Tianzhu Fan

Person

Ann Arbor, MI, US

People

Patents Grantslast 30 patents

Information Patent Grant
Power electronics assemblies having embedded power electronics devices
- Patent number 12,144,158
- Issue date Nov 12, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics device assemblies including dual graphite layers...
- Patent number 12,096,596
- Issue date Sep 17, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Tianzhu Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for providing heating and cooling to a vehicle...
- Patent number 11,247,529
- Issue date Feb 15, 2022
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for providing heating and cooling to a vehicle...
- Patent number 10,556,481
- Issue date Feb 11, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- B60 - VEHICLES IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
HIGHLY INTEGRATED POWER ELECTRONICS AND METHODS OF MANUFACTURING TH...
- Publication number 20240341043
- Publication date Oct 10, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
HIGHLY INTEGRATED POWER ELECTRONICS AND METHODS OF MANUFACTURING TH...
- Publication number 20240341027
- Publication date Oct 10, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
HIGHLY INTEGRATED POWER ELECTRONICS AND METHODS OF MANUFACTURING TH...
- Publication number 20240332204
- Publication date Oct 3, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-CHIP POWER CARD HAVING IMMERSION COOLING
- Publication number 20240321698
- Publication date Sep 26, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGHLY INTEGRATED POWER ELECTRONICS AND METHODS OF MANUFACTURING TH...
- Publication number 20240290632
- Publication date Aug 29, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DEVICE EMBEDDED PRINTED CIRCUIT BOARD - COLD PLATE ASSEMBLIES...
- Publication number 20240292564
- Publication date Aug 29, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER DEVICE EMBEDDED PRINTED CIRCUIT BOARD ASSEMBLIES WITH THIN FI...
- Publication number 20240290687
- Publication date Aug 29, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-CHIP POWER CARD HAVING EMBEDDED THERMAL CONDUCTOR
- Publication number 20240266262
- Publication date Aug 8, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UV CURABLE DIELECTRIC MATERIALS FOR 3D PRINTING AND 3D PRINTING SYS...
- Publication number 20240260201
- Publication date Aug 1, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Tianzhu Fan
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
POWER ELECTRONIC DEVICE ASSEMBLIES HAVING AN ELECTRICALLY INSULATIN...
- Publication number 20240258191
- Publication date Aug 1, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONIC DEVICE ASSEMBLIES HAVING HEAT SPREADERS AND ELECTR...
- Publication number 20240244805
- Publication date Jul 18, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER ELECTRONICS ASSEMBLIES HAVING EMBEDDED POWER ELECTRONICS DEVICES
- Publication number 20240130093
- Publication date Apr 18, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONICS DEVICE ASSEMBLIES INCLUDING DUAL GRAPHITE LAYERS...
- Publication number 20240130076
- Publication date Apr 18, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Tianzhu Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR PROVIDING HEATING AND COOLING TO A VEHICLE...
- Publication number 20200148029
- Publication date May 14, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- B60 - VEHICLES IN GENERAL
Information Patent Application
SYSTEMS AND METHODS FOR PROVIDING HEATING AND COOLING TO A VEHICLE...
- Publication number 20180370324
- Publication date Dec 27, 2018
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- B60 - VEHICLES IN GENERAL

Tianzhu Fan

Person

Patents Grantslast 30 patents

Power electronics assemblies having embedded power electronics devices

Power electronics device assemblies including dual graphite layers...

Systems and methods for providing heating and cooling to a vehicle...

Systems and methods for providing heating and cooling to a vehicle...

Patents Applicationslast 30 patents

HIGHLY INTEGRATED POWER ELECTRONICS AND METHODS OF MANUFACTURING TH...

HIGHLY INTEGRATED POWER ELECTRONICS AND METHODS OF MANUFACTURING TH...

HIGHLY INTEGRATED POWER ELECTRONICS AND METHODS OF MANUFACTURING TH...

CHIP-ON-CHIP POWER CARD HAVING IMMERSION COOLING

HIGHLY INTEGRATED POWER ELECTRONICS AND METHODS OF MANUFACTURING TH...

POWER DEVICE EMBEDDED PRINTED CIRCUIT BOARD - COLD PLATE ASSEMBLIES...

POWER DEVICE EMBEDDED PRINTED CIRCUIT BOARD ASSEMBLIES WITH THIN FI...

CHIP-ON-CHIP POWER CARD HAVING EMBEDDED THERMAL CONDUCTOR

UV CURABLE DIELECTRIC MATERIALS FOR 3D PRINTING AND 3D PRINTING SYS...

POWER ELECTRONIC DEVICE ASSEMBLIES HAVING AN ELECTRICALLY INSULATIN...

POWER ELECTRONIC DEVICE ASSEMBLIES HAVING HEAT SPREADERS AND ELECTR...

POWER ELECTRONICS ASSEMBLIES HAVING EMBEDDED POWER ELECTRONICS DEVICES

POWER ELECTRONICS DEVICE ASSEMBLIES INCLUDING DUAL GRAPHITE LAYERS...

SYSTEMS AND METHODS FOR PROVIDING HEATING AND COOLING TO A VEHICLE...

SYSTEMS AND METHODS FOR PROVIDING HEATING AND COOLING TO A VEHICLE...