TO PROTECT SELECTIVE TRANSFER LAYER DURING...

IC ASSEMBLIES WITH SELF-ALIGNMENT STRUCTURES HAVING ZERO MISALIGNMENT

FINE-GRAIN INTEGRATION OF GROUP III-V DEVICES

SELF-ALIGNMENT ASSISTED ASSEMBLY ON A STRUCTURAL WAFER FOR HYBRID B...

SELECTIVE LAYER TRANSFER WITH GLASS PANELS

PROTECTIVE DEBONDING STACK FOR SELECTIVE TRANSFER

BONDING STRUCTURES HAVING NON-VERTICAL EDGES FOR SELF-ALIGNMENT ASS...

TILT MITIGATION IN SELF-ALIGNMENT ASSISTED ASSEMBLY OF IC DIE

SELECTIVE TRANSFER OF THERMAL MANAGEMENT DIES

SELECTIVE LAYER TRANSFER PROCESS IMPROVEMENTS

SELECTIVE TRANSFER OF OPTICAL AND OPTO-ELECTRONIC COMPONENTS

CAPACITORS FOR USE WITH INTEGRATED CIRCUIT PACKAGES

BLANKET WAFER LASER PRE-EXPOSURE FOR FAST SELECTIVE LAYER TRANSFERS

SELECTIVE LAYER TRANSFER

SEMICONDUCTOR LAYER WITH DRY DEPOSITION LAYER

CARBON NANOFIBER CAPACITOR APPARATUS AND RELATED METHODS

PACKAGE SUBSTRATE EMBEDDED MULTI-LAYERED IN VIA CAPACITORS

SUBSTRATE PACKAGE-INTEGRATED OXIDE CAPACITORS AND RELATED METHODS