Ting-Yu Shen

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Nantou, TW

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Patents Grantslast 30 patents

Information Patent Grant
Carbonization of metal caps
- Patent number 9,385,034
- Issue date Jul 5, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Lin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-k interconnect structures with reduced RC delay
- Patent number 9,087,877
- Issue date Jul 21, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Chi Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device
- Patent number 8,324,731
- Issue date Dec 4, 2012
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- A44 - HABERDASHERY JEWELLERY
Information Patent Grant
Interconnect structure having a silicide/germanide cap layer
- Patent number 8,143,162
- Issue date Mar 27, 2012
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pads and methods for fabricating the same
- Patent number 7,646,097
- Issue date Jan 12, 2010
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for modulating stresses of a contact etch stop layer
- Patent number 7,629,273
- Issue date Dec 8, 2009
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Integrated circuit device
- Publication number 20100065969
- Publication date Mar 18, 2010
- Chen-Hua Yu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Interconnect Structure Having a Silicide/Germanide Cap Layer
- Publication number 20090275195
- Publication date Nov 5, 2009
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carbonization of metal caps
- Publication number 20080251928
- Publication date Oct 16, 2008
- Hui-Lin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low-k interconnect structures with reduced RC delay
- Publication number 20080096380
- Publication date Apr 24, 2008
- Chung-Chi Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for modulating stresses of a contact etch stop layer
- Publication number 20080085607
- Publication date Apr 10, 2008
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond pads and methods for fabricating the same
- Publication number 20070080460
- Publication date Apr 12, 2007
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL