TREA

Tien-Chih CHENG

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  • Hsinchu City, TW
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Patents Grantslast 30 patents

  • Information Patent Grant

    Semiconductor package
    • Patent number 12,002,735
    • Issue date Jun 4, 2024
    • Tien-Chien Cheng
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Vertical probe card
    • Patent number 11,243,231
    • Issue date Feb 8, 2022
    • Tien-Chien Cheng
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Methods for particle reduction in semiconductor processing
    • Patent number 9,721,783
    • Issue date Aug 1, 2017
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Tien-Chih Cheng
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wafer support device
    • Patent number 9,472,444
    • Issue date Oct 18, 2016
    • Taiwan Semiconductor Manufacturing Co., Ltd
    • Tien-Chih Cheng
    • Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Information Patent Grant

    Wafer support device
    • Patent number 9,355,885
    • Issue date May 31, 2016
    • Taiwan Semiconductor Manufacturing Co., Ltd
    • Tien-Chih Cheng
    • Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Information Patent Grant

    Wafer transfer pod for reducing wafer particulate contamination
    • Patent number 8,544,651
    • Issue date Oct 1, 2013
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Ying Zhang
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents