Thomas Ort

Person

Regensburg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Package formation methods including coupling a molded routing layer...
- Patent number 12,057,364
- Issue date Aug 6, 2024
- Intel Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan out package with integrated peripheral devices and methods
- Patent number 11,955,395
- Issue date Apr 9, 2024
- Intel Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages, and methods for forming semiconductor packages
- Patent number 11,764,187
- Issue date Sep 19, 2023
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan out package and methods
- Patent number 11,508,637
- Issue date Nov 22, 2022
- Intel Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan out package with integrated peripheral devices and methods
- Patent number 11,404,339
- Issue date Aug 2, 2022
- Intel Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Face-up fan-out electronic package with passive components using a...
- Patent number 11,211,337
- Issue date Dec 28, 2021
- Intel Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component magnetic shielding for microelectronic devices
- Patent number 10,867,934
- Issue date Dec 15, 2020
- Intel IP Corporation
- Saravana Maruthamuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded substrate package in fan-out wafer level package
- Patent number 10,720,393
- Issue date Jul 21, 2020
- Intel IP Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan out package with integrated peripheral devices and methods
- Patent number 10,699,980
- Issue date Jun 30, 2020
- Intel IP Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package including an integrated routing layer and a molded routing...
- Patent number 10,665,522
- Issue date May 26, 2020
- Intel IP Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Face-up fan-out electronic package with passive components using a...
- Patent number 10,546,817
- Issue date Jan 28, 2020
- Intel IP Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded substrate package in fan-out wafer level package
- Patent number 10,403,580
- Issue date Sep 3, 2019
- Intel IP Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for routing electrical connections of semiconduct...
- Patent number 8,598,709
- Issue date Dec 3, 2013
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for routing electrical connections of semiconduct...
- Patent number 8,415,803
- Issue date Apr 9, 2013
- Infineon Technologies AG
- Thorsten Meyer

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE FORMATION METHODS INCLUDING COUPLING A MOLDED ROUTING LAYER...
- Publication number 20240355697
- Publication date Oct 24, 2024
- Intel Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN OUT PACKAGE WITH INTEGRATED PERIPHERAL DEVICES AND METHODS
- Publication number 20240194552
- Publication date Jun 13, 2024
- Intel Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN OUT PACKAGE AND METHODS
- Publication number 20230090265
- Publication date Mar 23, 2023
- Intel Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN OUT PACKAGE WITH INTEGRATED PERIPHERAL DEVICES AND METHODS
- Publication number 20220336306
- Publication date Oct 20, 2022
- Intel Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACE-UP FAN-OUT ELECTRONIC PACKAGE WITH PASSIVE COMPONENTS USING A...
- Publication number 20220051990
- Publication date Feb 17, 2022
- Intel Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN OUT PACKAGE WITH INTEGRATED PERIPHERAL DEVICES AND METHODS
- Publication number 20200303274
- Publication date Sep 24, 2020
- Intel IP Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN OUT PACKAGE AND METHODS
- Publication number 20200251396
- Publication date Aug 6, 2020
- Intel IP Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages, and Methods for Forming Semiconductor Packages
- Publication number 20200227388
- Publication date Jul 16, 2020
- Intel IP Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACE-UP FAN-OUT ELECTRONIC PACKAGE WITH PASSIVE COMPONENTS USING A...
- Publication number 20200105678
- Publication date Apr 2, 2020
- Intell IP Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED SUBSTRATE PACKAGE IN FAN-OUT WAFER LEVEL PACKAGE
- Publication number 20190393154
- Publication date Dec 26, 2019
- Intel IP Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT MAGNETIC SHIELDING FOR MICROELECTRONIC DEVICES
- Publication number 20190304922
- Publication date Oct 3, 2019
- Intel IP Corporation
- Saravana Maruthamuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN OUT PACKAGE WITH INTEGRATED PERIPHERAL DEVICES AND METHODS
- Publication number 20190304863
- Publication date Oct 3, 2019
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL CONDUCTION DEVICES AND METHODS FOR EMBEDDED ELECTRONIC DEVICES
- Publication number 20190214327
- Publication date Jul 11, 2019
- Sonja Koller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACE-UP FAN-OUT ELECTRONIC PACKAGE WITH PASSIVE COMPONENTS USING A...
- Publication number 20190206799
- Publication date Jul 4, 2019
- Intel IP Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED SUBSTRATE PACKAGE IN FAN-OUT WAFER LEVEL PACKAGE
- Publication number 20190206800
- Publication date Jul 4, 2019
- Intel IP Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROTATED SEMICONDUCTOR DEVICE FAN-OUT WAFER LEVEL PACKAGES AND METHO...
- Publication number 20130256883
- Publication date Oct 3, 2013
- Intel Mobile Communications GmbH
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR ROUTING ELECTRICAL CONNECTIONS OF SEMICONDUCT...
- Publication number 20120049375
- Publication date Mar 1, 2012
- Thorsten MEYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component and electronic configuration
- Publication number 20070018308
- Publication date Jan 25, 2007
- Albert Schott
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Package formation methods including coupling a molded routing layer...

Fan out package with integrated peripheral devices and methods

Semiconductor packages, and methods for forming semiconductor packages

Fan out package and methods

Fan out package with integrated peripheral devices and methods

Face-up fan-out electronic package with passive components using a...

Component magnetic shielding for microelectronic devices

Molded substrate package in fan-out wafer level package

Fan out package with integrated peripheral devices and methods

Package including an integrated routing layer and a molded routing...

Face-up fan-out electronic package with passive components using a...

Molded substrate package in fan-out wafer level package

Method and system for routing electrical connections of semiconduct...

Method and system for routing electrical connections of semiconduct...

Patents Applicationslast 30 patents

PACKAGE FORMATION METHODS INCLUDING COUPLING A MOLDED ROUTING LAYER...

FAN OUT PACKAGE WITH INTEGRATED PERIPHERAL DEVICES AND METHODS

FAN OUT PACKAGE AND METHODS

FAN OUT PACKAGE WITH INTEGRATED PERIPHERAL DEVICES AND METHODS

FACE-UP FAN-OUT ELECTRONIC PACKAGE WITH PASSIVE COMPONENTS USING A...

FAN OUT PACKAGE WITH INTEGRATED PERIPHERAL DEVICES AND METHODS

FAN OUT PACKAGE AND METHODS

Semiconductor Packages, and Methods for Forming Semiconductor Packages

FACE-UP FAN-OUT ELECTRONIC PACKAGE WITH PASSIVE COMPONENTS USING A...

MOLDED SUBSTRATE PACKAGE IN FAN-OUT WAFER LEVEL PACKAGE

COMPONENT MAGNETIC SHIELDING FOR MICROELECTRONIC DEVICES

FAN OUT PACKAGE WITH INTEGRATED PERIPHERAL DEVICES AND METHODS

THERMAL CONDUCTION DEVICES AND METHODS FOR EMBEDDED ELECTRONIC DEVICES

FACE-UP FAN-OUT ELECTRONIC PACKAGE WITH PASSIVE COMPONENTS USING A...

MOLDED SUBSTRATE PACKAGE IN FAN-OUT WAFER LEVEL PACKAGE

ROTATED SEMICONDUCTOR DEVICE FAN-OUT WAFER LEVEL PACKAGES AND METHO...

METHOD AND SYSTEM FOR ROUTING ELECTRICAL CONNECTIONS OF SEMICONDUCT...

Electronic component and electronic configuration