Tohru Fujinawa

Person

Ibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Adhesive composition, circuit connecting material, connection struc...
- Patent number 8,696,942
- Issue date Apr 15, 2014
- Hitachi Chemical Company, Ltd.
- Shigeki Katogi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Circuit connection material, circuit member connecting structure an...
- Patent number 8,558,118
- Issue date Oct 15, 2013
- Hitachi Chemical Company, Ltd.
- Motohiro Arifuku
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Circuit connection material, circuit member connecting structure an...
- Patent number 8,541,688
- Issue date Sep 24, 2013
- Hitachi Chemical Company, Ltd.
- Motohiro Arifuku
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive composition, circuit connecting material, connection struc...
- Patent number 8,518,303
- Issue date Aug 27, 2013
- Hitachi Chemical Company, Ltd.
- Shigeki Katogi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Circuit connection material, circuit member connecting structure an...
- Patent number 8,497,431
- Issue date Jul 30, 2013
- Hitachi Chemical Company, Ltd.
- Motohiro Arifuku
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Circuit-connecting material and circuit terminal connected structur...
- Patent number 8,142,605
- Issue date Mar 27, 2012
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Wiring terminal-connecting adhesive
- Patent number 8,120,189
- Issue date Feb 21, 2012
- Hitachi Chemical Company, Ltd.
- Motohiro Arifuku
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive, method of connecting wiring terminals and wiring structure
- Patent number 8,115,322
- Issue date Feb 14, 2012
- Hitachi Chemical Company, Ltd.
- Motohiro Arifuku
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive for circuit connection, circuit connection method using th...
- Patent number 8,029,911
- Issue date Oct 4, 2011
- Hitachi Chemical Company, Ltd.
- Satoyuki Nomura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Circuit-connecting material and circuit terminal connected structur...
- Patent number 7,968,196
- Issue date Jun 28, 2011
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Circuit-connecting material and circuit terminal connected structur...
- Patent number 7,967,943
- Issue date Jun 28, 2011
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Circuit-connecting material and circuit terminal connected structur...
- Patent number 7,879,956
- Issue date Feb 1, 2011
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Wiring structure having a wiring-terminal-connecting adhesive compr...
- Patent number 7,777,335
- Issue date Aug 17, 2010
- Hitachi Chemical Company, Ltd.
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit-connecting material and circuit terminal connected structur...
- Patent number 7,629,050
- Issue date Dec 8, 2009
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Circuit-connecting material and circuit terminal connected structur...
- Patent number 7,629,056
- Issue date Dec 8, 2009
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Circuit-connecting material and circuit terminal connected structur...
- Patent number 7,618,713
- Issue date Nov 17, 2009
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Electronic circuit including circuit-connecting material
- Patent number 7,604,868
- Issue date Oct 20, 2009
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Circuit-connecting material and circuit terminal connected structur...
- Patent number 7,553,890
- Issue date Jun 30, 2009
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive, method of connecting wiring terminals and wiring structure
- Patent number 7,241,644
- Issue date Jul 10, 2007
- Hitachi Chemical Company, Ltd.
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive for circuit connection, circuit connection method using th...
- Patent number 7,208,105
- Issue date Apr 24, 2007
- Hitachi Chemical Co., Ltd.
- Satoyuki Nomura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Wiring-connecting material and wiring-connected board production pr...
- Patent number 7,141,645
- Issue date Nov 28, 2006
- Hitachi Chemical Company, Ltd.
- Tohru Fujinawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive agent, method of connecting wiring terminals and wiring st...
- Patent number 6,939,913
- Issue date Sep 6, 2005
- Hitachi Chemical Company, Ltd.
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit connecting material, and structure and method of connecting...
- Patent number 6,777,464
- Issue date Aug 17, 2004
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Wiring-connecting material and process for producing circuit board...
- Patent number 6,762,249
- Issue date Jul 13, 2004
- Hitachi Chemical Company, Ltd.
- Tohru Fujinawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTION STRUC...
- Publication number 20120273974
- Publication date Nov 1, 2012
- HITACHI CHEMICAL CO., Ltd.
- Shigeki Katogi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CIRCUIT CONNECTING MATERIAL, FILM-LIKE CIRCUIT CONNECTING MATERIAL...
- Publication number 20120138868
- Publication date Jun 7, 2012
- Hitachi Chemical Company, Ltd.
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANISOTROPIC CONDUCTIVE PARTICLES
- Publication number 20120097902
- Publication date Apr 26, 2012
- Hitachi Chemical Company, Ltd.
