Tom E. Pearson

Person

Beaverton, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Temporal calendar timepiece
- Patent number 11,131,966
- Issue date Sep 28, 2021
- Hewlett-Packard Development Company, L.P.
- Craig Peter Sayers
- G04 - HOROLOGY
Information Patent Grant
Protective device for electronic device
- Patent number 11,046,496
- Issue date Jun 29, 2021
- Hewlett-Packard Development Company, L.P.
- Tom E. Pearson
- B32 - LAYERED PRODUCTS
Information Patent Grant
Electronic wearable device electrode pad with collection well
- Patent number 10,063,074
- Issue date Aug 28, 2018
- Hewlett-Packard Development Company, L.P.
- Terrance O'Shea
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Inclined photonic chip package for integrated optical transceivers...
- Patent number 9,420,700
- Issue date Aug 16, 2016
- Intel Corporation
- Gerrit J Vreman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wireless peripheral data transmission for touchscreen displays
- Patent number 9,367,174
- Issue date Jun 14, 2016
- Intel Corporation
- Richard D. Roberts
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Inclined photonic chip package for integrated optical transceivers...
- Patent number 9,263,621
- Issue date Feb 16, 2016
- Intel Corporation
- Gerrit J Vreman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Temporal based motion sensor reporting
- Patent number 8,901,476
- Issue date Dec 2, 2014
- Intel-Ge Care Innovations LLC
- Terrance J. O'Shea
- G01 - MEASURING TESTING
Information Patent Grant
Temporal based motion sensor reporting
- Patent number 8,525,099
- Issue date Sep 3, 2013
- Intel-Ge Care Innovations LLC
- Terrance J. O'Shea
- G01 - MEASURING TESTING
Information Patent Grant
Method and structure for identifying lead-free solder
- Patent number 7,251,880
- Issue date Aug 7, 2007
- Intel Corporation
- Tom E. Pearson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitor placement for integrated circuit packages
- Patent number 7,230,317
- Issue date Jun 12, 2007
- Intel Corporation
- Tom E. Pearson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of creating solder bar connections on electronic packages
- Patent number 7,185,799
- Issue date Mar 6, 2007
- Intel Corporation
- Tom E. Pearson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldered heat sink anchor and method of use
- Patent number 7,183,496
- Issue date Feb 27, 2007
- Intel Corporation
- George Arrigotti
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structural reinforcement for electronic substrate
- Patent number 7,161,238
- Issue date Jan 9, 2007
- Intel Corporation
- George Hsieh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat-shrinkable retainer for PCB double-sided assembly
- Patent number 7,131,193
- Issue date Nov 7, 2006
- Intel Corporation
- Arjang Fartash
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic embedded wireless antenna
- Patent number 7,122,891
- Issue date Oct 17, 2006
- Intel Corporation
- Terrance Dishongh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing via intersect pad for electronic components
- Patent number 7,036,217
- Issue date May 2, 2006
- Intel Corporation
- Tom E. Pearson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Extension mechanism and method for assembling overhanging components
- Patent number 6,917,524
- Issue date Jul 12, 2005
- Intel Corporation
- Tom E. Pearson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat-shrinkable retainer for PCB double-sided assembly
- Patent number 6,906,268
- Issue date Jun 14, 2005
- Intel Corporation
- Arjang Fartash
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Channeled heat dissipation device and a method of fabrication
- Patent number 6,906,921
- Issue date Jun 14, 2005
- Intel Corporation
- Damion Searls
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly with thermally separated support
- Patent number 6,903,271
- Issue date Jun 7, 2005
- Intel Corporation
- Tom E. Pearson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Constructing of an electronic assembly having a decoupling capacitor
- Patent number 6,884,939
- Issue date Apr 26, 2005
- Intel Corporation
- Terrance J. Dishongh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Retainer for circuit board assembly and method for using the same
- Patent number 6,875,931
- Issue date Apr 5, 2005
- Intel Corporation
- Christopher D. Combs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Zero mounting force solder-free connector/component and method
- Patent number 6,817,878
- Issue date Nov 16, 2004
- Intel Corporation
- Christopher D. Combs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extension mechanism and method for assembling overhanging components
- Patent number 6,801,436
- Issue date Oct 5, 2004
- Intel Corporation
- Tom E. Pearson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interposer to couple a microelectronic device package to a circuit...
- Patent number 6,791,035
- Issue date Sep 14, 2004
- Intel Corporation
- Thomas E. Pearson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Epoxy washer for retention of inverted SMT components
- Patent number 6,791,189
- Issue date Sep 14, 2004
- Intel Corporation
- Tom E. Pearson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Zero insertion force heat-activated retention pin
- Patent number 6,764,325
- Issue date Jul 20, 2004
- Intel Corporation
- George Arrigotti
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Channeled heat dissipation device and a method of fabrication
- Patent number 6,747,873
- Issue date Jun 8, 2004
- Intel Corporation
- Damion Searls
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldered heat sink anchor and method of use
- Patent number 6,734,371
- Issue date May 11, 2004
- Intel Corporation
- George Arrigotti
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Retainer for circuit board assembly and method for using the same
- Patent number 6,700,800
- Issue date Mar 2, 2004
