Timothy P. Patterson

Person

Santa Ana, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Traceless flip chip assembly and method
- Patent number 6,846,701
- Issue date Jan 25, 2005
- Saturn Electronics & Engineering, Inc.
- Timothy Patterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for attaching components to a substrate
- Patent number 6,648,213
- Issue date Nov 18, 2003
- Saturn Electronics & Engineering, Inc.
- Timothy Patterson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Traceless flip chip assembly and method
- Patent number 6,571,468
- Issue date Jun 3, 2003
- Saturn Electronics & Engineering, Inc.
- Timothy Patterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Directionally conductive polymer
- Patent number 5,213,715
- Issue date May 25, 1993
- Western Digital Corporation
- Timothy P. Patterson
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polymer film interconnect
- Patent number 5,147,210
- Issue date Sep 15, 1992
- Western Digital Corporation
- Timothy P. Patterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plated plastic castellated interconnect for electrical components
- Patent number 5,069,626
- Issue date Dec 3, 1991
- Western Digital Corporation
- Timothy P. Patterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip mounting and packaging assembly
- Patent number 4,843,188
- Issue date Jun 27, 1989
- Western Digital Corporation
- Timothy P. Patterson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Traceless flip chip assembly and method
- Publication number 20030224556
- Publication date Dec 4, 2003
- Timothy Patterson
- H01 - BASIC ELECTRIC ELEMENTS

Timothy P. Patterson

Person

Patents Grantslast 30 patents

Traceless flip chip assembly and method

Manufacturing method for attaching components to a substrate

Traceless flip chip assembly and method

Directionally conductive polymer

Polymer film interconnect

Plated plastic castellated interconnect for electrical components

Integrated circuit chip mounting and packaging assembly

Patents Applicationslast 30 patents

Traceless flip chip assembly and method