Thomas P. Duffy

Person

Endicott, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Chip carrier having a chip mounted on an organic dielectric substra...
- Patent number 6,038,137
- Issue date Mar 14, 2000
- International Business Machines Corporation
- Ashwinkumar Chinuprasad Bhatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular circuit package having vertically aligned power and signal...
- Patent number 5,876,842
- Issue date Mar 2, 1999
- International Business Machines Corporation
- Thomas Patrick Duffy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuitized substrate with same surface conductors of different res...
- Patent number 5,817,405
- Issue date Oct 6, 1998
- International Business Machines Corporation
- Anikumar Chinuprasad Bhatt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Single-tiered organic chip carriers for wire bond-type chips
- Patent number 5,798,909
- Issue date Aug 25, 1998
- International Business Machines Corporation
- Ashwinkumar Chinuprasad Bhatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density template: materials and processes for the application...
- Patent number 5,789,121
- Issue date Aug 4, 1998
- International Business Machines Corporation
- Douglas Adam Cywar
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Chip carrier having an organic photopatternable material and a meta...
- Patent number 5,724,232
- Issue date Mar 3, 1998
- International Business Machines Corporation
- Ashwinkumar Chinuprasad Bhatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a circuitized substrate using two different metall...
- Patent number 5,707,893
- Issue date Jan 13, 1998
- International Business Machines Corporation
- Anilkumar Chinuprasad Bhatt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a flex laminate package
- Patent number 5,620,782
- Issue date Apr 15, 1997
- International Business Machines Corporation
- Charles R. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making circuitized substrate
- Patent number 5,599,747
- Issue date Feb 4, 1997
- International Business Machines Corporation
- Ashwinkumar C. Bhatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for laminating and circuitizing substrates having opening...
- Patent number 5,578,796
- Issue date Nov 26, 1996
- International Business Machines Corporation
- Ashwinkumar C. Bhatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of construction for multi-tiered cavities used in laminate c...
- Patent number 5,566,448
- Issue date Oct 22, 1996
- International Business Machines Corporation
- Ashwinkumar C. Bhatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of laminating and circuitizing substrates having openings th...
- Patent number 5,542,175
- Issue date Aug 6, 1996
- International Business Machines Corporation
- Ashwinkumar C. Bhatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a flex laminate package
- Patent number 5,509,196
- Issue date Apr 23, 1996
- International Business Machines Corporation
- Charles R. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density pattern template: materials and processes for the appl...
- Patent number 5,460,921
- Issue date Oct 24, 1995
- International Business Machines Corporation
- Douglas A. Cywar
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Vacuum loading chuck and fixture for flexible printed circuit panels
- Patent number 5,395,198
- Issue date Mar 7, 1995
- International Business Machines Corporation
- Thomas P. Duffy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flex laminate package for a parallel processor
- Patent number 5,384,690
- Issue date Jan 24, 1995
- International Business Machines Corporation
- Charles R. Davis
- H01 - BASIC ELECTRIC ELEMENTS

Thomas P. Duffy

Person

Patents Grantslast 30 patents

Chip carrier having a chip mounted on an organic dielectric substra...

Modular circuit package having vertically aligned power and signal...

Circuitized substrate with same surface conductors of different res...

Single-tiered organic chip carriers for wire bond-type chips

High density template: materials and processes for the application...

Chip carrier having an organic photopatternable material and a meta...

Method of making a circuitized substrate using two different metall...

Method of fabricating a flex laminate package

Method of making circuitized substrate

Apparatus for laminating and circuitizing substrates having opening...

Method of construction for multi-tiered cavities used in laminate c...

Method of laminating and circuitizing substrates having openings th...

Method of fabricating a flex laminate package

High density pattern template: materials and processes for the appl...

Vacuum loading chuck and fixture for flexible printed circuit panels

Flex laminate package for a parallel processor