TIEN-CHUNG YANG

Person

HSINCHU CITY, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with electromagnetic interference film and met...
- Patent number 12,243,833
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Hsi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for identifying size of object, optical sensing apparatus an...
- Patent number 12,019,809
- Issue date Jun 25, 2024
- PixArt Imaging Inc.
- Tien-Chung Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor structure
- Patent number 11,842,983
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for identifying object, optical sensing apparatus and system
- Patent number 11,662,828
- Issue date May 30, 2023
- PixArt Imaging Inc.
- Tien-Chung Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dynamic reference current memory array and method
- Patent number 11,657,881
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tien-Chun Yang
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor structure
- Patent number 11,177,238
- Issue date Nov 16, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,145,633
- Issue date Oct 12, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming
- Patent number 11,133,197
- Issue date Sep 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with electromagnetic interference protection a...
- Patent number 10,825,780
- Issue date Nov 3, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Hsi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,510,715
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming
- Patent number 10,340,155
- Issue date Jul 2, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 10,276,542
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,217,687
- Issue date Feb 26, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tien-Chung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-stack package-on-package structures
- Patent number 10,163,701
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Jung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 10,090,284
- Issue date Oct 2, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures, pop devices and methods of forming the same
- Patent number 9,941,248
- Issue date Apr 10, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tien-Chung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,929,069
- Issue date Mar 27, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tien-Chung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level shielding in multi-stacked fan out packages and methods...
- Patent number 9,922,939
- Issue date Mar 20, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 9,859,258
- Issue date Jan 2, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-stack package-on-package structures
- Patent number 9,806,059
- Issue date Oct 31, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Jung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pop devices and methods of forming the same
- Patent number 9,793,246
- Issue date Oct 17, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hua-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level shielding in multi-stacked fan out packages and methods...
- Patent number 9,659,878
- Issue date May 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,564,345
- Issue date Feb 7, 2017
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tien-Chung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for optical proximity correction of a modified in...
- Patent number 8,607,171
- Issue date Dec 10, 2013
- Macronix International Co., Ltd.
- Chungte Hsuan
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method for patterning material layer
- Patent number 8,343,713
- Issue date Jan 1, 2013
- Macronix International Co., Ltd.
- Chih-Hao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of controlling implantation dosages during coding of read-on...
- Patent number 6,969,642
- Issue date Nov 29, 2005
- Macronix International Co., Ltd.
- Ta Hung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming metal/dielectric multi-layered interconnects
- Patent number 6,531,385
- Issue date Mar 11, 2003
- Macronix International, Ltd.
- Tien-Chu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming silicide
- Patent number 6,528,421
- Issue date Mar 4, 2003
- Macronix International Co., Ltd.
- Tien-Chu Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH ELECTROMAGNETIC INTERFERENCE FILM AND MET...
- Publication number 20240387401
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Hsi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH UNDER-BUMP METALLIZATION PROVIDING IMPRO...
- Publication number 20240379571
- Publication date Nov 14, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Ting-Ting Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPENSATION METHOD FOR WAFER BONDING
- Publication number 20240332246
- Publication date Oct 3, 2024
- Macronix International Co., Ltd.
- Tien Chu YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF CRACKS IN REDISTRIBUTION STRUCTURE
- Publication number 20240063099
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ting KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGE AND METHOD OF MAKING SAME
- Publication number 20240047321
- Publication date Feb 8, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Tien-Chung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION
- Publication number 20240038649
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ting KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGE STRUCTURES WITH CASCADED OPENINGS IN ENHANCEMENT LAYER
- Publication number 20240038701
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ting Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION
- Publication number 20240038682
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tien-Chung YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING
- Publication number 20230420438
- Publication date Dec 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tien-Chung YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR IDENTIFYING OBJECT, OPTICAL SENSING APPARATUS AND SYSTEM
- Publication number 20230244319
- Publication date Aug 3, 2023
- PIXART IMAGING Inc.
- TIEN-CHUNG YANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR IDENTIFYING OBJECT, OPTICAL SENSING APPARATUS AND SYSTEM
- Publication number 20220382378
- Publication date Dec 1, 2022
- PIXART IMAGING Inc.
- TIEN-CHUNG YANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FORCE SENSOR DEVICE AND METHOD FOR DETECTING FORCE BASED ON TEMPORA...
- Publication number 20220137723
- Publication date May 5, 2022
- PixArt Imaging Inc.
- Tien-Chung Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20220068880
- Publication date Mar 3, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- CHEN-HUA YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC REFERENCE CURRENT MEMORY ARRAY AND METHOD
- Publication number 20210350860
- Publication date Nov 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tien-Chun YANG
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210066263
- Publication date Mar 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20210050305
- Publication date Feb 18, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Hsi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20200118974
- Publication date Apr 16, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- CHEN-HUA YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure and Method of Forming
- Publication number 20190326132
- Publication date Oct 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180211895
- Publication date Jul 26, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- TIEN-CHUNG YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20180151510
- Publication date May 31, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Hsi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20180122781
- Publication date May 3, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Stack Package-on-Package Structures
- Publication number 20180068979
- Publication date Mar 8, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Jung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20180026010
- Publication date Jan 25, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES, POP DEVICES AND METHODS OF FORMING THE SAME
- Publication number 20170345795
- Publication date Nov 30, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tien-Chung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20170338207
- Publication date Nov 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Stack Package-on-Package Structures
- Publication number 20170330858
- Publication date Nov 16, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Jung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure and Method of Forming
- Publication number 20170301562
- Publication date Oct 19, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Shielding in Multi-Stacked Fan Out Packages and Methods...
- Publication number 20170256502
- Publication date Sep 7, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20170170145
- Publication date Jun 15, 2017
- CHEN-HUA YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL SHIELDING IN MULTI-STACKED FAN OUT PACKAGES AND METHODS...
- Publication number 20170110413
- Publication date Apr 20, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS

