Todd R. YOUNKIN

Person

Cary, NC, US

People

Patents Grantslast 30 patents

Information Patent Grant
Maskless air gap to prevent via punch through
- Patent number 10,971,394
- Issue date Apr 6, 2021
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Triblock copolymers for self-aligning vias or contacts
- Patent number 10,950,501
- Issue date Mar 16, 2021
- Intel Corporation
- Todd R. Younkin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-pass patterning using nonreflecting radiation lithography on...
- Patent number 10,678,137
- Issue date Jun 9, 2020
- Intel Corporation
- Manish Chandhok
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Materials and deposition schemes using photoactive materials for in...
- Patent number 10,269,622
- Issue date Apr 23, 2019
- Intel Corporation
- Rami Hourani
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Maskless air gap to prevent via punch through
- Patent number 10,256,141
- Issue date Apr 9, 2019
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for creating alternate hardmask cap interconnect structure w...
- Patent number 10,109,583
- Issue date Oct 23, 2018
- Intel Corporation
- Robert L. Bristol
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MASKLESS AIR GAP TO PREVENT VIA PUNCH THROUGH
- Publication number 20190189500
- Publication date Jun 20, 2019
- Intel Corporation
- Manish CHANDHOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRIBLOCK COPOLYMERS FOR SELF-ALIGNING VIAS OR CONTACTS
- Publication number 20180323104
- Publication date Nov 8, 2018
- Intel Corporation
- Todd R. YOUNKIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PITCH DIVISION USING DIRECTED SELF-ASSEMBLY
- Publication number 20180323078
- Publication date Nov 8, 2018
- Intel Corporation
- Stephanie A. BOJARSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASKLESS AIR GAP TO PREVENT VIA PUNCH THROUGH
- Publication number 20180204760
- Publication date Jul 19, 2018
- Intel Corporation
- Manish CHANDHOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTODEFINABLE ALIGNMENT LAYER FOR CHEMICAL ASSISTED PATTERNING
- Publication number 20170345643
- Publication date Nov 30, 2017
- Intel Corporation
- Todd R. YOUNKIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATERIALS AND DEPOSITION SCHEMES USING PHOTOACTIVE MATERIALS FOR IN...
- Publication number 20170263496
- Publication date Sep 14, 2017
- Intel Corporation
- RAMI HOURANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL METHOD FOR CREATING ALTERNATE HARDMASK CAP INTERCONNECT STRUC...
- Publication number 20170263551
- Publication date Sep 14, 2017
- Intel Corporation
- ROBERT L. BRISTOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-PASS PATTERNING USING NONREFLECTING RADIATION LITHOGRAPHY ON...
- Publication number 20170235228
- Publication date Aug 17, 2017
- Intel Corporation
- Manish CHANDHOK
- H01 - BASIC ELECTRIC ELEMENTS

Todd R. YOUNKIN

Person

Patents Grantslast 30 patents

Maskless air gap to prevent via punch through

Triblock copolymers for self-aligning vias or contacts

Multi-pass patterning using nonreflecting radiation lithography on...

Materials and deposition schemes using photoactive materials for in...

Maskless air gap to prevent via punch through

Method for creating alternate hardmask cap interconnect structure w...

Patents Applicationslast 30 patents

MASKLESS AIR GAP TO PREVENT VIA PUNCH THROUGH

TRIBLOCK COPOLYMERS FOR SELF-ALIGNING VIAS OR CONTACTS

PITCH DIVISION USING DIRECTED SELF-ASSEMBLY

MASKLESS AIR GAP TO PREVENT VIA PUNCH THROUGH

PHOTODEFINABLE ALIGNMENT LAYER FOR CHEMICAL ASSISTED PATTERNING

MATERIALS AND DEPOSITION SCHEMES USING PHOTOACTIVE MATERIALS FOR IN...

NOVEL METHOD FOR CREATING ALTERNATE HARDMASK CAP INTERCONNECT STRUC...

MULTI-PASS PATTERNING USING NONREFLECTING RADIATION LITHOGRAPHY ON...