Thomas Weller Mountsier

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
High aspect ratio etch of oxide metal oxide metal stack
- Patent number 10,242,883
- Issue date Mar 26, 2019
- Lam Research Corporation
- Joydeep Guha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High aspect ratio etch with combination mask
- Patent number 9,659,783
- Issue date May 23, 2017
- Lam Research Corporation
- Joydeep Guha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PECVD films for EUV lithography
- Patent number 9,618,846
- Issue date Apr 11, 2017
- Lam Research Corporation
- Nader Shamma
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Selective formation of dielectric barriers for metal interconnects...
- Patent number 9,418,889
- Issue date Aug 16, 2016
- Lam Research Corporation
- Thomas Weller Mountsier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sacrificial pre-metal dielectric for self-aligned contact scheme
- Patent number 9,379,210
- Issue date Jun 28, 2016
- Lam Research Corporation
- Thomas Weller Mountsier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PECVD films for EUV lithography
- Patent number 9,304,396
- Issue date Apr 5, 2016
- Lam Research Corporation
- Nader Shamma
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Plasma activated conformal film deposition
- Patent number 9,230,800
- Issue date Jan 5, 2016
- Novellus Systems, Inc.
- Adrien LaVoie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sacrificial pre-metal dielectric for self-aligned contact scheme
- Patent number 9,190,489
- Issue date Nov 17, 2015
- Lam Research Corporation
- Thomas Weller Mountsier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High aspect ratio etch with combination mask
- Patent number 9,018,103
- Issue date Apr 28, 2015
- Lam Research Corporation
- Joydeep Guha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma activated conformal film deposition
- Patent number 8,728,956
- Issue date May 20, 2014
- Novellus Systems, Inc.
- Adrien LaVoie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tungsten barrier and seed for copper filled TSV
- Patent number 8,709,948
- Issue date Apr 29, 2014
- Novellus Systems, Inc.
- Michal Danek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multistep method of depositing metal seed layers
- Patent number 8,298,936
- Issue date Oct 30, 2012
- Novellus Systems, Inc.
- Robert Rozbicki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for reducing UV and dielectric diffusion barrier interaction
- Patent number 8,173,537
- Issue date May 8, 2012
- Novellus Systems, Inc.
- Kaushik Chattopadhyay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing UV and dielectric diffusion barrier interaction through th...
- Patent number 8,124,522
- Issue date Feb 28, 2012
- Novellus Systems, Inc.
- Hui-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion barrier layers
- Patent number 8,053,861
- Issue date Nov 8, 2011
- Novellus Systems, Inc.
- Thomas W. Mountsier
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Protection of Cu damascene interconnects by formation of a self-ali...
- Patent number 8,030,777
- Issue date Oct 4, 2011
- Novellus Systems, Inc.
- Bart van Schravendijk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming moisture barrier for low K film integration with...
- Patent number 8,003,549
- Issue date Aug 23, 2011
- Novellus Systems, Inc.
- Ming Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low-k b-doped SiC copper diffusion barrier films
- Patent number 7,842,604
- Issue date Nov 30, 2010
- Novellus Systems, Inc.
- Yongsik Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multistep method of depositing metal seed layers
- Patent number 7,682,966
- Issue date Mar 23, 2010
- Novellus Systems, Inc.
- Robert Rozbicki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of forming moisture barrier for low k film integration with...
- Patent number 7,642,202
- Issue date Jan 5, 2010
- Novellus Systems, Inc.
- Ming Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Fabrication of semiconductor interconnect structure
- Patent number 7,531,463
- Issue date May 12, 2009
- Novellus Systems, Inc.
- Daniel A. Koos
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Boron-doped SIC copper diffusion barrier films
- Patent number 7,420,275
- Issue date Sep 2, 2008
- Novellus Systems, Inc.
- Yongsik Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Protection of Cu damascene interconnects by formation of a self-ali...
- Patent number 7,396,759
- Issue date Jul 8, 2008
- Novellus Systems, Inc.
- Bart van Schravendijk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabrication of semiconductor interconnect structure with...
- Patent number 7,338,908
- Issue date Mar 4, 2008
- Novellus Systems, Inc.
- Daniel A. Koos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-k B-doped SiC copper diffusion barrier films
- Patent number 7,239,017
- Issue date Jul 3, 2007
- Novellus Systems, Inc.
- Yongsik Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Applications and methods of making nitrogen-free anti-reflective la...
- Patent number 7,052,988
- Issue date May 30, 2006
- Novellus Systems, Inc.
- Bart van Schravendijk
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for patterning multilevel interconnects
- Patent number 6,875,699
- Issue date Apr 5, 2005
- Lam Research Corporation
- Stephan Lassig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Applications and methods of making nitrogen-free anti-reflective la...
- Patent number 6,720,251
- Issue date Apr 13, 2004
- Novellus Systems, Inc.
- Bart van Schravendijk
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus and method for physical vapor deposition using an open to...
- Patent number 6,613,199
- Issue date Sep 2, 2003
- Novellus Systems, Inc.
- Jeffrey A. Tobin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of minimizing reactive ion etch damage of organic insulating...
- Patent number 6,265,320
- Issue date Jul 24, 2001
- Novellus Systems, Inc.
- Jianou Shi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH ASPECT RATIO ETCH OF OXIDE METAL OXIDE METAL STACK
- Publication number 20180374712
- Publication date Dec 27, 2018
- LAM RESEARCH CORPORATION
- Joydeep GUHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PECVD FILMS FOR EUV LITHOGRAPHY
- Publication number 20160179005
- Publication date Jun 23, 2016
- LAM RESEARCH CORPORATION
- Nader Shamma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SACRIFICIAL PRE-METAL DIELECTRIC FOR SELF-ALIGNED CONTACT SCHEME
- Publication number 20160071953
- Publication date Mar 10, 2016
- LAM RESEARCH CORPORATION
- Thomas Weller Mountsier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE FORMATION OF DIELECTRIC BARRIERS FOR METAL INTERCONNECTS...
- Publication number 20150380302
- Publication date Dec 31, 2015
- LAM RESEARCH CORPORATION
- Thomas Weller Mountsier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ASPECT RATIO ETCH WITH COMBINATION MASK
- Publication number 20150200106
- Publication date Jul 16, 2015
- LAM RESEARCH CORPORATION
- Joydeep GUHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ASPECT RATIO ETCH WITH COMBINATION MASK
- Publication number 20150087154
- Publication date Mar 26, 2015
- LAM RESEARCH CORPORATION
- Joydeep GUHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PECVD FILMS FOR EUV LITHOGRAPHY
- Publication number 20140239462
- Publication date Aug 28, 2014
- Nader Shamma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA ACTIVATED CONFORMAL FILM DEPOSITION
- Publication number 20140209562
- Publication date Jul 31, 2014
- Novellus Systems, Inc.
- Adrien LaVoie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA ACTIVATED CONFORMAL FILM DEPOSITION
- Publication number 20110256726
- Publication date Oct 20, 2011
- Adrien LaVoie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TUNGSTEN BARRIER AND SEED FOR COPPER FILLED TSV
- Publication number 20110221044
- Publication date Sep 15, 2011
- Michal Danek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION BARRIER LAYERS
- Publication number 20100187693
- Publication date Jul 29, 2010
- Novellus Systems, Inc.
- Thomas W. Mountsier
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Fabrication of semiconductor interconnect structure
- Publication number 20070105377
- Publication date May 10, 2007
- Novellus Systems, Inc.
- Daniel A. Koos
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Thomas Weller Mountsier

