Tom Hu

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Gilbert, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Saw and etch singulation method for a chip package
- Patent number 6,841,414
- Issue date Jan 11, 2005
- Amkor Technology, Inc.
- Tom Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with singulation crease
- Patent number 6,611,047
- Issue date Aug 26, 2003
- Amkor Technology, Inc.
- Tom Hu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACK UP PCB SUBSTRATE FOR HIGH DENSITY INTERCONNECT PACKAGES
- Publication number 20080150132
- Publication date Jun 26, 2008
- Tom Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor package with singulation crease
- Publication number 20030073265
- Publication date Apr 17, 2003
- Tom Hu
- H01 - BASIC ELECTRIC ELEMENTS