The present disclosure relates generally to fabricating component housings and, more particularly, to an electronically induced fusing system to fabricate components.
Conventional brazing methods for fixing electrical components tend to excessively heat large portions of a module containing the electrical components. These electrical components may be thermally sensitive, and can be damaged when exposed to the excessive heat generated by the conventional brazing methods.
In addition, it is desirable to provide a lid that covers the electrical components disposed within the module. Conventional methods of using solder or a brazing compound to attach the lid include placing the module and lid together in a heated oven to melt the solder or brazing compound. The oven, however, excessively heats the entire module, which can damage thermally sensitive electrical components.
In an exemplary embodiment, an electrically induced fusing system comprises a module including walls and a base to define a module body. The module body includes first and second conductive layers stacked next to one another. An electrically resistive layer is interposed between the first and second conductive layers, and is configured to emit heat in response to receiving electrical current from a power supply. At least one electrically conductive terminal is in electrical communication with the resistive layer and an output of the power supply to form an electrical path that delivers the current to the resistive layer. The system further includes a separable component configured to attach to the first conductive layer. At least one fusing element is interposed between the separable component and the first conductive layer, and is configured to melt in response to the heat emitted by the resistive layer.
In another embodiment, a fusible module comprises a base and walls extending perpendicular from the base. The walls extend along a length and width to define a module body. The module body comprises a plurality of conductive layers stacked against one another. The plurality of conductive layers includes a resistive layer interposed between a first conductive layer and a second conductive layer. The resistive layer is formed from an electrically resistive material that emits heat in response to electrical current flowing therethrough. At least one fusing element is disposed adjacent the resistive layer. The at least one fusing element is configured to melt in response to the heat emitted from the resistive layer to form at least one melted fusing element.
In yet another embodiment, a method of electronically fusing a separable component to a module body comprises interposing an electrically resistive layer between first and second conductive layers integrated in the module body. The method further includes disposing at least one fusing element against at least one of the module body and the separable component. The at least one fusing element is configured to melt in response to heat. The method further includes generating an electrical current, and flowing the current through the resistive layer to generate heat such that the fusing element melts and the module body bonds to the separable component.
For a more complete understanding of this disclosure, reference is now made to the following brief description, taken in connection with the accompanying drawings and detailed description, wherein like reference numerals represent like parts:
It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements. In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures and components have not been described in detail so as not to obscure the related relevant feature(s) being described. Also, the description is not to be considered as limiting the scope of the embodiments described herein.
Referring now to
The module 104 includes a module body 106 and a separable component 108. The module body 106 may be formed as a housing that contains a plurality of conductive layers 110 as further illustrated in
The module body 106 further includes at least one resistive layer 112 integrated therein and interposed between a first conductive layer 114 and a second conductive layer 116. The resistive layer 112 is formed from an electrically resistive material that emits heat in response to electrical current flowing therethrough. For example, the resistive layer 112 may be formed from copper, silver, tantalum nitride (TaN), nichrome, gold, etc. The resistive layer 112 is integrated in the module body 106 and defines a localized heating area 118 at the first conductive layer 114. Further, the resistive layer 112 may have a width of about 0.2 millimeters (mm) to about 0.5 mm. The resistive layer may be disposed near the upper surface of the first conductive layer 114. For example, the distance between the upper surface of the first conductive layer 114 and the resistive layer may range from about 0.08 mm to about 0.24 mm.
Referring to
Referring again to
The separable component 108 may be a component to be attached and detached to and from the module body 106. For example, the separable component 108 may be formed as a cover as further illustrated in
Referring further to
The fusing system 100 may further include a microcontroller 122 in electrical communication with the power supply 102. The microcontroller 122 is configured to store a predetermined thermal profile that models thermal behavior over a time period. One example of a thermal model is a Ramp-Soak-Spike (RSS) profile. Accordingly, the microcontroller 122 may adjust the power supply 102 to vary a current level of the current based on the thermal model such that thermal levels realized by the fusing element 120 may be controlled.
Referring now to
The cover 202 includes a base 206 extending along a first direction to define a length and a second direction to define a width. Walls 208 extend perpendicular from the base 206 to define an exterior of the cover 202. The cover 202 comprises a plurality of layers 210 stacked against one another. The plurality of layers 210 include a resistive layer 212 interposed between a first conductive layer 214 and a second conductive layer 216. The resistive layer 212 is formed from an electrically resistive material, such as copper, silver, tantalum nitride (TaN), nichrome, gold, etc., that emits heat in response to electrical current flowing therethrough.
Referring to
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More specifically, the housing unit 302 includes a plurality of conductive layers 306 stacked against one another. A resistive layer 308 is interposed between a first conductive layer 310 and a second conductive layer 312. The resistive layer 308 is formed from an electrically resistive material, such as copper, silver, tantalum nitride (TaN), nichrome, gold, etc., that emits heat in response to electrical current flowing therethrough.
Fusing elements, such as solder balls 314, are disposed at an upper surface 316 of the first conductive layer 310. As discussed above, the resistive layer 308 is integrated in the housing unit 302 such that a localized heating area may be defined at the upper surface 316 of the first conductive layer 310. The solder balls 314 are disposed at the localized heating areas, and the cover 304 is disposed against the upper surface 316 of the first conducting layer 310. Accordingly, the solder balls 314 are disposed between the cover 304 and the first conductive surface 310 of the housing unit 302. As discussed above, the solder balls 314 melt in response to current-induced heat emitted from the resistive layer 308 to form a melted fusing element such that the cover 304 is bonded to the housing unit 302.
Referring now
The housing unit 402 includes a resistive layer 414 integrated therein. More specifically, the resistive layer 414 is disposed beneath the base 410 that supports the electrical component 408. The housing unit 402 may include one or more electrical terminals 416, which are configured to receive an electrical output generated from a power supply. As described above, the resistive layer 414 is formed from an electrically resistive material, such as copper, silver, tantalum nitride (TaN), nichrome, gold, etc., that emits heat in response to electrical current flowing therethrough. Accordingly, the heat emitted from the resistive layer 414 melts the solder pad 412, thereby bonding the electrical component 408 to the base 410. Although not illustrated, an electrical component 408 and a cover may both be bonded to the housing unit 402 using the electrically induced fusing method described in detail above.
In each of the embodiments described above, it is appreciated that electrical power may be re-applied to the resistive layer while the fusing module exists in the fused state. As a result, the fusing element may again be melted and the module body and separable portion may be separate from another without exposing the entire fusing module to excessive heat.
As will thus be appreciated, among the technical benefits of the above described embodiments is a feature of providing a localized thermal area such that sensitive components included in the fusing module are not subjected to excessive temperatures. Accordingly, thermal damage to sensitive electrical components may be prevented.
While the disclosure has been described with reference to a preferred embodiment or embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the disclosure. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the disclosure without departing from the essential scope thereof. Therefore, it is intended that the disclosure not be limited to the particular embodiment disclosed as the best mode contemplated for carrying out this disclosure, but that the disclosure will include all embodiments falling within the scope of the appended claims.