Tim J. Corbett

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Magnetically adjusting color-converting materials within a matrix a...
- Patent number 9,039,474
- Issue date May 26, 2015
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor components having lasered feat...
- Patent number 8,728,921
- Issue date May 20, 2014
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thinned semiconductor components having lasered features and method...
- Patent number 8,530,895
- Issue date Sep 10, 2013
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating semiconductor components using thinning and...
- Patent number 8,187,983
- Issue date May 29, 2012
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal wafer carrier for wafer level die burn-in
- Patent number 7,511,520
- Issue date Mar 31, 2009
- Micron Technology, Inc.
- Alan G. Wood
- G01 - MEASURING TESTING
Information Patent Grant
Comparing identifying indicia formed using laser marking techniques...
- Patent number 7,452,732
- Issue date Nov 18, 2008
- Micron Technology, Inc.
- Tim J. Corbett
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Universal wafer carrier for wafer level die burn-in
- Patent number 7,362,113
- Issue date Apr 22, 2008
- Micron Technology, Inc.
- Alan G. Wood
- G01 - MEASURING TESTING
Information Patent Grant
Method for testing using a universal wafer carrier for wafer level...
- Patent number 7,288,953
- Issue date Oct 30, 2007
- Micron Technology, Inc.
- Alan G. Wood
- G01 - MEASURING TESTING
Information Patent Grant
Method for testing using a universal wafer carrier for wafer level...
- Patent number 7,167,014
- Issue date Jan 23, 2007
- Micron Technology, Inc.
- Alan G. Wood
- G01 - MEASURING TESTING
Information Patent Grant
Universal wafer carrier for wafer level die burn-in
- Patent number 7,167,012
- Issue date Jan 23, 2007
- Micron Technology, Inc.
- Alan G. Wood
- G01 - MEASURING TESTING
Information Patent Grant
Method for testing using a universal wafer carrier for wafer level...
- Patent number 7,161,373
- Issue date Jan 9, 2007
- Micron Technology, Inc.
- Alan G. Wood
- G01 - MEASURING TESTING
Information Patent Grant
Method for testing using a universal wafer carrier for wafer level...
- Patent number 7,141,997
- Issue date Nov 28, 2006
- Micron Technology, Inc.
- Alan G. Wood
- G01 - MEASURING TESTING
Information Patent Grant
Method for testing using a universal wafer carrier for wafer level...
- Patent number 7,112,985
- Issue date Sep 26, 2006
- Micron Technology, Inc.
- Alan G. Wood
- G01 - MEASURING TESTING
Information Patent Grant
Method for testing using a universal wafer carrier for wafer level...
- Patent number 7,112,986
- Issue date Sep 26, 2006
- Micron Technology, Inc.
- Alan G. Wood
- G01 - MEASURING TESTING
Information Patent Grant
Method for burn-in testing semiconductor dice
- Patent number 6,998,860
- Issue date Feb 14, 2006
- Micron Technology, Inc.
- Alan G. Wood
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor reliability test chip
- Patent number 6,770,906
- Issue date Aug 3, 2004
- Micron Technology, Inc.
- Tim J. Corbett
- G01 - MEASURING TESTING
Information Patent Grant
Method for universal wafer carrier for wafer level die burn-in
- Patent number 6,737,882
- Issue date May 18, 2004
- Micron Technology, Inc.
- Alan G. Wood
- G01 - MEASURING TESTING
Information Patent Grant
Laser marking techniques
- Patent number 6,683,637
- Issue date Jan 27, 2004
- Micron Technology, Inc.
- Tim J. Corbett
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor reliability test chip
- Patent number 6,538,264
- Issue date Mar 25, 2003
- Micron Technology, Inc.
- Tim J. Corbett
- G01 - MEASURING TESTING
Information Patent Grant
Universal wafer carrier for wafer level die burn-in
- Patent number 6,535,012
- Issue date Mar 18, 2003
- Micron Technology, Inc.
- Alan G. Wood
- G01 - MEASURING TESTING
Information Patent Grant
Laser marking techniques
- Patent number 6,461,690
- Issue date Oct 8, 2002
- Micron Technology, Inc.
- Tim J. Corbett
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser marking techniques
- Patent number 6,429,890
- Issue date Aug 6, 2002
- Micron Technology, Inc.
- Tim J. Corbett
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser marking techniques
- Patent number 6,342,912
- Issue date Jan 29, 2002
- Micron Technology, Inc.
- Tim J. Corbett
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Universal wafer carrier for wafer level die burn-in
- Patent number 6,342,789
- Issue date Jan 29, 2002
- Micron Technology, Inc.
- Alan G. Wood
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor reliability test chip
- Patent number 6,320,201
- Issue date Nov 20, 2001
- Micron Technology, Inc.
- Tim J. Corbett
- G01 - MEASURING TESTING
Information Patent Grant
Laser marking techniques
- Patent number 6,217,949
- Issue date Apr 17, 2001
- Micron Technology, Inc.
- Tim J. Corbett
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor reliability test chip
- Patent number 6,157,046
- Issue date Dec 5, 2000
- Micron Technology, Inc.
- Tim J. Corbett
- G01 - MEASURING TESTING
Information Patent Grant
Laser making techniques
- Patent number 6,113,992
- Issue date Sep 5, 2000
- Micron Technology, Inc.
- Tim J. Corbett
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser marking techniques
- Patent number 6,108,026
- Issue date Aug 22, 2000
- Micron Technology, Inc.
- Tim J. Corbett
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Discrete die burn-in for nonpackaged die
- Patent number 6,091,251
- Issue date Jul 18, 2000
- Alan G. Wood
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR COMPONENTS HAVING LASERED FEAT...
- Publication number 20130323909
- Publication date Dec 5, 2013
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETICALLY ADJUSTING COLOR-CONVERTING MATERIALS WITHIN A MATRIX A...
- Publication number 20130119419
- Publication date May 16, 2013
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THINNED SEMICONDUCTOR COMPONENTS HAVING LASERED FEATURES AND METHOD...
- Publication number 20120241742
- Publication date Sep 27, 2012
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thinned Semiconductor Components Having Lasered Features And Method...
- Publication number 20100264423
- Publication date Oct 21, 2010
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIVERSAL WAFER CARRIER FOR WAFER LEVEL DIE BURN-IN
- Publication number 20070285115
- Publication date Dec 13, 2007
- Micron Technology, Inc.
- Alan G. Wood
- G01 - MEASURING TESTING
Information Patent Application
Universal wafer carrier for wafer level die burn-in
- Publication number 20070103180
- Publication date May 10, 2007
- Alan G. Wood
- G01 - MEASURING TESTING
Information Patent Application
Method for testing using a universal wafer carrier for wafer level...
- Publication number 20050253619
- Publication date Nov 17, 2005
- Alan G. Wood
- G01 - MEASURING TESTING
Information Patent Application
Method for testing using a universal wafer carrier for wafer level...
- Publication number 20050253620
- Publication date Nov 17, 2005
- Alan G. Wood
- G01 - MEASURING TESTING
Information Patent Application
Method for testing using a universal wafer carrier for wafer level...
- Publication number 20050237076
- Publication date Oct 27, 2005
- Alan G. Wood
- G01 - MEASURING TESTING
Information Patent Application
Method for testing using a universal wafer carrier for wafer level...
- Publication number 20050237077
- Publication date Oct 27, 2005
- Alan G. Wood
- G01 - MEASURING TESTING
Information Patent Application
Method for testing using a universal wafer carrier for wafer level...
- Publication number 20050237075
- Publication date Oct 27, 2005
- Alan G. Wood
- G01 - MEASURING TESTING
Information Patent Application
Method for universal wafer carrier for wafer level die burn-in
- Publication number 20040212391
- Publication date Oct 28, 2004
- Alan G. Wood
- G01 - MEASURING TESTING
Information Patent Application
Universal wafer carrier for wafer level die burn-in
- Publication number 20030206030
- Publication date Nov 6, 2003
- Alan G. Wood
- G01 - MEASURING TESTING
Information Patent Application
Laser marking techniques
- Publication number 20030203591
- Publication date Oct 30, 2003
- Tim J. Corbett
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor reliability test chip
- Publication number 20030151047
- Publication date Aug 14, 2003
- Tim J. Corbett
- G01 - MEASURING TESTING
Information Patent Application
Method for universal wafer carrier for wafer level die burn-in
- Publication number 20030080770
- Publication date May 1, 2003
- Alan G. Wood
- G01 - MEASURING TESTING
Information Patent Application
Laser marking techniques
- Publication number 20020135670
- Publication date Sep 26, 2002
- Tim J. Corbett
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Laser marking techniques
- Publication number 20020132060
- Publication date Sep 19, 2002
- Tim J. Corbett
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Universal wafer carrier for wafer level die burn-in
- Publication number 20020070742
- Publication date Jun 13, 2002
- Alan G. Wood
- G01 - MEASURING TESTING
Information Patent Application
Laser marking techniques
- Publication number 20020030732
- Publication date Mar 14, 2002
- Tim J. Corbett
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Semiconductor reliability test chip
- Publication number 20020024046
- Publication date Feb 28, 2002
- Tim J. Corbett
- G01 - MEASURING TESTING
Information Patent Application
Laser marking techniques
- Publication number 20010055825
- Publication date Dec 27, 2001
- Tim J. Corbett
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Laser marking techniques
- Publication number 20010010392
- Publication date Aug 2, 2001
- Tim J. Corbett
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Tim J. Corbett

