Ting Zhong

Person

Tigard, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Solder contacts for socket assemblies
- Patent number 10,321,573
- Issue date Jun 11, 2019
- Intel Corporation
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect alloy material and methods
- Patent number 10,099,307
- Issue date Oct 16, 2018
- Intel Corporation
- Ting Zhong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder contacts for socket assemblies
- Patent number 9,860,988
- Issue date Jan 2, 2018
- Intel Corporation
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid metal interconnects
- Patent number 9,835,648
- Issue date Dec 5, 2017
- Intel Corporation
- Rajashree Baskaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect alloy material and methods
- Patent number 9,731,369
- Issue date Aug 15, 2017
- Intel Corporation
- Ting Zhong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnects including liquid metal
- Patent number 9,523,713
- Issue date Dec 20, 2016
- Intel Corporation
- Youngseok Oh
- G01 - MEASURING TESTING
Information Patent Grant
Magnetic attachment structure
- Patent number 9,010,618
- Issue date Apr 21, 2015
- Intel Corporation
- Aleksandar Aleksov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Magnetic attachment structure
- Patent number 8,434,668
- Issue date May 7, 2013
- Intel Corporation
- Aleksandar Aleksov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper die bumps with electromigration cap and plated solder
- Patent number 7,919,859
- Issue date Apr 5, 2011
- Intel Corporation
- Ting Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming a barrier layer in interconnect joints and structures forme...
- Patent number 7,416,980
- Issue date Aug 26, 2008
- Intel Corporation
- Ting Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capping copper bumps
- Patent number 7,391,112
- Issue date Jun 24, 2008
- Intel Corporation
- Jianxing Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to deposit metal alloy barrier layers
- Patent number 7,223,695
- Issue date May 29, 2007
- Intel Corporation
- Ting Zhong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Preparation of electroless deposition solutions
- Patent number 7,087,104
- Issue date Aug 8, 2006
- Intel Corporation
- Hok-Kin Choi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SOLDER CONTACTS FOR SOCKET ASSEMBLIES
- Publication number 20180192519
- Publication date Jul 5, 2018
- Intel Corporation
- Fay HUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT ALLOY MATERIAL AND METHODS
- Publication number 20170361390
- Publication date Dec 21, 2017
- Intel Corporation
- Ting Zhong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER CONTACTS FOR SOCKET ASSEMBLIES
- Publication number 20160338199
- Publication date Nov 17, 2016
- Intel Corporation
- Fay HUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTS INCLUDING LIQUID METAL
- Publication number 20140354318
- Publication date Dec 4, 2014
- Youngseok Oh
- G01 - MEASURING TESTING
Information Patent Application
INTERCONNECT ALLOY MATERIAL AND METHODS
- Publication number 20140263588
- Publication date Sep 18, 2014
- Ting Zhong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MAGNETIC ATTACHMENT STRUCTURE
- Publication number 20130224444
- Publication date Aug 29, 2013
- Aleksandar Aleksov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID METAL INTERCONNECTS
- Publication number 20130000117
- Publication date Jan 3, 2013
- Rajashree Baskaran
- G01 - MEASURING TESTING
Information Patent Application
MAGNETIC ATTACHMENT STRUCTURE
- Publication number 20110278044
- Publication date Nov 17, 2011
- Aleksandar Aleksov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Copper die bumps with electromigration cap and plated solder
- Publication number 20080230896
- Publication date Sep 25, 2008
- Ting Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID ELECTRO-DEPOSITION OF SOFT MAGNETIC COBALT ALLOY FILMS
- Publication number 20080202922
- Publication date Aug 28, 2008
- Ting Zhong
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Iridium encased metal interconnects for integrated circuit applicat...
- Publication number 20080045013
- Publication date Feb 21, 2008
- Adrien R. Lavoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING A BARRIER LAYER IN JOINT STRUCTURES
- Publication number 20070123025
- Publication date May 31, 2007
- Ting Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper bump barrier cap to reduce electrical resistance
- Publication number 20070045833
- Publication date Mar 1, 2007
- Ting Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capping copper bumps
- Publication number 20060276022
- Publication date Dec 7, 2006
- Jianxing Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming a barrier layer in interconnect joints and structures forme...
- Publication number 20060205234
- Publication date Sep 14, 2006
- Ting Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods to deposit metal alloy barrier layers
- Publication number 20060071340
- Publication date Apr 6, 2006
- Ting Zhong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Preparation of electroless deposition solutions
- Publication number 20040265501
- Publication date Dec 30, 2004
- Intel Corporation
- Hok-Kin Choi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Person

Patents Grantslast 30 patents

Solder contacts for socket assemblies

Interconnect alloy material and methods

Solder contacts for socket assemblies

Liquid metal interconnects

Interconnect alloy material and methods

Interconnects including liquid metal

Magnetic attachment structure

Magnetic attachment structure

Copper die bumps with electromigration cap and plated solder

Forming a barrier layer in interconnect joints and structures forme...

Capping copper bumps

Methods to deposit metal alloy barrier layers

Preparation of electroless deposition solutions

Patents Applicationslast 30 patents

SOLDER CONTACTS FOR SOCKET ASSEMBLIES

INTERCONNECT ALLOY MATERIAL AND METHODS

SOLDER CONTACTS FOR SOCKET ASSEMBLIES

INTERCONNECTS INCLUDING LIQUID METAL

INTERCONNECT ALLOY MATERIAL AND METHODS

MAGNETIC ATTACHMENT STRUCTURE

LIQUID METAL INTERCONNECTS

MAGNETIC ATTACHMENT STRUCTURE

Copper die bumps with electromigration cap and plated solder

HYBRID ELECTRO-DEPOSITION OF SOFT MAGNETIC COBALT ALLOY FILMS

Iridium encased metal interconnects for integrated circuit applicat...

FORMING A BARRIER LAYER IN JOINT STRUCTURES

Copper bump barrier cap to reduce electrical resistance

Capping copper bumps

Forming a barrier layer in interconnect joints and structures forme...

Methods to deposit metal alloy barrier layers

Preparation of electroless deposition solutions