Todd P. Albertson

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Probe pins with etched tips for electrical die test
- Patent number 11,340,258
- Issue date May 24, 2022
- Intel Corporation
- Joseph D. Stanford
- G01 - MEASURING TESTING
Information Patent Grant
Probe head and electronic device testing system
- Patent number 11,112,430
- Issue date Sep 7, 2021
- Intel Corporation
- Anil Kaza
- G01 - MEASURING TESTING
Information Patent Grant
Probe pins with etched tips for electrical die test
- Patent number 10,598,696
- Issue date Mar 24, 2020
- Intel Corporation
- Joseph D. Stanford
- G01 - MEASURING TESTING
Information Patent Grant
Probes for wafer sorting
- Patent number 10,578,647
- Issue date Mar 3, 2020
- Intel Corporation
- Todd Albertson
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Etching for probe wire tips for microelectronic device test
- Patent number 9,977,054
- Issue date May 22, 2018
- Intel Corporation
- Todd P. Albertson
- G01 - MEASURING TESTING
Information Patent Grant
Probe tip formation for die sort and test
- Patent number 9,823,273
- Issue date Nov 21, 2017
- Intel Corporation
- Keith J. Martin
- G01 - MEASURING TESTING
Information Patent Grant
Organic space transformer attachment and assembly
- Patent number 9,581,639
- Issue date Feb 28, 2017
- Intel Corporation
- Jin Yang
- G01 - MEASURING TESTING
Information Patent Grant
Anti-rotation for wire probes in a probe head of a die tester
- Patent number 9,535,095
- Issue date Jan 3, 2017
- Intel Corporation
- David Shia
- G01 - MEASURING TESTING
Information Patent Grant
Composite wire probe test assembly
- Patent number 9,354,273
- Issue date May 31, 2016
- Intel Corporation
- Kip Stevenson
- G01 - MEASURING TESTING
Information Patent Grant
Mechanism for facilitating modular processing cell framework and ap...
- Patent number 9,279,854
- Issue date Mar 8, 2016
- Intel Corporation
- John C. Johnson
- G01 - MEASURING TESTING
Information Patent Grant
Micro positioning test socket and methods for active precision alig...
- Patent number 9,255,945
- Issue date Feb 9, 2016
- Intel Corporation
- Abram M Detofsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite wire probes for testing integrated circuits
- Patent number 9,207,258
- Issue date Dec 8, 2015
- Intel Corporation
- David Shia
- G01 - MEASURING TESTING
Information Patent Grant
Sort probe gripper
- Patent number 9,134,343
- Issue date Sep 15, 2015
- Intel Corporation
- David Shia
- G01 - MEASURING TESTING
Information Patent Grant
Wire probe assembly and forming process for die testing
- Patent number 9,069,014
- Issue date Jun 30, 2015
- Intel Corporation
- Todd P. Albertson
- G01 - MEASURING TESTING
Information Patent Grant
Thermal interface for multi-chip packages
- Patent number 8,891,235
- Issue date Nov 18, 2014
- Intel Corporation
- Joseph F. Walczyk
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Micro positioning test socket and methods for active precision alig...
- Patent number 8,710,858
- Issue date Apr 29, 2014
- Intel Corporation
- Abram M Detofsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Temperature and voltage controlled integrated circuit processes
- Patent number 7,345,495
- Issue date Mar 18, 2008
- Intel Corporation
- Daniel J. Dangelo
- G01 - MEASURING TESTING
Information Patent Grant
Anticyclone powered active thermal control unit
- Patent number 6,360,544
- Issue date Mar 26, 2002
- Intel Corporation
- Todd P. Albertson
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...

