Timothy Mobley

Person

Marana, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating a glass substrate with a plurality of vias
- Patent number 11,646,246
- Issue date May 9, 2023
- Samtec, Inc.
- Tim Mobley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filling materials and methods of filling through holes of a substrate
- Patent number 11,251,109
- Issue date Feb 15, 2022
- Samtec, Inc.
- Tim Mobley
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Filling materials and methods of filling through holes for improved...
- Patent number 9,374,892
- Issue date Jun 21, 2016
- TRITON MICROTECHNOLOGIES
- Tim Mobley
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Filling materials and methods of filling through holes for improved...
- Patent number 9,337,060
- Issue date May 10, 2016
- TRITON MICROTECHNOLOGIES
- Tim Mobley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Filling materials and methods of filling through holes for improved...
- Patent number 9,236,274
- Issue date Jan 12, 2016
- TRITON MICROTECHNOLOGIES
- Tim Mobley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for metallization and reinforcement of glass subs...
- Patent number 9,184,135
- Issue date Nov 10, 2015
- TRINTON MICROTECHNOLOGIES
- Tim Mobley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for metallization and reinforcement of glass subs...
- Patent number 9,184,064
- Issue date Nov 10, 2015
- TRITON MICROTECHNOLOGIES
- Tim Mobley
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low cost and high performance bonding of wafer to interposer and me...
- Patent number 9,111,917
- Issue date Aug 18, 2015
- TRITON MICROTECHNOLOGIES
- Tim Mobley
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FILLING MATERIALS AND METHODS OF FILLING THROUGH HOLES OF A SUBSTRATE
- Publication number 20220059436
- Publication date Feb 24, 2022
- SAMTEC, INC.
- Tim Mobley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILLING MATERIALS AND METHODS OF FILLING THROUGH HOLES OF A SUBSTRATE
- Publication number 20190322572
- Publication date Oct 24, 2019
- Samtec Inc.
- Tim MOBLEY
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
FILLING MATERIALS AND METHODS OF FILLING THROUGH HOLES OF A SUBSTRATE
- Publication number 20190326130
- Publication date Oct 24, 2019
- Samtec Inc.
- Tim MOBLEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILLING MATERIALS AND METHODS OF FILLING THROUGH HOLES OF A SUBSTRATE
- Publication number 20190304877
- Publication date Oct 3, 2019
- Samtec Inc.
- Tim MOBLEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICALLY INDUCED CERAMIC FUSIBLE METAL SYSTEM
- Publication number 20140175077
- Publication date Jun 26, 2014
- Raytheon Company
- Jeremy B. Baldwin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW COST AND HIGH PERFORMANCE BONDING OF WAFER TO INTERPOSER & METH...
- Publication number 20130105211
- Publication date May 2, 2013
- Tim Mobley
- H01 - BASIC ELECTRIC ELEMENTS

Timothy Mobley

Person

Patents Grantslast 30 patents

Method of fabricating a glass substrate with a plurality of vias

Filling materials and methods of filling through holes of a substrate

Filling materials and methods of filling through holes for improved...

Filling materials and methods of filling through holes for improved...

Filling materials and methods of filling through holes for improved...

System and method for metallization and reinforcement of glass subs...

System and method for metallization and reinforcement of glass subs...

Low cost and high performance bonding of wafer to interposer and me...

Patents Applicationslast 30 patents

FILLING MATERIALS AND METHODS OF FILLING THROUGH HOLES OF A SUBSTRATE

FILLING MATERIALS AND METHODS OF FILLING THROUGH HOLES OF A SUBSTRATE

FILLING MATERIALS AND METHODS OF FILLING THROUGH HOLES OF A SUBSTRATE

FILLING MATERIALS AND METHODS OF FILLING THROUGH HOLES OF A SUBSTRATE

ELECTRONICALLY INDUCED CERAMIC FUSIBLE METAL SYSTEM

LOW COST AND HIGH PERFORMANCE BONDING OF WAFER TO INTERPOSER & METH...