Tom Dolbear

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Back side metallization
- Patent number 11,488,922
- Issue date Nov 1, 2022
- Advanced Micro Devices, Inc.
- Thomas P. Dolbear
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Back side metallization
- Patent number 10,957,669
- Issue date Mar 23, 2021
- Advanced Micro Devices, Inc.
- Thomas P. Dolbear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back side metallization
- Patent number 10,431,562
- Issue date Oct 1, 2019
- Advanced Micro Devices, Inc.
- Thomas P. Dolbear
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Back side metallization
- Patent number 10,242,962
- Issue date Mar 26, 2019
- Advanced Micro Devices, Inc.
- Thomas P. Dolbear
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low inductance power distribution system for an integrated circuit...
- Patent number 8,198,723
- Issue date Jun 12, 2012
- Advanced Micro Devices, Inc.
- Dennis J. Herrell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low inductance power distribution system for an integrated circuit...
- Patent number 6,828,666
- Issue date Dec 7, 2004
- Advanced Micro Devices, Inc.
- Dennis J. Herrell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Temperature sensor mounting for accurate measurement and durability
- Patent number 6,477,047
- Issue date Nov 5, 2002
- Advanced Micro Devices, Inc.
- Doug Markwardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement for reducing non-uniformity in current flow through var...
- Patent number 6,462,956
- Issue date Oct 8, 2002
- Advanced Micro Devices, Inc.
- Dennis J. Herrell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power surge management for high performance integrated circuit
- Patent number 5,963,023
- Issue date Oct 5, 1999
- Advanced Micro Devices, Inc.
- Dennis James Herrell
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heat transfer apparatus which accommodates elevational disparity ac...
- Patent number 5,926,371
- Issue date Jul 20, 1999
- Advanced Micro Devices, Inc.
- Thomas P. Dolbear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-profile heat transfer apparatus for a surface-mounted semicondu...
- Patent number 5,907,474
- Issue date May 25, 1999
- Advanced Micro Devices, Inc.
- Thomas P. Dolbear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally conductive connection with matrix material and randomly d...
- Patent number 5,445,308
- Issue date Aug 29, 1995
- Richard D. Nelson
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for encapsulating an integrated circuit using a removable he...
- Patent number 5,344,795
- Issue date Sep 6, 1994
- Microelectronics and Computer Technology Corporation
- Seyed H. Hashemi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally and electrically conductive adhesive material and method...
- Patent number 5,328,087
- Issue date Jul 12, 1994
- Microelectronics and Computer Technology Corporation
- Richard D. Nelson
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Thermally conductive screen mesh for encapsulated integrated circui...
- Patent number 5,309,321
- Issue date May 3, 1994
- Microelectronics and Computer Technology Corporation
- Michael A. Olla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure with heat exchanger elements secured t...
- Patent number 5,265,321
- Issue date Nov 30, 1993
- Microelectronics and Computer Technology Corporation
- Richard D. Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid metal paste for thermal and electrical connections
- Patent number 5,170,930
- Issue date Dec 15, 1992
- Microelectronics and Computer Technology Corporation
- Thomas P. Dolbear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid metal paste for thermal and electrical connections
- Patent number 5,056,706
- Issue date Oct 15, 1991
- Microelectronics and Computer Technology Corporation
- Thomas P. Dolbear
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coiled spring heat transfer element
- Patent number 4,993,482
- Issue date Feb 19, 1991
- Microelectronics and Computer Technology Corporation
- Thomas P. Dolbear
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
BACK SIDE METALLIZATION
- Publication number 20190371758
- Publication date Dec 5, 2019
- ADVANCED MICRO DEVICES, INC.
- Thomas P. Dolbear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip chip semiconductor devices and heat sink assemblies, and the c...
- Publication number 20030085453
- Publication date May 8, 2003
- Advance Micro Devices, Inc.
- Lewis M. Eyman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tester with independent control of devices under test
- Publication number 20020121913
- Publication date Sep 5, 2002
- Advanced Micro Devices, Inc.
- R. Mark Miller
- G01 - MEASURING TESTING

Tom Dolbear

Person

Patents Grantslast 30 patents

Back side metallization

Back side metallization

Back side metallization

Back side metallization

Low inductance power distribution system for an integrated circuit...

Low inductance power distribution system for an integrated circuit...

Temperature sensor mounting for accurate measurement and durability

Arrangement for reducing non-uniformity in current flow through var...

Power surge management for high performance integrated circuit

Heat transfer apparatus which accommodates elevational disparity ac...

Low-profile heat transfer apparatus for a surface-mounted semicondu...

Thermally conductive connection with matrix material and randomly d...

Method for encapsulating an integrated circuit using a removable he...

Thermally and electrically conductive adhesive material and method...

Thermally conductive screen mesh for encapsulated integrated circui...

Integrated circuit structure with heat exchanger elements secured t...

Liquid metal paste for thermal and electrical connections

Liquid metal paste for thermal and electrical connections

Coiled spring heat transfer element

Patents Applicationslast 30 patents

BACK SIDE METALLIZATION

Flip chip semiconductor devices and heat sink assemblies, and the c...

Tester with independent control of devices under test