Tim A. Renfro

Person

Mesa, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thermally coupling an integrated heat spreader to a heat sink base
- Patent number 7,364,063
- Issue date Apr 29, 2008
- Intel Corporation
- Matthew J. Schaenzer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for reducing socket warpage
- Patent number 7,350,299
- Issue date Apr 1, 2008
- Intel Corporation
- Tim A. Renfro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metallic solder thermal interface material layer and application of...
- Patent number 7,347,354
- Issue date Mar 25, 2008
- Intel Corporation
- Edward Hurley
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated socket and cable connector
- Patent number 7,244,137
- Issue date Jul 17, 2007
- Intel Corporation
- Tim A. Renfro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket for having the same conductor inserts for signal, power and...
- Patent number 7,077,661
- Issue date Jul 18, 2006
- Intel Corporation
- Tim Renfro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Attaching integrated circuits to printed circuit boards
- Patent number 7,037,115
- Issue date May 2, 2006
- Intel Corporation
- Tim A. Renfro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated socket and cable connector
- Patent number 6,969,270
- Issue date Nov 29, 2005
- Intel Corporation
- Tim A. Renfro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket warpage reduction apparatus and method
- Patent number 6,692,280
- Issue date Feb 17, 2004
- Intel Corporation
- Tim A. Renfro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated horizontal cam lever for zero-insertion force (ZIF) sock...
- Patent number 6,616,471
- Issue date Sep 9, 2003
- Intel Corporation
- Tim A. Renfro
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Thermally coupling an integrated heat spreader to a heat sink base
- Publication number 20080156457
- Publication date Jul 3, 2008
- Matthew J. Schaenzer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOCKET WARPAGE REDUCTION APPARATUS
- Publication number 20080119081
- Publication date May 22, 2008
- Intel Corporation
- Tim A. Renfro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated socket and cable connector
- Publication number 20060040523
- Publication date Feb 23, 2006
- Tim A. Renfro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermally coupling an integrated heat spreader to a heat sink base
- Publication number 20060027635
- Publication date Feb 9, 2006
- Matthew J. Schaenzer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Attaching integrated circuits to printed circuit boards
- Publication number 20050255723
- Publication date Nov 17, 2005
- Tim A. Renfro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Aligning socket load plates to integral heat spreaders
- Publication number 20050243521
- Publication date Nov 3, 2005
- Michael Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metallic solder thermal interface material layer and application of...
- Publication number 20050211752
- Publication date Sep 29, 2005
- Intel Corporation
- Edward Hurley
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOCKET FOR A MICROELECTRONIC COMPONENT
- Publication number 20050181639
- Publication date Aug 18, 2005
- Tim Renfro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Land grid array membrane
- Publication number 20050164505
- Publication date Jul 28, 2005
- Tim A. Renfro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated socket and cable connector
- Publication number 20040266226
- Publication date Dec 30, 2004
- Tim A. Renfro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Socket warpage reduction apparatus and method
- Publication number 20040147156
- Publication date Jul 29, 2004
- Intel Corporation
- Tim A. Renfro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Socket warpage reduction apparatus and method
- Publication number 20030064619
- Publication date Apr 3, 2003
- Tim A. Renfro
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Integrated horizontal cam lever for zero-insertion force (ZIF) sock...
- Publication number 20030060074
- Publication date Mar 27, 2003
- Tim A. Renfro
- H01 - BASIC ELECTRIC ELEMENTS

Tim A. Renfro

Person

Patents Grantslast 30 patents

Thermally coupling an integrated heat spreader to a heat sink base

Method for reducing socket warpage

Metallic solder thermal interface material layer and application of...

Integrated socket and cable connector

Socket for having the same conductor inserts for signal, power and...

Attaching integrated circuits to printed circuit boards

Integrated socket and cable connector

Socket warpage reduction apparatus and method

Integrated horizontal cam lever for zero-insertion force (ZIF) sock...

Patents Applicationslast 30 patents

Thermally coupling an integrated heat spreader to a heat sink base

SOCKET WARPAGE REDUCTION APPARATUS

Integrated socket and cable connector

Thermally coupling an integrated heat spreader to a heat sink base

Attaching integrated circuits to printed circuit boards

Aligning socket load plates to integral heat spreaders

Metallic solder thermal interface material layer and application of...

SOCKET FOR A MICROELECTRONIC COMPONENT

Land grid array membrane

Integrated socket and cable connector

Socket warpage reduction apparatus and method

Socket warpage reduction apparatus and method

Integrated horizontal cam lever for zero-insertion force (ZIF) sock...