Tim Böttcher

Person

Hamburg, DE

People

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR POWER DEVICE WITH TERMINATION RINGS
- Publication number 20250212469
- Publication date Jun 26, 2025
- NEXPERIA B.V.
- Georgio El Zammar
Information Patent Application
SUPPRESSION OF AUTO-DOPING DURING EPITAXIAL GROWTH OF EPITAXY LAYER...
- Publication number 20250212475
- Publication date Jun 26, 2025
- NEXPERIA B.V.
- Tim Böttcher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSED REGIONS OF A JUNCTION TERMINATION EXTENSION FOR SEMICONDUC...
- Publication number 20250107167
- Publication date Mar 27, 2025
- NEXPERIA B.V.
- Tim Böttcher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP SURFACE OF A JUNCTION TERMINATION EXTENSION FOR SEMICONDUCTOR D...
- Publication number 20250107165
- Publication date Mar 27, 2025
- NEXPERIA B.V.
- Tim Böttcher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having an Improved Termination Area Using a Pl...
- Publication number 20250072063
- Publication date Feb 27, 2025
- NEXPERIA B.V.
- Massimo Cataldo Mazzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF IMPROVING PACKAGE CREEPAGE DISTANCE
- Publication number 20240371712
- Publication date Nov 7, 2024
- NEXPERIA B.V.
- Hans-Juergen Funke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Schottky Barrier Control in Vertically Oriented Semiconductor Devic...
- Publication number 20240363768
- Publication date Oct 31, 2024
- NEXPERIA B.V.
- Massimo Cataldo Mazzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Control of the Forward and Reverse Characteristics of Vertically Or...
- Publication number 20240363769
- Publication date Oct 31, 2024
- NEXPERIA B.V.
- Georgio El Zammar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Assembly
- Publication number 20240120260
- Publication date Apr 11, 2024
- NEXPERIA B.V.
- Tim Böttcher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Semiconductor Package, Such Semiconductor...
- Publication number 20240120247
- Publication date Apr 11, 2024
- NEXPERIA B.V.
- Regnerus Hermannus Poelma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Improving Package Creepage Distance
- Publication number 20240105447
- Publication date Mar 28, 2024
- NEXPERIA B.V.
- Hans-Juergen Funke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER DEVICE WITH IMPROVED RUGGEDNESS
- Publication number 20240096933
- Publication date Mar 21, 2024
- NEXPERIA B.V.
- Georgio El Zammar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240072113
- Publication date Feb 29, 2024
- NEXPERIA B.V.
- Stefan Berglund
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER DEVICE FOR TRANSFERRING AN ELECTRONIC COMPONENT
- Publication number 20230402550
- Publication date Dec 14, 2023
- NEXPERIA B.V.
- Tim BÖTTCHER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL ORIENTED SEMICONDUCTOR DEVICE HAVING A REDUCED LATERAL FIE...
- Publication number 20230307494
- Publication date Sep 28, 2023
- NEXPERIA B.V.
- Stefan Berglund
- H01 - BASIC ELECTRIC ELEMENTS

Tim Böttcher

Person

Patents Applicationslast 30 patents

SEMICONDUCTOR POWER DEVICE WITH TERMINATION RINGS

SUPPRESSION OF AUTO-DOPING DURING EPITAXIAL GROWTH OF EPITAXY LAYER...

RECESSED REGIONS OF A JUNCTION TERMINATION EXTENSION FOR SEMICONDUC...

TOP SURFACE OF A JUNCTION TERMINATION EXTENSION FOR SEMICONDUCTOR D...

Semiconductor Device Having an Improved Termination Area Using a Pl...

METHOD OF IMPROVING PACKAGE CREEPAGE DISTANCE

Schottky Barrier Control in Vertically Oriented Semiconductor Devic...

Control of the Forward and Reverse Characteristics of Vertically Or...

Semiconductor Package Assembly

Method of Manufacturing a Semiconductor Package, Such Semiconductor...

Method of Improving Package Creepage Distance

SEMICONDUCTOR POWER DEVICE WITH IMPROVED RUGGEDNESS

VERTICAL SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

TRANSFER DEVICE FOR TRANSFERRING AN ELECTRONIC COMPONENT

VERTICAL ORIENTED SEMICONDUCTOR DEVICE HAVING A REDUCED LATERAL FIE...