"IBM Technical Disclosure Bulletin", vol. 31, No. 5, Oct. 1988, p. 34. |
Keeler, "Liquid Interconnects for Fine Pitch Assembly?", Electronic Packaging & Production, vol. 14, Jun. 1989. |
Glushkova et al., "Gallium-Copper and Gallium-Nickel Paste Solders", Svar. Proiz., 1968, No. 11, pp. 36-37. |
Tikhomirova et al., "Soldering Copper with Copper-Gallium Solders", Svar. Proiz., 1967, No. 10, pp. 16-18. |
Harman, "Hard Gallium Alloys for Use as Low Contact Resistance Electrodes and for Bonding Thermocouples into Samples", The Review of Scientific Instruments, Jul. 1960, vol. 31, No. 7, pp. 717-720. |
Tikhomirova et al., "Effect of the Particle Shape and Size of a Second Component on the Properties of Gallium Solders", Poroshkovaya Metallurgiya, Dec. 1969, No. 12 (84), pp. 51-56. |