- Intel Corporation
- Christopher Combs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SELF-SEATING SYSTEM AND METHOD
- Publication number 20210080262
- Publication date Mar 18, 2021
- Terrance J O'Shea
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PROTECTIVE DEVICE FOR ELECTRONIC DEVICE
- Publication number 20190241341
- Publication date Aug 8, 2019
- Hewlett-Packard Development Company, L.P.
- Tom E. Pearson
- B32 - LAYERED PRODUCTS
Information Patent Application
TEMPORAL CALENDAR TIMEPIECE
- Publication number 20190033785
- Publication date Jan 31, 2019
- Hewlett-Packard Development Company, L.P.
- Craig Peter Sayers
- G04 - HOROLOGY
Information Patent Application
ELECTRONIC WEARABLE DEVICE ELECTRODE PAD WITH COLLECTION WELL
- Publication number 20170288432
- Publication date Oct 5, 2017
- Hewlett-Packard Development Company, L.P.
- Terry OShea
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
INCLINED PHOTONIC CHIP PACKAGE FOR INTEGRATED OPTICAL TRANSCEIVERS...
- Publication number 20160088740
- Publication date Mar 24, 2016
- Intel Corporation
- Gerrit J. VREMAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DATA TRANSMISSION FOR TOUCHSCREEN DISPLAYS
- Publication number 20150277613
- Publication date Oct 1, 2015
- Richard D. ROBERTS
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INCLINED PHOTONIC CHIP PACKAGE FOR INTEGRATED OPTICAL TRANSCEIVERS...
- Publication number 20150185895
- Publication date Jul 2, 2015
- Gerrit J VREMAN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TEMPORAL BASED MOTION SENSOR REPORTING
- Publication number 20140002270
- Publication date Jan 2, 2014
- Intel-GE Care Innovations LLC
- Terrance J. O'Shea
- G01 - MEASURING TESTING
Information Patent Application
TEMPORAL BASED MOTION SENSOR REPORTING
- Publication number 20120155602
- Publication date Jun 21, 2012
- Terrance J. O'Shea
- G08 - SIGNALLING
Information Patent Application
RFID embedded in device
- Publication number 20060109121
- Publication date May 25, 2006
- Terry J. Dishongh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Capacitor placement for integrated circuit packages
- Publication number 20060049479
- Publication date Mar 9, 2006
- Tom E. Pearson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Infrared transmissive integrated circuit socket cap
- Publication number 20050218035
- Publication date Oct 6, 2005
- Tom E. Pearson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of creating solder bar connections on electronic packages
- Publication number 20050211750
- Publication date Sep 29, 2005
- Tom E. Pearson
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Ceramic embedded wireless antenna
- Publication number 20050134507
- Publication date Jun 23, 2005
- Terrance Dishongh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Constructing of an electronic assembly having a decoupling capacitor
- Publication number 20050090041
- Publication date Apr 28, 2005
- Terrance J. Dishongh
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTRONIC ASSEMBLY WITH THERMALLY SEPARATED SUPPORT
- Publication number 20050067178
- Publication date Mar 31, 2005
- Tom E. Pearson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Extension mechanism and method for assembling overhanging components
- Publication number 20050014419
- Publication date Jan 20, 2005
- Tom E. Pearson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Constructing of an electronic assembly having a decoupling capacitor
- Publication number 20040256133
- Publication date Dec 23, 2004
- Terrance J. Dishongh
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Soldered heat sink anchor and method of use
- Publication number 20040207076
- Publication date Oct 21, 2004
- George Arrigotti
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heat-shrinkable retainer for PCB double-sided assembly
- Publication number 20040209508
- Publication date Oct 21, 2004
- Arjang Fartash
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Channeled heat dissipation device and a method of fabrication
- Publication number 20040179336
- Publication date Sep 16, 2004
- Damion Searls
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Built up lands
- Publication number 20040124006
- Publication date Jul 1, 2004
- Tom E. Pearson
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Structural reinforcement for electronic substrate
- Publication number 20040124517
- Publication date Jul 1, 2004
- George Hsieh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Retainer for circuit board assembly and method for using the same
- Publication number 20040011557
- Publication date Jan 22, 2004
- Christopher D. Combs
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Interposer to couple a microelectronic device package to a circuit...
- Publication number 20040003496
- Publication date Jan 8, 2004
- Intel Corporation
- Thomas E. Pearson
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
RETAINER FOR CIRCUIT BOARD ASSEMBLY AND METHOD FOR USING THE SAME
- Publication number 20030231481
- Publication date Dec 18, 2003
- Christopher Combs
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Zero insertion force heat-activated retention pin
- Publication number 20030216066
- Publication date Nov 20, 2003
- George Arrigotti
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interposer to couple a microelectronic device package to a circuit...
- Publication number 20030156396
- Publication date Aug 21, 2003
- Thomas E. Pearson
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Zero mounting force solder-free connector/component and method
- Publication number 20030124885
- Publication date Jul 3, 2003
- Christopher D. Combs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Epoxy washer for retention of inverted SMT components
- Publication number 20030111259
- Publication date Jun 19, 2003
- Tom E. Pearson
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Tom E. Pearson

