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Tom M. Lappin
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Mesa, AZ, US
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Patents Grants
last 30 patents
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Patent Grant
Method and system for performing die attach using a flame
Patent number
7,288,472
Issue date
Oct 30, 2007
Intel Corporation
Kris J. Frutschy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Gap control between interposer and substrate in electronic assemblies
Patent number
7,160,757
Issue date
Jan 9, 2007
Intel Corporation
Madhuri R. Narkhede
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
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Patent Application
GAP CONTROL BETWEEN INTERPOSER AND SUBSTRATE IN ELECTRONIC ASSEMBLIES
Publication number
20070158856
Publication date
Jul 12, 2007
Madhuri R. Narkhede
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Gap control between interposer and substrate in electronic assemblies
Publication number
20060240658
Publication date
Oct 26, 2006
Madhuri R. Narkhede
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Method and system for performing die attach using a flame
Publication number
20060134830
Publication date
Jun 22, 2006
Kris J. Frutschy
H01 - BASIC ELECTRIC ELEMENTS