Person

Patents Grantslast 30 patents

High aspect ratio etch of oxide metal oxide metal stack

High aspect ratio etch with combination mask

PECVD films for EUV lithography

Selective formation of dielectric barriers for metal interconnects...

Sacrificial pre-metal dielectric for self-aligned contact scheme

PECVD films for EUV lithography

Plasma activated conformal film deposition

Sacrificial pre-metal dielectric for self-aligned contact scheme

High aspect ratio etch with combination mask

Plasma activated conformal film deposition

Tungsten barrier and seed for copper filled TSV

Multistep method of depositing metal seed layers

Methods for reducing UV and dielectric diffusion barrier interaction

Reducing UV and dielectric diffusion barrier interaction through th...

Diffusion barrier layers

Protection of Cu damascene interconnects by formation of a self-ali...

Methods of forming moisture barrier for low K film integration with...

Low-k b-doped SiC copper diffusion barrier films

Multistep method of depositing metal seed layers

Methods of forming moisture barrier for low k film integration with...

Fabrication of semiconductor interconnect structure

Boron-doped SIC copper diffusion barrier films

Protection of Cu damascene interconnects by formation of a self-ali...

Method for fabrication of semiconductor interconnect structure with...

Low-k B-doped SiC copper diffusion barrier films

Applications and methods of making nitrogen-free anti-reflective la...

Method for patterning multilevel interconnects

Applications and methods of making nitrogen-free anti-reflective la...

Apparatus and method for physical vapor deposition using an open to...

Method of minimizing reactive ion etch damage of organic insulating...

Patents Applicationslast 30 patents

HIGH ASPECT RATIO ETCH OF OXIDE METAL OXIDE METAL STACK

PECVD FILMS FOR EUV LITHOGRAPHY

SACRIFICIAL PRE-METAL DIELECTRIC FOR SELF-ALIGNED CONTACT SCHEME

SELECTIVE FORMATION OF DIELECTRIC BARRIERS FOR METAL INTERCONNECTS...

HIGH ASPECT RATIO ETCH WITH COMBINATION MASK

HIGH ASPECT RATIO ETCH WITH COMBINATION MASK

PECVD FILMS FOR EUV LITHOGRAPHY

PLASMA ACTIVATED CONFORMAL FILM DEPOSITION

PLASMA ACTIVATED CONFORMAL FILM DEPOSITION

TUNGSTEN BARRIER AND SEED FOR COPPER FILLED TSV

DIFFUSION BARRIER LAYERS

Fabrication of semiconductor interconnect structure