Thomas Matthew Gregorich

Person

San Diego, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Flip chip package utilizing trace bump trace interconnection
- Patent number 11,121,108
- Issue date Sep 14, 2021
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package utilizing trace bump trace interconnection
- Patent number 10,707,183
- Issue date Jul 7, 2020
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package utilizing trace bump trace interconnection
- Patent number 10,354,970
- Issue date Jul 16, 2019
- MEDIATEK INC.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 9,659,893
- Issue date May 23, 2017
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with trace covered by solder resist
- Patent number 9,640,505
- Issue date May 2, 2017
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package structure
- Patent number 9,437,512
- Issue date Sep 6, 2016
- Mediatek Inc.
- Thomas Matthew Gregorich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced flip chip structure using copper column interconnect
- Patent number 9,437,534
- Issue date Sep 6, 2016
- Mediatek Inc.
- Thomas Matthew Gregorich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with solder resist capped trace to prevent un...
- Patent number 9,142,526
- Issue date Sep 22, 2015
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced flip chip structure using copper column interconnect
- Patent number 9,064,757
- Issue date Jun 23, 2015
- MediaTek Inc.
- Thomas Matthew Gregorich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded interposer package and method for fabricating the same
- Patent number 9,040,359
- Issue date May 26, 2015
- Mediatek Inc.
- Thomas Matthew Gregorich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded interposer package and method for fabricating the same
- Patent number 8,957,518
- Issue date Feb 17, 2015
- Mediatek Inc.
- Thomas Matthew Gregorich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded interposer package and method for fabricating the same
- Patent number 8,859,340
- Issue date Oct 14, 2014
- Mediatek Inc.
- Thomas Matthew Gregorich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 8,633,588
- Issue date Jan 21, 2014
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate for bump on trace interconnection
- Patent number 8,502,377
- Issue date Aug 6, 2013
- MediaTek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package utilizing trace bump trace interconnection
- Patent number 8,390,119
- Issue date Mar 5, 2013
- MediaTek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for accommodating small minimum die in wire bonded area arra...
- Patent number 6,891,275
- Issue date May 10, 2005
- QUALCOMM Incorporated
- Ryan Lane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Area array package with non-electrically connected solder balls
- Patent number 6,762,495
- Issue date Jul 13, 2004
- QUALCOMM Incorporated
- Edward Reyes
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BALL GRID ARRAY RF PACKAGE CONFIGURATIONS
- Publication number 20240282722
- Publication date Aug 22, 2024
- Infinera Corporation
- John W. Osenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE UTILIZING TRACE BUMP TRACE INTERCONNECTION
- Publication number 20200294948
- Publication date Sep 17, 2020
- MEDIATEK INC.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE UTILIZING TRACE BUMP TRACE INTERCONNECTION
- Publication number 20190295980
- Publication date Sep 26, 2019
- MEDIATEK INC.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20150357291
- Publication date Dec 10, 2015
- MEDIATEK INC.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20150348932
- Publication date Dec 3, 2015
- MEDIATEK INC.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED FLIP CHIP STRUCTURE USING COPPER COLUMN INTERCONNECT
- Publication number 20150249060
- Publication date Sep 3, 2015
- MEDIATEK INC.
- Thomas Matthew Gregorich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED INTERPOSER PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20140377913
- Publication date Dec 25, 2014
- Thomas Matthew GREGORICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED INTERPOSER PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20140127865
- Publication date May 8, 2014
- MEDIATEK INC.
- Thomas Matthew GREGORICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20140091481
- Publication date Apr 3, 2014
- MEDIATEK INC.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED FLIP CHIP STRUCTURE USING COPPER COLUMN INTERCONNECT
- Publication number 20130221536
- Publication date Aug 29, 2013
- Thomas Matthew Gregorich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED INTERPOSER PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20130168857
- Publication date Jul 4, 2013
- Thomas Matthew GREGORICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20130161810
- Publication date Jun 27, 2013
- MEDIATEK INC.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE UTILIZING TRACE BUMP TRACE INTERCONNECTION
- Publication number 20130140694
- Publication date Jun 6, 2013
- MEDIATEK INC.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE STRUCTURE
- Publication number 20130087911
- Publication date Apr 11, 2013
- MEDIATEK INC.
- Thomas Matthew GREGORICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD (PCB) ASSEMBLY WITH ADVANCED QUAD FLAT NO-LEA...
- Publication number 20120140427
- Publication date Jun 7, 2012
- MEDIATEK INC.
- Thomas Matthew GREGORICH
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PACKAGE SUBSTRATE FOR BUMP ON TRACE INTERCONNECTION
- Publication number 20120032343
- Publication date Feb 9, 2012
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE UTILIZING TRACE BUMP TRACE INTERCONNECTION
- Publication number 20120032322
- Publication date Feb 9, 2012
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for accommodating small minimum die in wire bonded area arra...
- Publication number 20040195703
- Publication date Oct 7, 2004
- Ryan Lane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for a accommodating small minimum die in wire bonded area ar...
- Publication number 20040075178
- Publication date Apr 22, 2004
- Ryan Lane
- H01 - BASIC ELECTRIC ELEMENTS

Thomas Matthew Gregorich

Person

Patents Grantslast 30 patents

Flip chip package utilizing trace bump trace interconnection

Flip chip package utilizing trace bump trace interconnection

Flip chip package utilizing trace bump trace interconnection

Semiconductor package

Semiconductor package with trace covered by solder resist

Integrated circuit package structure

Enhanced flip chip structure using copper column interconnect

Semiconductor package with solder resist capped trace to prevent un...

Enhanced flip chip structure using copper column interconnect

Molded interposer package and method for fabricating the same

Molded interposer package and method for fabricating the same

Molded interposer package and method for fabricating the same

Semiconductor package

Package substrate for bump on trace interconnection

Flip chip package utilizing trace bump trace interconnection

Method for accommodating small minimum die in wire bonded area arra...

Area array package with non-electrically connected solder balls

Patents Applicationslast 30 patents

BALL GRID ARRAY RF PACKAGE CONFIGURATIONS

FLIP CHIP PACKAGE UTILIZING TRACE BUMP TRACE INTERCONNECTION

FLIP CHIP PACKAGE UTILIZING TRACE BUMP TRACE INTERCONNECTION

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

ENHANCED FLIP CHIP STRUCTURE USING COPPER COLUMN INTERCONNECT

MOLDED INTERPOSER PACKAGE AND METHOD FOR FABRICATING THE SAME

MOLDED INTERPOSER PACKAGE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

ENHANCED FLIP CHIP STRUCTURE USING COPPER COLUMN INTERCONNECT

MOLDED INTERPOSER PACKAGE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

FLIP CHIP PACKAGE UTILIZING TRACE BUMP TRACE INTERCONNECTION

INTEGRATED CIRCUIT PACKAGE STRUCTURE

PRINTED CIRCUIT BOARD (PCB) ASSEMBLY WITH ADVANCED QUAD FLAT NO-LEA...

PACKAGE SUBSTRATE FOR BUMP ON TRACE INTERCONNECTION

FLIP CHIP PACKAGE UTILIZING TRACE BUMP TRACE INTERCONNECTION

Method for accommodating small minimum die in wire bonded area arra...

Method for a accommodating small minimum die in wire bonded area ar...