Thomas Laursen

Person

New Haven, CT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for controlled slurry distribution
- Patent number 7,887,396
- Issue date Feb 15, 2011
- Novellus Systems, Inc.
- Thomas Laursen
- B24 - GRINDING POLISHING
Information Patent Grant
Methods for chemical mechanical planarization and for detecting end...
- Patent number 7,622,052
- Issue date Nov 24, 2009
- Novellus Systems, Inc.
- Justin Quarantello
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for controlling slurry distribution
- Patent number 7,314,402
- Issue date Jan 1, 2008
- SpeedFam-IPEC Corporation
- Thomas Laursen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for monitoring a chemical mechanical planarization process...
- Patent number 7,264,537
- Issue date Sep 4, 2007
- Novellus Systems, Inc.
- Thomas Laursen
- B24 - GRINDING POLISHING
Information Patent Grant
Methods for controlling the pressures of adjustable pressure zones...
- Patent number 7,115,017
- Issue date Oct 3, 2006
- Novellus Systems, Inc.
- Thomas Laursen
- B24 - GRINDING POLISHING
Information Patent Grant
Multiprobe detection system for chemical-mechanical planarization tool
- Patent number 6,960,115
- Issue date Nov 1, 2005
- SpeedFam-IPEC Corporation
- Matthew Weldon
- B24 - GRINDING POLISHING
Information Patent Grant
Multizone carrier with process monitoring system for chemical-mecha...
- Patent number 6,923,711
- Issue date Aug 2, 2005
- SpeedFam-IPEC Corporation
- Thomas Laursen
- B24 - GRINDING POLISHING
Information Patent Grant
Flexible snapshot in endpoint detection
- Patent number 6,821,794
- Issue date Nov 23, 2004
- Novellus Systems, Inc.
- Thomas Laursen
- B24 - GRINDING POLISHING
Information Patent Grant
Multiprobe detection system for chemical-mechanical planarization tool
- Patent number 6,805,613
- Issue date Oct 19, 2004
- SpeedFam-IPEC Corporation
- Matthew Weldon
- B24 - GRINDING POLISHING
Information Patent Grant
Multizone slurry delivery for chemical mechanical polishing tool
- Patent number 6,572,445
- Issue date Jun 3, 2003
- Speedfam-IPEC
- Thomas Laursen
- B24 - GRINDING POLISHING
Information Patent Grant
Two-step chemical-mechanical planarization for damascene structures...
- Patent number 6,555,466
- Issue date Apr 29, 2003
- Speedfam Corporation
- Thomas Laursen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modification to fill layers for inlaying semiconductor patterns
- Patent number 6,521,537
- Issue date Feb 18, 2003
- SpeedFam-IPEC Corporation
- Thomas Laursen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad conditioning for copper-based semiconductor wafers
- Patent number 6,387,188
- Issue date May 14, 2002
- SpeedFam-IPEC Corporation
- Thomas Laursen
- B24 - GRINDING POLISHING
Information Patent Grant
Sacrificial deposit to improve damascene pattern planarization in s...
- Patent number 6,258,711
- Issue date Jul 10, 2001
- SpeedFam-IPEC Corporation
- Thomas Laursen
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
Method for polishing copper on a workpiece surface
- Publication number 20060255016
- Publication date Nov 16, 2006
- Novellus Systems, Inc.
- Julia Svirchevski
- B24 - GRINDING POLISHING
Information Patent Application
METHOD AND APPARATUS FOR CONTROLLED SLURRY DISTRIBUTION
- Publication number 20060151110
- Publication date Jul 13, 2006
- SpeedFam-IPEC Corporation
- Thomas Laursen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Detection system for chemical-mechanical planarization tool
- Publication number 20050026542
- Publication date Feb 3, 2005
- Tezer Battal
- B24 - GRINDING POLISHING
Information Patent Application
Method for planarizing a work piece
- Publication number 20050016861
- Publication date Jan 27, 2005
- Thomas Laursen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Multiprobe detection system for chemical-mechanical planarization tool
- Publication number 20040038624
- Publication date Feb 26, 2004
- Matthew Weldon
- B24 - GRINDING POLISHING
Information Patent Application
Method for polishing copper on a workpiece surface
- Publication number 20030134576
- Publication date Jul 17, 2003
- Saket Chadda
- B24 - GRINDING POLISHING
Information Patent Application
Method and apparatus for controlling slurry distribution
- Publication number 20030092363
- Publication date May 15, 2003
- Thomas Laursen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Flexible snapshot in endpoint detection
- Publication number 20030087459
- Publication date May 8, 2003
- Thomas Laursen
- B24 - GRINDING POLISHING
Information Patent Application
Multizone slurry delivery for chemical mechanical polishing tool
- Publication number 20020173232
- Publication date Nov 21, 2002
- Thomas Laursen
- B24 - GRINDING POLISHING
Information Patent Application
Multizone carrier with process monitoring system for chemical-mecha...
- Publication number 20020098777
- Publication date Jul 25, 2002
- Thomas Laursen
- B24 - GRINDING POLISHING

Thomas Laursen

Person

Patents Grantslast 30 patents

Method and apparatus for controlled slurry distribution

Methods for chemical mechanical planarization and for detecting end...

Method and apparatus for controlling slurry distribution

Methods for monitoring a chemical mechanical planarization process...

Methods for controlling the pressures of adjustable pressure zones...

Multiprobe detection system for chemical-mechanical planarization tool

Multizone carrier with process monitoring system for chemical-mecha...

Flexible snapshot in endpoint detection

Multiprobe detection system for chemical-mechanical planarization tool

Multizone slurry delivery for chemical mechanical polishing tool

Two-step chemical-mechanical planarization for damascene structures...

Modification to fill layers for inlaying semiconductor patterns

Pad conditioning for copper-based semiconductor wafers

Sacrificial deposit to improve damascene pattern planarization in s...

Patents Applicationslast 30 patents

Method for polishing copper on a workpiece surface

METHOD AND APPARATUS FOR CONTROLLED SLURRY DISTRIBUTION

Detection system for chemical-mechanical planarization tool

Method for planarizing a work piece

Multiprobe detection system for chemical-mechanical planarization tool

Method for polishing copper on a workpiece surface

Method and apparatus for controlling slurry distribution

Flexible snapshot in endpoint detection

Multizone slurry delivery for chemical mechanical polishing tool

Multizone carrier with process monitoring system for chemical-mecha...