Person

Patents Grantslast 30 patents

Magnetically adjusting color-converting materials within a matrix a...

Method for fabricating semiconductor components having lasered feat...

Thinned semiconductor components having lasered features and method...

Methods for fabricating semiconductor components using thinning and...

Universal wafer carrier for wafer level die burn-in

Comparing identifying indicia formed using laser marking techniques...

Universal wafer carrier for wafer level die burn-in

Method for testing using a universal wafer carrier for wafer level...

Method for testing using a universal wafer carrier for wafer level...

Universal wafer carrier for wafer level die burn-in

Method for testing using a universal wafer carrier for wafer level...

Method for testing using a universal wafer carrier for wafer level...

Method for testing using a universal wafer carrier for wafer level...

Method for testing using a universal wafer carrier for wafer level...

Method for burn-in testing semiconductor dice

Semiconductor reliability test chip

Method for universal wafer carrier for wafer level die burn-in

Laser marking techniques

Semiconductor reliability test chip

Universal wafer carrier for wafer level die burn-in

Laser marking techniques

Laser marking techniques

Laser marking techniques

Universal wafer carrier for wafer level die burn-in

Semiconductor reliability test chip

Laser marking techniques

Semiconductor reliability test chip

Laser making techniques

Laser marking techniques

Discrete die burn-in for nonpackaged die

Patents Applicationslast 30 patents

METHOD FOR FABRICATING SEMICONDUCTOR COMPONENTS HAVING LASERED FEAT...

MAGNETICALLY ADJUSTING COLOR-CONVERTING MATERIALS WITHIN A MATRIX A...

THINNED SEMICONDUCTOR COMPONENTS HAVING LASERED FEATURES AND METHOD...

Thinned Semiconductor Components Having Lasered Features And Method...

UNIVERSAL WAFER CARRIER FOR WAFER LEVEL DIE BURN-IN

Universal wafer carrier for wafer level die burn-in

Method for testing using a universal wafer carrier for wafer level...

Method for testing using a universal wafer carrier for wafer level...

Method for testing using a universal wafer carrier for wafer level...

Method for testing using a universal wafer carrier for wafer level...

Method for testing using a universal wafer carrier for wafer level...

Method for universal wafer carrier for wafer level die burn-in

Universal wafer carrier for wafer level die burn-in

Laser marking techniques

Semiconductor reliability test chip

Method for universal wafer carrier for wafer level die burn-in

Laser marking techniques

Laser marking techniques

Universal wafer carrier for wafer level die burn-in

Laser marking techniques

Semiconductor reliability test chip

Laser marking techniques

Laser marking techniques