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL AND CONNECTING ST...
- Publication number 20120085579
- Publication date Apr 12, 2012
- Hitachi Chemical Company, Ltd.
- Takashi Tatsuzawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE MATERIAL REEL
- Publication number 20120015126
- Publication date Jan 19, 2012
- Hitachi Chemical Company, Ltd.
- Takashi Tatsuzawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE MATERIAL REEL
- Publication number 20110300326
- Publication date Dec 8, 2011
- Hitachi Chemical Company, Ltd.
- Takashi Tatsuzawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTED STRUCTUR...
- Publication number 20110114893
- Publication date May 19, 2011
- HITACHI CHEMICAL CO., Ltd.
- Itsuo Watanabe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE, METHOD OF CONNECTING WIRING TERMINALS AND WIRING STRUCTURE
- Publication number 20100330364
- Publication date Dec 30, 2010
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE, METHOD OF CONNECTING WIRING TERMINALS AND WIRING STRUCTURE
- Publication number 20100326596
- Publication date Dec 30, 2010
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE FOR CIRCUIT CONNECTION, CIRCUIT CONNECTION METHOD USING TH...
- Publication number 20100294551
- Publication date Nov 25, 2010
- Satoyuki Nomura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
WIRING-CONNECTING MATERIAL AND WIRING-CONNECTED BOARD PRODUCTION PR...
- Publication number 20100265685
- Publication date Oct 21, 2010
- Tohru Fujinawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CIRCUIT CONNECTION MATERIAL, CIRCUIT MEMBER CONNECTING STRUCTURE AN...
- Publication number 20100212943
- Publication date Aug 26, 2010
- Hitachi Chemical Company, Ltd.
- Motohiro Arifuku
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CIRCUIT CONNECTION MATERIAL, CIRCUIT MEMBER CONNECTING STRUCTURE AN...
- Publication number 20100208444
- Publication date Aug 19, 2010
- Hitachi Chemical Company, Ltd.
- Motohiro Arifuku
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CIRCUIT CONNECTION MATERIAL, CIRCUIT MEMBER CONNECTING STRUCTURE AN...
- Publication number 20100108365
- Publication date May 6, 2010
- Hitachi Chemical Company, Ltd.
- Motohiro Arifuku
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTION STRUC...
- Publication number 20090309220
- Publication date Dec 17, 2009
- Hitachi Chemical Co., Ltd.
- Shigeki Katogi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE, METHOD OF CONNECTING WIRING TERMINALS AND WIRING STRUCTURE
- Publication number 20090101279
- Publication date Apr 23, 2009
- Motohiro Arifuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTED STRUCTUR...
- Publication number 20080064233
- Publication date Mar 13, 2008
- HITACHI CHEMICAL CO., Ltd.
- Itsuo Watanabe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTED STRUCTUR...
- Publication number 20080054225
- Publication date Mar 6, 2008
- HITACHI CHEMICAL CO., Ltd.
- Itsuo Watanabe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTED STRUCTUR...
- Publication number 20080057742
- Publication date Mar 6, 2008
- HITACHI CHEMICAL CO., Ltd.
- Itsuo Watanabe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTED STRUCTUR...
- Publication number 20070299172
- Publication date Dec 27, 2007
- HITACHI CHEMICAL CO., Ltd.
- Itsuo Watanabe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive for circuit connection, circuit connection method using th...
- Publication number 20070166549
- Publication date Jul 19, 2007
- Satoyuki Nomura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Wiring-connecting material and wiring-connected board production pr...
- Publication number 20060252843
- Publication date Nov 9, 2006
- Tohru Fujinawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Electronic circuit including circuit-connecting material
- Publication number 20060060969
- Publication date Mar 23, 2006
- Hitachi Chemical Co., Ltd.
- Itsuo Watanabe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Circuit-connecting material and circuit terminal connected structur...
- Publication number 20060063366
- Publication date Mar 23, 2006
- HITACHI CHEMICAL CO., Ltd.
- Itsuo Watanabe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Circuit-connecting material and circuit terminal connected structur...
- Publication number 20060014860
- Publication date Jan 19, 2006
- Hitachi Chemical Co., Ltd.
- Itsuo Watanabe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive, method of connecting wiring terminals and wiring structure
- Publication number 20050178502
- Publication date Aug 18, 2005
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Adhesive, method of connecting wiring terminals and wiring structure
- Publication number 20050176882
- Publication date Aug 11, 2005
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit-connecting material and circuit terminal connected structur...
- Publication number 20040222408
- Publication date Nov 11, 2004
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Wiring-connecting material and wiring-connected board production pr...
- Publication number 20040214979
- Publication date Oct 28, 2004
- Tohru Fujinawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive for circuit connection , circuit connection method using t...
- Publication number 20030141014
- Publication date Jul 31, 2003
- Nomura Satoyuki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Tohru Fujinawa

