Claims
- 1. A laminated structure comprising first, second and third substrates formed of an organic material,
- said substrates having respectively first, second and third through openings therein in an aligned configuration,
- said first opening being smaller than said second opening to thereby form a first step on said first substrate about the perimeter of said first opening,
- said second opening being smaller than said third opening to thereby form a second step on said second substrate about the perimeter of said second opening,
- a metallic ground plane laminated to and substantially covering said first substrate,
- an integrated circuit chip supported by said ground plane and defined in said first opening, and
- bonding pads located on said first step and connected by circuitry located on said first substrate to said integrated circuit chip.
- 2. The device of claim 1 wherein said substrates are formed of epoxy impregnated fiberglass.
- 3. The device of claim 2 wherein said substrates are bonded together by sheets of epoxy impregnated fiberglass.
- 4. The device of claim 1 further characterized by wire bonds connecting said integrated circuit chip with said bonding pads.
- 5. The device of claim 1 further characterized by said second step being free of circuitry.
- 6. A laminated structure comprising first, second and third substrates formed of an organic material,
- said substrates having respectively first, second and third through openings therein in an aligned configuration,
- said first opening being smaller than said second opening to thereby form a first step on said first substrate about the perimeter of said first opening,
- said second opening being smaller than said third opening to thereby form a second step on said second substrate about the perimeter of said second opening,
- a film of material located on the surface of said third substrate overlying said third opening,
- bonding pads located on said first step and being connected to circuitry located on said first substrate,
- said second step arranged to support a removable plug,
- said removable plug comprising a head portion and a stem portion,
- said removable plug disposed within said third opening and at least partially supported by said second step, and
- said head portion of said removable plug having a support surface in coplanar contact with said film of material.
- 7. The device of claim 6 wherein said substrates are formed of epoxy impregnated fiberglass.
- 8. The device of claim 7 wherein said substrates are bonded together by sheets of epoxy impregnated fiberglass.
- 9. The device of claim 6 further characterized by said second step being free of circuitry.
- 10. The device of claim 6 further characterized by said film of material being dry photoresist.
Parent Case Info
This is a divisional of application Ser. No. 08/359,491, filed on Dec. 20, 1994, now U.S. Pat. No. 5,542,175.
US Referenced Citations (12)
Foreign Referenced Citations (2)
Number |
Date |
Country |
2-237142 |
Sep 1990 |
JPX |
5-211256 |
Aug 1993 |
JPX |
Non-Patent Literature Citations (1)
Entry |
"IBM Technical Disclosure Bulletin," vol. 27, No. 2; Jul., 1984; p. 1139. |
Divisions (1)
|
Number |
Date |
Country |
Parent |
359491 |
Dec 1994 |
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