Patents Applicationslast 30 patents

Information Patent Application
PROBE HEAD AND ELECTRONIC DEVICE TESTING SYSTEM
- Publication number 20200309818
- Publication date Oct 1, 2020
- Anil Kaza
- G01 - MEASURING TESTING
Information Patent Application
PROBE PINS WITH ETCHED TIPS FOR ELECTRICAL DIE TEST
- Publication number 20200209280
- Publication date Jul 2, 2020
- Intel Corporation
- Joseph D. Stanford
- G01 - MEASURING TESTING
Information Patent Application
PROBES FOR WAFER SORTING
- Publication number 20190101569
- Publication date Apr 4, 2019
- Intel Corporation
- Todd Albertson
- G01 - MEASURING TESTING
Information Patent Application
PROBE PINS WITH ETCHED TIPS FOR ELECTRICAL DIE TEST
- Publication number 20170276700
- Publication date Sep 28, 2017
- Joseph D. Stanford
- G01 - MEASURING TESTING
Information Patent Application
ETCHING FOR PROBE WIRE TIPS FOR MICROELECTRONIC DEVICE TEST
- Publication number 20160363613
- Publication date Dec 15, 2016
- Intel Corporation
- TODD P. ALBERTSON
- G01 - MEASURING TESTING
Information Patent Application
COMPOSITE WIRE PROBE TEST ASSEMBLY
- Publication number 20160274148
- Publication date Sep 22, 2016
- Intel Corporation
- Kip Stevenson
- G01 - MEASURING TESTING
Information Patent Application
FORMED WIRE PROBE INTERCONNECT FOR TEST DIE CONTACTOR
- Publication number 20160178663
- Publication date Jun 23, 2016
- Intel Corporation
- Mohanraj Prabhugoud
- G01 - MEASURING TESTING
Information Patent Application
ORGANIC SPACE TRANSFORMER ATTACHMENT AND ASSEMBLY
- Publication number 20150185252
- Publication date Jul 2, 2015
- Jin YANG
- G01 - MEASURING TESTING
Information Patent Application
ANTI-ROTATION FOR WIRE PROBES IN A PROBE HEAD OF A DIE TESTER
- Publication number 20150061713
- Publication date Mar 5, 2015
- David Shia
- G01 - MEASURING TESTING
Information Patent Application
PROBE TIP FORMATION FOR DIE SORT AND TEST
- Publication number 20150002181
- Publication date Jan 1, 2015
- Keith J. Martin
- G01 - MEASURING TESTING
Information Patent Application
MICRO POSITIONING TEST SOCKET AND METHODS FOR ACTIVE PRECISION ALIG...
- Publication number 20140218061
- Publication date Aug 7, 2014
- Abram M. Detofsky
- G01 - MEASURING TESTING
Information Patent Application
MECHANISM FOR FACILITATING MODULAR PROCESSING CELL FRAMEWORK AND AP...
- Publication number 20140184255
- Publication date Jul 3, 2014
- JOHN C. JOHNSON
- G01 - MEASURING TESTING
Information Patent Application
COMPOSITE WIRE PROBE TEST ASSEMBLY
- Publication number 20140176172
- Publication date Jun 26, 2014
- Kip Stevenson
- G01 - MEASURING TESTING
Information Patent Application
COMPOSITE WIRE PROBES FOR TESTING INTEGRATED CIRCUITS
- Publication number 20140091821
- Publication date Apr 3, 2014
- David Shia
- G01 - MEASURING TESTING
Information Patent Application
Sort Probe Gripper
- Publication number 20140091828
- Publication date Apr 3, 2014
- David Shia
- G01 - MEASURING TESTING
Information Patent Application
THERMAL INTERFACE FOR MULTI-CHIP PACKAGES
- Publication number 20140002994
- Publication date Jan 2, 2014
- Joseph F. Walczyk
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Wire Probe Assembly and Forming Process for Die Testing
- Publication number 20140002124
- Publication date Jan 2, 2014
- Todd P. Albertson
- G01 - MEASURING TESTING
Information Patent Application
APPARATUS AND METHOD FOR AUTOMATED SORT PROBE ASSEMBLY AND REPAIR
- Publication number 20130269173
- Publication date Oct 17, 2013
- Todd P. Albertson
- G01 - MEASURING TESTING
Information Patent Application
MICRO POSITIONING TEST SOCKET AND METHODS FOR ACTIVE PRECISION ALIG...
- Publication number 20120074975
- Publication date Mar 29, 2012
- Abram M. Detofsky
- G01 - MEASURING TESTING
Information Patent Application
Temperature and voltage controlled integrated circuit processes
- Publication number 20060002161
- Publication date Jan 5, 2006
- Daniel J. Dangelo
- G01 - MEASURING TESTING

Todd P. Albertson

Person

Patents Grantslast 30 patents

Probe pins with etched tips for electrical die test

Probe head and electronic device testing system

Probe pins with etched tips for electrical die test

Probes for wafer sorting

Etching for probe wire tips for microelectronic device test

Probe tip formation for die sort and test

Organic space transformer attachment and assembly

Anti-rotation for wire probes in a probe head of a die tester

Composite wire probe test assembly

Mechanism for facilitating modular processing cell framework and ap...

Micro positioning test socket and methods for active precision alig...

Composite wire probes for testing integrated circuits

Sort probe gripper

Wire probe assembly and forming process for die testing

Thermal interface for multi-chip packages

Micro positioning test socket and methods for active precision alig...

Temperature and voltage controlled integrated circuit processes

Anticyclone powered active thermal control unit

Patents Applicationslast 30 patents

PROBE HEAD AND ELECTRONIC DEVICE TESTING SYSTEM

PROBE PINS WITH ETCHED TIPS FOR ELECTRICAL DIE TEST

PROBES FOR WAFER SORTING

PROBE PINS WITH ETCHED TIPS FOR ELECTRICAL DIE TEST

ETCHING FOR PROBE WIRE TIPS FOR MICROELECTRONIC DEVICE TEST

COMPOSITE WIRE PROBE TEST ASSEMBLY

FORMED WIRE PROBE INTERCONNECT FOR TEST DIE CONTACTOR

ORGANIC SPACE TRANSFORMER ATTACHMENT AND ASSEMBLY

ANTI-ROTATION FOR WIRE PROBES IN A PROBE HEAD OF A DIE TESTER

PROBE TIP FORMATION FOR DIE SORT AND TEST

MICRO POSITIONING TEST SOCKET AND METHODS FOR ACTIVE PRECISION ALIG...

MECHANISM FOR FACILITATING MODULAR PROCESSING CELL FRAMEWORK AND AP...

COMPOSITE WIRE PROBE TEST ASSEMBLY

COMPOSITE WIRE PROBES FOR TESTING INTEGRATED CIRCUITS

Sort Probe Gripper

THERMAL INTERFACE FOR MULTI-CHIP PACKAGES

Wire Probe Assembly and Forming Process for Die Testing

APPARATUS AND METHOD FOR AUTOMATED SORT PROBE ASSEMBLY AND REPAIR

MICRO POSITIONING TEST SOCKET AND METHODS FOR ACTIVE PRECISION ALIG...

Temperature and voltage controlled integrated circuit processes