Person

Patents Grantslast 30 patents

Adhesive composition, circuit connecting material, connection struc...

Circuit connection material, circuit member connecting structure an...

Circuit connection material, circuit member connecting structure an...

Adhesive composition, circuit connecting material, connection struc...

Circuit connection material, circuit member connecting structure an...

Circuit-connecting material and circuit terminal connected structur...

Wiring terminal-connecting adhesive

Adhesive, method of connecting wiring terminals and wiring structure

Adhesive for circuit connection, circuit connection method using th...

Circuit-connecting material and circuit terminal connected structur...

Circuit-connecting material and circuit terminal connected structur...

Circuit-connecting material and circuit terminal connected structur...

Wiring structure having a wiring-terminal-connecting adhesive compr...

Circuit-connecting material and circuit terminal connected structur...

Circuit-connecting material and circuit terminal connected structur...

Circuit-connecting material and circuit terminal connected structur...

Electronic circuit including circuit-connecting material

Circuit-connecting material and circuit terminal connected structur...

Adhesive, method of connecting wiring terminals and wiring structure

Adhesive for circuit connection, circuit connection method using th...

Wiring-connecting material and wiring-connected board production pr...

Adhesive agent, method of connecting wiring terminals and wiring st...

Circuit connecting material, and structure and method of connecting...

Wiring-connecting material and process for producing circuit board...

Patents Applicationslast 30 patents

ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTION STRUC...

CIRCUIT CONNECTING MATERIAL, FILM-LIKE CIRCUIT CONNECTING MATERIAL...

ANISOTROPIC CONDUCTIVE PARTICLES

ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL AND CONNECTING ST...

ADHESIVE MATERIAL REEL

ADHESIVE MATERIAL REEL

CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTED STRUCTUR...

ADHESIVE, METHOD OF CONNECTING WIRING TERMINALS AND WIRING STRUCTURE

ADHESIVE, METHOD OF CONNECTING WIRING TERMINALS AND WIRING STRUCTURE

ADHESIVE FOR CIRCUIT CONNECTION, CIRCUIT CONNECTION METHOD USING TH...

WIRING-CONNECTING MATERIAL AND WIRING-CONNECTED BOARD PRODUCTION PR...

CIRCUIT CONNECTION MATERIAL, CIRCUIT MEMBER CONNECTING STRUCTURE AN...

CIRCUIT CONNECTION MATERIAL, CIRCUIT MEMBER CONNECTING STRUCTURE AN...

CIRCUIT CONNECTION MATERIAL, CIRCUIT MEMBER CONNECTING STRUCTURE AN...

ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTION STRUC...

ADHESIVE, METHOD OF CONNECTING WIRING TERMINALS AND WIRING STRUCTURE

CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTED STRUCTUR...

CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTED STRUCTUR...

CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTED STRUCTUR...

CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTED STRUCTUR...

Adhesive for circuit connection, circuit connection method using th...

Wiring-connecting material and wiring-connected board production pr...

Electronic circuit including circuit-connecting material

Circuit-connecting material and circuit terminal connected structur...

Circuit-connecting material and circuit terminal connected structur...

Adhesive, method of connecting wiring terminals and wiring structure

Adhesive, method of connecting wiring terminals and wiring structure

Circuit-connecting material and circuit terminal connected structur...

Wiring-connecting material and wiring-connected board production pr...

Adhesive for circuit connection , circuit connection method using t...