Tiao Zhou

Person

Carrollton, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Exposed die sensor package
- Patent number 10,608,125
- Issue date Mar 31, 2020
- Maxim Integrated Products, Inc.
- Tiao Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad defined contact for wafer level package
- Patent number 10,204,876
- Issue date Feb 12, 2019
- Maxim Integrated Products, Inc.
- Tiao Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder fatigue arrest for wafer level package
- Patent number 9,583,425
- Issue date Feb 28, 2017
- Maxim Integrated Products, Inc.
- Yong Li Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-cost low-profile solder bump process for enabling ultra-thin wa...
- Patent number 9,425,064
- Issue date Aug 23, 2016
- Karthik Thambidurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass based multichip package
- Patent number 9,371,982
- Issue date Jun 21, 2016
- Maxim Integrated Products, Inc.
- Tiao Zhou
- F21 - LIGHTING
Information Patent Grant
Highly integrated flex sensor package
- Patent number 9,356,003
- Issue date May 31, 2016
- Maxim Integrated Products, Inc.
- Tiao Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for wafer-level processing of QFN packages
- Patent number 9,040,408
- Issue date May 26, 2015
- Maxim Integrated Products, Inc.
- Tiao Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package (WLP) device having bump assemblies including a...
- Patent number 8,259,464
- Issue date Sep 4, 2012
- Maxim Integrated Products, Inc.
- Tiao Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer enhancement to improve reliability of wafer le...
- Patent number 8,084,871
- Issue date Dec 27, 2011
- Maxim Integrated Products, Inc.
- S. Kaysar Rahim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer enhancement to improve reliability of wafer le...
- Patent number 7,989,961
- Issue date Aug 2, 2011
- Maxim Integrated Products, Inc.
- S. Kaysar Rahim

Patents Applicationslast 30 patents

Information Patent Application
GLASS BASED MULTICHIP PACKAGE
- Publication number 20150049498
- Publication date Feb 19, 2015
- Maxim Integrated Products, Inc.
- Tiao Zhou
- F21 - LIGHTING
Information Patent Application
WAFER-LEVEL PACKAGE MITIGATED UNDERCUT
- Publication number 20140252571
- Publication date Sep 11, 2014
- Maxim Integrated Products, Inc.
- Viren Khandekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAD DEFINED CONTACT FOR WAFER LEVEL PACKAGE
- Publication number 20140252592
- Publication date Sep 11, 2014
- Maxim Integrated Products, Inc.
- Tiao Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-COST LOW-PROFILE SOLDER BUMP PROCESS FOR ENABLING ULTRA-THIN WA...
- Publication number 20140167252
- Publication date Jun 19, 2014
- Maxim Integrated Products, Inc.
- Karthik Thambidurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER FATIGUE ARREST FOR WAFER LEVEL PACKAGE
- Publication number 20140131859
- Publication date May 15, 2014
- Yong Li Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE (WLP) DEVICE HAVING BUMP ASSEMBLIES INCLUDING A...
- Publication number 20110317385
- Publication date Dec 29, 2011
- MAXIM INTEGRATED PRODUCTS, INC.
- Tiao Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYER ENHANCEMENT TO IMPROVE RELIABILITY OF WAFER LE...
- Publication number 20110108981
- Publication date May 12, 2011
- MAXIM INTEGRATED PRODUCTS, INC.
- KAYSAR RAHIM
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Exposed die sensor package

Pad defined contact for wafer level package

Solder fatigue arrest for wafer level package

Low-cost low-profile solder bump process for enabling ultra-thin wa...

Glass based multichip package

Highly integrated flex sensor package

Techniques for wafer-level processing of QFN packages

Wafer level package (WLP) device having bump assemblies including a...

Redistribution layer enhancement to improve reliability of wafer le...

Redistribution layer enhancement to improve reliability of wafer le...

Patents Applicationslast 30 patents

GLASS BASED MULTICHIP PACKAGE

WAFER-LEVEL PACKAGE MITIGATED UNDERCUT

PAD DEFINED CONTACT FOR WAFER LEVEL PACKAGE

LOW-COST LOW-PROFILE SOLDER BUMP PROCESS FOR ENABLING ULTRA-THIN WA...

SOLDER FATIGUE ARREST FOR WAFER LEVEL PACKAGE

WAFER LEVEL PACKAGE (WLP) DEVICE HAVING BUMP ASSEMBLIES INCLUDING A...

REDISTRIBUTION LAYER ENHANCEMENT TO IMPROVE RELIABILITY OF WAFER LE...