Person

Patents Grantslast 30 patents

Temporal calendar timepiece

Protective device for electronic device

Electronic wearable device electrode pad with collection well

Inclined photonic chip package for integrated optical transceivers...

Wireless peripheral data transmission for touchscreen displays

Inclined photonic chip package for integrated optical transceivers...

Temporal based motion sensor reporting

Temporal based motion sensor reporting

Method and structure for identifying lead-free solder

Capacitor placement for integrated circuit packages

Method of creating solder bar connections on electronic packages

Soldered heat sink anchor and method of use

Structural reinforcement for electronic substrate

Heat-shrinkable retainer for PCB double-sided assembly

Ceramic embedded wireless antenna

Methods of manufacturing via intersect pad for electronic components

Extension mechanism and method for assembling overhanging components

Heat-shrinkable retainer for PCB double-sided assembly

Channeled heat dissipation device and a method of fabrication

Electronic assembly with thermally separated support

Constructing of an electronic assembly having a decoupling capacitor

Retainer for circuit board assembly and method for using the same

Zero mounting force solder-free connector/component and method

Extension mechanism and method for assembling overhanging components

Interposer to couple a microelectronic device package to a circuit...

Epoxy washer for retention of inverted SMT components

Zero insertion force heat-activated retention pin

Channeled heat dissipation device and a method of fabrication

Soldered heat sink anchor and method of use

Retainer for circuit board assembly and method for using the same

Patents Applicationslast 30 patents

SELF-SEATING SYSTEM AND METHOD

PROTECTIVE DEVICE FOR ELECTRONIC DEVICE

TEMPORAL CALENDAR TIMEPIECE

ELECTRONIC WEARABLE DEVICE ELECTRODE PAD WITH COLLECTION WELL

INCLINED PHOTONIC CHIP PACKAGE FOR INTEGRATED OPTICAL TRANSCEIVERS...

DATA TRANSMISSION FOR TOUCHSCREEN DISPLAYS

INCLINED PHOTONIC CHIP PACKAGE FOR INTEGRATED OPTICAL TRANSCEIVERS...

TEMPORAL BASED MOTION SENSOR REPORTING

TEMPORAL BASED MOTION SENSOR REPORTING

RFID embedded in device

Capacitor placement for integrated circuit packages

Infrared transmissive integrated circuit socket cap

Method of creating solder bar connections on electronic packages

Ceramic embedded wireless antenna

Constructing of an electronic assembly having a decoupling capacitor

ELECTRONIC ASSEMBLY WITH THERMALLY SEPARATED SUPPORT

Extension mechanism and method for assembling overhanging components

Constructing of an electronic assembly having a decoupling capacitor

Soldered heat sink anchor and method of use

Heat-shrinkable retainer for PCB double-sided assembly

Channeled heat dissipation device and a method of fabrication

Built up lands

Structural reinforcement for electronic substrate

Retainer for circuit board assembly and method for using the same

Interposer to couple a microelectronic device package to a circuit...

RETAINER FOR CIRCUIT BOARD ASSEMBLY AND METHOD FOR USING THE SAME

Zero insertion force heat-activated retention pin

Interposer to couple a microelectronic device package to a circuit...

Zero mounting force solder-free connector/component and method

Epoxy washer for retention of inverted SMT components