Tin-Hao Kuo

Person

Hsin-Chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
IPD modules with flexible connection scheme in packaging
- Patent number 12,368,141
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and method for manufacturing the same
- Patent number 12,354,926
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming the same
- Patent number 12,322,706
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a heat dissipation structure connected...
- Patent number 12,300,618
- Issue date May 13, 2025
- Taiwna Semiconductor Manufacturing Company, Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 12,300,571
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Rong Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor structure including a barrier s...
- Patent number 12,278,208
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,261,126
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Hsien Chiang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding passive devices on active dies to form 3D packages
- Patent number 12,255,174
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with thermal relaxation block and manufacturi...
- Patent number 12,255,196
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 12,255,184
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cross-wafer RDLs in constructed wafers
- Patent number 12,230,513
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System, device and methods of manufacture
- Patent number 12,218,006
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, circuit board structure and manufacturing met...
- Patent number 12,205,923
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tin-Hao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure and method
- Patent number 12,199,051
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,159,839
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having hollow cylinders and method of fabricating...
- Patent number 12,159,851
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and the methods of manufacturing
- Patent number 12,142,597
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimension large system integration
- Patent number 12,136,612
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,125,804
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure having a side recess and semiconductor structure inc...
- Patent number 12,087,718
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an integrated fan-out package having fan-ou...
- Patent number 12,080,615
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 12,074,143
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with thick RDLs and thin RDLs stacked alternatingly
- Patent number 12,057,405
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method of package structure the...
- Patent number 12,051,666
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure comprising rigid-flexible substrate...
- Patent number 12,040,281
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure including a silicon substrate interposer and...
- Patent number 12,014,976
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor packages
- Patent number 12,014,979
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 12,009,281
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages having support rings
- Patent number 11,990,381
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Rong Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,961,810
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE CONNECTED...
- Publication number 20250239528
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20250219010
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH THERMAL RELAXATION BLOCK AND MANUFACTURI...
- Publication number 20250183245
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CROSS-WAFER RDLS IN CONSTRUCTED WAFERS
- Publication number 20250183058
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System, Device and Methods of Manufacture
- Publication number 20250140610
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE AND METHOD
- Publication number 20250096163
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, CIRCUIT BOARD STRUCTURE AND MANUFACTURING MET...
- Publication number 20250096198
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tin-Hao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING PACKAGE STRUCTURE HAVING HOLLOW CYLINDERS
- Publication number 20250087615
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IPD MODULES WITH FLEXIBLE CONNECTION SCHEME IN PACKAGING
- Publication number 20240405005
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240395721
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PASSIVE DEVICES ON ACTIVE DIES TO FORM 3D PACKAGES
- Publication number 20240395769
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE WITH THERMAL RELAXATI...
- Publication number 20240387498
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSION LARGE SYSTEM INTEGRATION
- Publication number 20240379637
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20240371726
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Rong Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371795
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN INTEGRATED FAN-OUT PACKAGE HAVING FAN-OU...
- Publication number 20240363463
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20240363591
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES WITH THICK RDLS AND THIN RDLS STACKED ALTERNATINGLY
- Publication number 20240355754
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE STRUCTURE AND PACKAGE STRUCTURE THE...
- Publication number 20240339427
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE COMPRISING RIGID-FLEXIBLE SUBSTRATE...
- Publication number 20240321757
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR PACKAGES
- Publication number 20240297114
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE INCLUDING A SILICON SUBSTRATE INTERPOSER AND...
- Publication number 20240290703
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo-Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240170414
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Hsien Chiang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Cross-Wafer RDLs in Constructed Wafers
- Publication number 20240145257
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chamfered Die of Semiconductor Package and Method for Forming the Same
- Publication number 20240088050
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE
- Publication number 20240071981
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System, Device and Methods of Manufacture
- Publication number 20240071825
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230378098
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH THERMAL RELAXATION BLOCK AND MANUFACTURI...
- Publication number 20230378151
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IPD Modules with Flexible Connection Scheme in Packaging
- Publication number 20230369303
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS

Tin-Hao Kuo

Person

Patents Grantslast 30 patents

IPD modules with flexible connection scheme in packaging

Package and method for manufacturing the same

Chip package and method of forming the same

Semiconductor device having a heat dissipation structure connected...

Integrated circuit package and method

Method of fabricating semiconductor structure including a barrier s...

Semiconductor package

Bonding passive devices on active dies to form 3D packages

Semiconductor package with thermal relaxation block and manufacturi...

Semiconductor packages and methods of forming the same

Cross-wafer RDLs in constructed wafers

System, device and methods of manufacture

Semiconductor device, circuit board structure and manufacturing met...

Integrated circuit structure and method

Semiconductor packages

Package structure having hollow cylinders and method of fabricating...

Integrated fan-out package and the methods of manufacturing

Three-dimension large system integration

Semiconductor package and manufacturing method thereof

Bump structure having a side recess and semiconductor structure inc...

Method of manufacturing an integrated fan-out package having fan-ou...

Integrated circuit package and method

Packages with thick RDLs and thin RDLs stacked alternatingly

Package structure and manufacturing method of package structure the...

Semiconductor package structure comprising rigid-flexible substrate...

Chip package structure including a silicon substrate interposer and...

Methods of forming semiconductor packages

Package structure and method of manufacturing the same

Integrated circuit packages having support rings

Solderless interconnection structure and method of forming same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE CONNECTED...

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR PACKAGE WITH THERMAL RELAXATION BLOCK AND MANUFACTURI...

CROSS-WAFER RDLS IN CONSTRUCTED WAFERS

System, Device and Methods of Manufacture

INTEGRATED CIRCUIT STRUCTURE AND METHOD

SEMICONDUCTOR DEVICE, CIRCUIT BOARD STRUCTURE AND MANUFACTURING MET...

METHOD OF FABRICATING PACKAGE STRUCTURE HAVING HOLLOW CYLINDERS

IPD MODULES WITH FLEXIBLE CONNECTION SCHEME IN PACKAGING

SEMICONDUCTOR PACKAGES

BONDING PASSIVE DEVICES ON ACTIVE DIES TO FORM 3D PACKAGES

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE WITH THERMAL RELAXATI...

THREE-DIMENSION LARGE SYSTEM INTEGRATION

Integrated Circuit Package and Method

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

METHOD OF MANUFACTURING AN INTEGRATED FAN-OUT PACKAGE HAVING FAN-OU...

INTEGRATED CIRCUIT PACKAGE AND METHOD

PACKAGES WITH THICK RDLS AND THIN RDLS STACKED ALTERNATINGLY

MANUFACTURING METHOD OF PACKAGE STRUCTURE AND PACKAGE STRUCTURE THE...

SEMICONDUCTOR PACKAGE STRUCTURE COMPRISING RIGID-FLEXIBLE SUBSTRATE...

METHODS OF FORMING SEMICONDUCTOR PACKAGES

CHIP PACKAGE STRUCTURE INCLUDING A SILICON SUBSTRATE INTERPOSER AND...

SEMICONDUCTOR PACKAGE

Cross-Wafer RDLs in Constructed Wafers

Chamfered Die of Semiconductor Package and Method for Forming the Same

METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE

System, Device and Methods of Manufacture

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE WITH THERMAL RELAXATION BLOCK AND MANUFACTURI...

IPD Modules with Flexible Connection Scheme in Packaging