Tien-Jen Cheng

Person

Beford, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Metal to metal bonding for stacked (3D) integrated circuits
- Patent number 9,673,176
- Issue date Jun 6, 2017
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal to metal bonding for stacked (3D) integrated circuits
- Patent number 9,666,563
- Issue date May 30, 2017
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal to metal bonding for stacked (3D) integrated circuits
- Patent number 9,653,431
- Issue date May 16, 2017
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal to metal bonding for stacked (3D) integrated circuits
- Patent number 9,653,432
- Issue date May 16, 2017
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal to metal bonding for stacked (3D) integrated circuits
- Patent number 9,515,051
- Issue date Dec 6, 2016
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition chamber cleaning method including stressed cleaning layer
- Patent number 9,017,486
- Issue date Apr 28, 2015
- International Business Machines Corporation
- Tien-Jen Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Deposition chamber cleaning method including stressed cleaning layer
- Patent number 9,017,487
- Issue date Apr 28, 2015
- International Business Machines Corporation
- Tien-Jen J. Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal to metal bonding for stacked (3D) integrated circuits
- Patent number 8,916,448
- Issue date Dec 23, 2014
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for removing copper oxide layer
- Patent number 8,444,868
- Issue date May 21, 2013
- International Business Machines Corporation
- Tien-Jen Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective copper encapsulation layer deposition
- Patent number 8,415,252
- Issue date Apr 9, 2013
- International Business Machines Corporation
- Tien-Jen Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor having interconnects with improved mechanical propert...
- Patent number 8,384,219
- Issue date Feb 26, 2013
- International Business Machines Corporation
- Junjing Bao
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Methods of forming integrated circuit devices having damascene inte...
- Patent number 8,373,273
- Issue date Feb 12, 2013
- Samsung Electronics Co., Ltd.
- Hyeok-Sang Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming integrated circuit devices having damascene inte...
- Patent number 8,232,200
- Issue date Jul 31, 2012
- International Business Machines Corporation
- Hyeok-Sang Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of improving mechanical properties of semiconductor intercon...
- Patent number 8,129,269
- Issue date Mar 6, 2012
- International Business Machines Corporation
- Junjing Bao
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Conformal adhesion promoter liner for metal interconnects
- Patent number 8,105,937
- Issue date Jan 31, 2012
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures comprising capping layers with low dielectr...
- Patent number 8,026,166
- Issue date Sep 27, 2011
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BLM structure for application to copper pad
- Patent number 7,923,836
- Issue date Apr 12, 2011
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming robust solder interconnect structures by reducing effects o...
- Patent number 7,767,575
- Issue date Aug 3, 2010
- Tessera Intellectual Properties, Inc.
- Kamalesh K. Srivastava
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a bond pad on an I/C chip and resulting structure
- Patent number 7,572,726
- Issue date Aug 11, 2009
- International Business Machines Corporation
- Julie C. Biggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compressible films surrounding solder connectors
- Patent number 7,566,649
- Issue date Jul 28, 2009
- International Business Machines Corporation
- William E. Bernier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming robust solder interconnect structures by reducin...
- Patent number 7,473,997
- Issue date Jan 6, 2009
- International Business Machines Corporation
- Kamalesh K. Srivastava
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compressible films surrounding solder connectors
- Patent number 7,332,821
- Issue date Feb 19, 2008
- International Business Machines Corporation
- William E. Bernier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for selective electroplating of semiconductor device I/O pad...
- Patent number 7,144,490
- Issue date Dec 5, 2006
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming robust solder interconnect structures by reducin...
- Patent number 6,995,084
- Issue date Feb 7, 2006
- International Business Machines Corporation
- Kamalesh K. Srivastava
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
I/C chip suitable for wire bonding
- Patent number 6,995,475
- Issue date Feb 7, 2006
- International Business Machines Corporation
- Julie C. Biggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier for interconnect and method
- Patent number 6,992,389
- Issue date Jan 31, 2006
- International Business Machines Corporation
- Panayotis C. Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fuse structure and method to form the same
- Patent number 6,927,472
- Issue date Aug 9, 2005
- International Business Machines Corporation
- David K. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fuse structure and method to form the same
- Patent number 6,924,185
- Issue date Aug 2, 2005
- International Business Machines Corporation
- David K. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for controlling local current to achieve uniform plating thi...
- Patent number 6,896,784
- Issue date May 24, 2005
- International Business Machines Corporation
- Tien-Jen Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for controlling local current to achieve unifo...
- Patent number 6,890,413
- Issue date May 10, 2005
- International Business Machines Corporation
- Tien-Jen Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METAL TO METAL BONDING FOR STACKED (3D) INTEGRATED CIRCUITS
- Publication number 20160086914
- Publication date Mar 24, 2016
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL TO METAL BONDING FOR STACKED (3D) INTEGRATED CIRCUITS
- Publication number 20160086915
- Publication date Mar 24, 2016
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL TO METAL BONDING FOR STACKED (3D) INTEGRATED CIRCUITS
- Publication number 20160086916
- Publication date Mar 24, 2016
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL TO METAL BONDING FOR STACKED (3D) INTEGRATED CIRCUITS
- Publication number 20160086925
- Publication date Mar 24, 2016
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE PASSIVATION OF VIAS
- Publication number 20150076695
- Publication date Mar 19, 2015
- STMicroelectronics, Inc.
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL TO METAL BONDING FOR STACKED (3D) INTEGRATED CIRCUITS
- Publication number 20140374903
- Publication date Dec 25, 2014
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL TO METAL BONDING FOR STACKED (3D) INTEGRATED CIRCUITS
- Publication number 20140191418
- Publication date Jul 10, 2014
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUE FOR UNIFORM CMP
- Publication number 20140097539
- Publication date Apr 10, 2014
- John H. Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION CHAMBER CLEANING METHOD INCLUDING STRESSED CLEANING LAYER
- Publication number 20130180543
- Publication date Jul 18, 2013
- International Business Machines Corporation
- Tien-Jen J. Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Chemical Bath Replenishment
- Publication number 20130095649
- Publication date Apr 18, 2013
- International Business Machines Corporation
- Tien-Jen Cheng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHODS OF FORMING INTEGRATED CIRCUIT DEVICES HAVING DAMASCENE INTE...
- Publication number 20120267785
- Publication date Oct 25, 2012
- Hyeok-Sang Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor having interconnects with improved mechanical propert...
- Publication number 20120146224
- Publication date Jun 14, 2012
- International Business Machines Corporation
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF IMPROVING MECHANICAL PROPERTIES OF SEMICONDUCTOR INTERCON...
- Publication number 20120068315
- Publication date Mar 22, 2012
- International Business Machines Corporation
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Deposition Chamber Cleaning Method Including Stressed Cleaning Layer
- Publication number 20120061234
- Publication date Mar 15, 2012
- International Business Machines Corporation
- Tien-Jen Cheng
- B08 - CLEANING
Information Patent Application
Method for Removing Copper Oxide Layer
- Publication number 20110183520
- Publication date Jul 28, 2011
- International Business Machines Corporation
- Tien-Jen Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELECTIVE COPPER ENCAPSULATION LAYER DEPOSITION
- Publication number 20110162875
- Publication date Jul 7, 2011
- International Business Machines Corporation
- Tien-Jen Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONFORMAL ADHESION PROMOTER LINER FOR METAL INTERCONNECTS
- Publication number 20100038789
- Publication date Feb 18, 2010
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES COMPRISING CAPPING LAYERS WITH LOW DIELECTR...
- Publication number 20100038793
- Publication date Feb 18, 2010
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING ROBUST SOLDER INTERCONNECT STRUCTURES BY REDUCING EFFECTS O...
- Publication number 20090163019
- Publication date Jun 25, 2009
- International Business Machines Corporation
- Kamalesh K. Srivastava
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR IMPROVED COPPER LAYER ETCHING OF WAFERS WITH C4 CONNECTI...
- Publication number 20080119056
- Publication date May 22, 2008
- International Business Machines Corporation
- Carla A. Bailey
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BLM STRUCTURE FOR APPLICATION TO COPPER PAD
- Publication number 20080017984
- Publication date Jan 24, 2008
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPRESSIBLE FILMS SURROUNDING SOLDER CONNECTORS
- Publication number 20080009101
- Publication date Jan 10, 2008
- William E. Bernier
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Device with area array pads for test probing
- Publication number 20060249854
- Publication date Nov 9, 2006
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming a bond pad on an I/C chip and resulting structure
- Publication number 20060081981
- Publication date Apr 20, 2006
- International Business Machines Corporation
- Julie C. Biggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPRESSIBLE FILMS SURROUNDING SOLDER CONNECTORS
- Publication number 20060040567
- Publication date Feb 23, 2006
- International Business Machines Corporation
- William E. Bernier
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD FOR FORMING ROBUST SOLDER INTERCONNECT STRUCTURES BY REDUCIN...
- Publication number 20060009022
- Publication date Jan 12, 2006
- International Business Machines Corporation
- Kamalesh K. Srivastava
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER FOR INTERCONNECT AND METHOD
- Publication number 20050245070
- Publication date Nov 3, 2005
- International Business Machines Corporation
- Panayotis C. Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING ROBUST SOLDER INTERCONNECT STRUCTURES BY REDUCIN...
- Publication number 20050208748
- Publication date Sep 22, 2005
- International Business Machines Corporation
- Kamalesh K. Srivastava
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE WITH AREA ARRAY PADS FOR TEST PROBING
- Publication number 20050167837
- Publication date Aug 4, 2005
- International Business Machines Corporation
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SELECTIVE ELECTROPLATING OF SEMICONDUCTOR DEVICE I/O PAD...
- Publication number 20050103636
- Publication date May 19, 2005
- International Business Machines Corporation
- Tien-Jen Cheng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Tien-Jen Cheng

