TREA

Tian Siang Yip

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  • Singapore, SG
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Patents Grantslast 30 patents

  • Information Patent Grant

    Lead frame
    • Patent number RE41510
    • Issue date Aug 17, 2010
    • Infineon Technologies AG
    • Heng Wan Hong
    • 257 - Active solid-state devices
  • Information Patent Grant

    Non-leaded semiconductor package and a method to assemble the same
    • Patent number 7,732,259
    • Issue date Jun 8, 2010
    • Infineon Technologies AG
    • Min Wee Low
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Packaging of integrated circuits to lead frames
    • Patent number 7,645,639
    • Issue date Jan 12, 2010
    • Infineon Technologies AG
    • Tian Siang Yip
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Lead frame
    • Patent number 7,193,298
    • Issue date Mar 20, 2007
    • Infineon Technologies AG
    • Heng Wan Hong
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents