Tien Y. Wu

Person

Endwell, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Protective cover plate for flip chip assembly backside
- Patent number 6,403,882
- Issue date Jun 11, 2002
- International Business Machines Corporation
- William Tze-You Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package
- Patent number 6,226,187
- Issue date May 1, 2001
- International Business Machines Corporation
- David Lee Questad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package including a heat sink and an adhesive
- Patent number 6,084,299
- Issue date Jul 4, 2000
- International Business Machines Corporation
- David Lee Questad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated electronic package including a power/ground assembly
- Patent number 5,574,630
- Issue date Nov 12, 1996
- International Business Machines Corporation
- John S. Kresge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package having active means to maintain its operating te...
- Patent number 5,491,610
- Issue date Feb 13, 1996
- International Business Machines Corporation
- Lawrence S.-W. Mok
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multilayered circuit board
- Patent number 5,442,144
- Issue date Aug 15, 1995
- International Business Machines Corporation
- William T. Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making multilayered circuit board
- Patent number 5,359,767
- Issue date Nov 1, 1994
- International Business Machines Corporation
- William T. Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Protective cover plate for flip chip assembly backside

Integrated circuit package

Integrated circuit package including a heat sink and an adhesive

Laminated electronic package including a power/ground assembly

Electronic package having active means to maintain its operating te...

Multilayered circuit board

Method of making multilayered circuit board