TIEN-CHUNG YANG

Person

Patents Grantslast 30 patents

Semiconductor device with electromagnetic interference film and met...

Method for identifying size of object, optical sensing apparatus an...

Semiconductor structure

Method for identifying object, optical sensing apparatus and system

Dynamic reference current memory array and method

Semiconductor structure

Semiconductor package and manufacturing method thereof

Semiconductor structure and method of forming

Semiconductor device with electromagnetic interference protection a...

Semiconductor structure and manufacturing method thereof

Semiconductor structure and method of forming

Package structure and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Multi-stack package-on-package structures

Semiconductor device and method of manufacture

Package structures, pop devices and methods of forming the same

Semiconductor device and manufacturing method thereof

Wafer level shielding in multi-stacked fan out packages and methods...

Semiconductor device and method of manufacture

Multi-stack package-on-package structures

Pop devices and methods of forming the same

Wafer level shielding in multi-stacked fan out packages and methods...

Semiconductor device and manufacturing method thereof

System and method for optical proximity correction of a modified in...

Method for patterning material layer

Method of controlling implantation dosages during coding of read-on...

Method of forming metal/dielectric multi-layered interconnects

Method for forming silicide

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH ELECTROMAGNETIC INTERFERENCE FILM AND MET...

SEMICONDUCTOR PACKAGE WITH UNDER-BUMP METALLIZATION PROVIDING IMPRO...

COMPENSATION METHOD FOR WAFER BONDING

REDUCTION OF CRACKS IN REDISTRIBUTION STRUCTURE

INTEGRATED FAN-OUT PACKAGE AND METHOD OF MAKING SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION

FAN-OUT PACKAGE STRUCTURES WITH CASCADED OPENINGS IN ENHANCEMENT LAYER

SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION

SEMICONDUCTOR PACKAGING

METHOD FOR IDENTIFYING OBJECT, OPTICAL SENSING APPARATUS AND SYSTEM

METHOD FOR IDENTIFYING OBJECT, OPTICAL SENSING APPARATUS AND SYSTEM

FORCE SENSOR DEVICE AND METHOD FOR DETECTING FORCE BASED ON TEMPORA...

SEMICONDUCTOR STRUCTURE

DYNAMIC REFERENCE CURRENT MEMORY ARRAY AND METHOD

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

SEMICONDUCTOR STRUCTURE

Semiconductor Structure and Method of Forming

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

Semiconductor Device and Method of Manufacture

Multi-Stack Package-on-Package Structures

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURES, POP DEVICES AND METHODS OF FORMING THE SAME

Semiconductor Device and Method of Manufacture

Multi-Stack Package-on-Package Structures

Semiconductor Structure and Method of Forming

Wafer Level Shielding in Multi-Stacked Fan Out Packages and Methods...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

WAFER LEVEL SHIELDING IN MULTI-STACKED FAN OUT PACKAGES AND METHODS...