Person

Patents Grantslast 30 patents

Metal to metal bonding for stacked (3D) integrated circuits

Metal to metal bonding for stacked (3D) integrated circuits

Metal to metal bonding for stacked (3D) integrated circuits

Metal to metal bonding for stacked (3D) integrated circuits

Metal to metal bonding for stacked (3D) integrated circuits

Deposition chamber cleaning method including stressed cleaning layer

Deposition chamber cleaning method including stressed cleaning layer

Metal to metal bonding for stacked (3D) integrated circuits

Method for removing copper oxide layer

Selective copper encapsulation layer deposition

Semiconductor having interconnects with improved mechanical propert...

Methods of forming integrated circuit devices having damascene inte...

Methods of forming integrated circuit devices having damascene inte...

Method of improving mechanical properties of semiconductor intercon...

Conformal adhesion promoter liner for metal interconnects

Interconnect structures comprising capping layers with low dielectr...

BLM structure for application to copper pad

Forming robust solder interconnect structures by reducing effects o...

Method of forming a bond pad on an I/C chip and resulting structure

Compressible films surrounding solder connectors

Method for forming robust solder interconnect structures by reducin...

Compressible films surrounding solder connectors

Method for selective electroplating of semiconductor device I/O pad...

Method for forming robust solder interconnect structures by reducin...

I/C chip suitable for wire bonding

Barrier for interconnect and method

Fuse structure and method to form the same

Fuse structure and method to form the same

Method for controlling local current to achieve uniform plating thi...

Method and apparatus for controlling local current to achieve unifo...

Patents Applicationslast 30 patents

METAL TO METAL BONDING FOR STACKED (3D) INTEGRATED CIRCUITS

METAL TO METAL BONDING FOR STACKED (3D) INTEGRATED CIRCUITS

METAL TO METAL BONDING FOR STACKED (3D) INTEGRATED CIRCUITS

METAL TO METAL BONDING FOR STACKED (3D) INTEGRATED CIRCUITS

SELECTIVE PASSIVATION OF VIAS

METAL TO METAL BONDING FOR STACKED (3D) INTEGRATED CIRCUITS

METAL TO METAL BONDING FOR STACKED (3D) INTEGRATED CIRCUITS

TECHNIQUE FOR UNIFORM CMP

DEPOSITION CHAMBER CLEANING METHOD INCLUDING STRESSED CLEANING LAYER

Chemical Bath Replenishment

METHODS OF FORMING INTEGRATED CIRCUIT DEVICES HAVING DAMASCENE INTE...

Semiconductor having interconnects with improved mechanical propert...

METHOD OF IMPROVING MECHANICAL PROPERTIES OF SEMICONDUCTOR INTERCON...

Deposition Chamber Cleaning Method Including Stressed Cleaning Layer

Method for Removing Copper Oxide Layer

SELECTIVE COPPER ENCAPSULATION LAYER DEPOSITION

CONFORMAL ADHESION PROMOTER LINER FOR METAL INTERCONNECTS

INTERCONNECT STRUCTURES COMPRISING CAPPING LAYERS WITH LOW DIELECTR...

FORMING ROBUST SOLDER INTERCONNECT STRUCTURES BY REDUCING EFFECTS O...

METHOD FOR IMPROVED COPPER LAYER ETCHING OF WAFERS WITH C4 CONNECTI...

BLM STRUCTURE FOR APPLICATION TO COPPER PAD

COMPRESSIBLE FILMS SURROUNDING SOLDER CONNECTORS

Device with area array pads for test probing

Method of forming a bond pad on an I/C chip and resulting structure

COMPRESSIBLE FILMS SURROUNDING SOLDER CONNECTORS

METHOD FOR FORMING ROBUST SOLDER INTERCONNECT STRUCTURES BY REDUCIN...

BARRIER FOR INTERCONNECT AND METHOD

METHOD FOR FORMING ROBUST SOLDER INTERCONNECT STRUCTURES BY REDUCIN...

DEVICE WITH AREA ARRAY PADS FOR TEST PROBING

METHOD FOR SELECTIVE ELECTROPLATING OF SEMICONDUCTOR DEVICE I/O PAD...