Tomio Fukuda

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Thermosetting resin composition, prepreg, laminate and multilayer p...
- Patent number 11,359,055
- Issue date Jun 14, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Takao Tanigawa
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin composition, resin film, laminate, multilayer printed wiring...
- Patent number 11,339,251
- Issue date May 24, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Yuki Nagai
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin composition, support with resin layer, prepreg, laminate, mul...
- Patent number 11,286,346
- Issue date Mar 29, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Takao Tanigawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin composition, prepreg, laminate and multilayer printed wiring...
- Patent number 11,041,045
- Issue date Jun 22, 2021
- SHOWA DENKO MATERIALS CO., LTD.
- Yuki Nagai
- B32 - LAYERED PRODUCTS
Information Patent Grant
Multilayer transmission line plate
- Patent number 10,957,964
- Issue date Mar 23, 2021
- SHOWA DENKO MATERIALS CO., LTD.
- Takao Tanigawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermosetting resin composition, prepreg, laminated board, printed...
- Patent number 10,876,000
- Issue date Dec 29, 2020
- SHOWA DENKO MATERIALS CO., LTD.
- Shunsuke Tonouchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermosetting resin composition, prepreg, laminate and multilayer p...
- Patent number 10,519,279
- Issue date Dec 31, 2019
- Hitachi Chemical Company, Ltd.
- Takao Tanigawa
- B32 - LAYERED PRODUCTS
Information Patent Grant
Multilayer transmission line plate
- Patent number 10,506,705
- Issue date Dec 10, 2019
- Hitachi Chemical Company, Ltd.
- Yuusuke Kondou
- B32 - LAYERED PRODUCTS
Information Patent Grant
Polyphenylene ether derivative having N-substituted maleimide group...
- Patent number 9,828,466
- Issue date Nov 28, 2017
- Hitachi Chemical Company, Ltd.
- Yasuyuki Mizuno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Incombustible resin composition, prepreg, laminated plate, metal-cl...
- Patent number 6,706,409
- Issue date Mar 16, 2004
- Hitachi Chemical Co., Ltd.
- Nozomu Takano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Prepreg for printed wiring boards, resin varnish, resin composition...
- Patent number 6,696,155
- Issue date Feb 24, 2004
- Hitachi Chemical Company, Ltd.
- Nozomu Takano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Prepreg for printed wiring boards, resin varnish, resin composition...
- Patent number 6,692,792
- Issue date Feb 17, 2004
- Hitachi Chemical Company, Ltd.
- Nozomu Takano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of producing prepreg for printed wiring boards, glass fiber...
- Patent number 6,572,968
- Issue date Jun 3, 2003
- Hitachi Chemical Co., Ltd.
- Nozomu Takano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Prepreg, metal-clad laminate, and printed circuit board obtained fr...
- Patent number 6,524,717
- Issue date Feb 25, 2003
- Hitachi Chemical Co., Ltd.
- Nozomu Takano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin compositions for printed circuit board and printed circ...
- Patent number 6,462,147
- Issue date Oct 8, 2002
- Hitachi Chemical Company, Ltd.
- Michitoshi Arata
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxidized phenol-hydroxybenzaldehyde condensate, bisphenol-formald...
- Patent number 6,329,474
- Issue date Dec 11, 2001
- Hitachi Chemical Company, Ltd.
- Michitoshi Arata
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy composition for printed circuit boards
- Patent number 6,180,250
- Issue date Jan 30, 2001
- Hitachi Chemical Co., Ltd.
- Michitoshi Arata
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method and apparatus for preparing photographic processing control...
- Patent number 5,883,699
- Issue date Mar 16, 1999
- Fuji Photo Film, Co., Ltd.
- Yasuo Kuramitsu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Polyamino-bis-maleimide prepolymer, method for manufacture thereof,...
- Patent number 4,707,316
- Issue date Nov 17, 1987
- Hitachi Chemical Company, Ltd.
- Atsushi Fujioka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Polyamino-bis-maleimide prepolymer, method for manufacture thereof,...
- Patent number 4,598,115
- Issue date Jul 1, 1986
- Hitachi Chemical Company, Ltd.
- Atsushi Fujioka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Polyamino-bis-imide resin
- Patent number 4,526,838
- Issue date Jul 2, 1985
- Hitachi Chemical Company, Ltd.
- Atsushi Fujioka
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE AND MULTILAYER P...
- Publication number 20200071464
- Publication date Mar 5, 2020
- Hitachi Chemical Company, Ltd.
- Takao TANIGAWA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION, RESIN FILM, LAMINATE, MULTILAYER PRINTED WIRING...
- Publication number 20190309130
- Publication date Oct 10, 2019
- Hitachi Chemical Company, Ltd.
- Yuki NAGAI
- B32 - LAYERED PRODUCTS
Information Patent Application
THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATED BOARD, PRINTED...
- Publication number 20190169432
- Publication date Jun 6, 2019
- Hitachi Chemical Company, Ltd.
- Shunsuke TONOUCHI
- B32 - LAYERED PRODUCTS
Information Patent Application
MULTILAYER TRANSMISSION LINE PLATE
- Publication number 20190023899
- Publication date Jan 24, 2019
- Hitachi Chemical Company, Ltd.
- Takao TANIGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION, PREPREG, LAMINATE AND MULTILAYER PRINTED WIRING...
- Publication number 20180134842
- Publication date May 17, 2018
- Hitachi Chemical Company, Ltd.
- Yuki NAGAI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MULTILAYER TRANSMISSION LINE PLATE
- Publication number 20180139837
- Publication date May 17, 2018
- Hitachi Chemical Company, Ltd.
- Yuusuke KONDOU
- B32 - LAYERED PRODUCTS
Information Patent Application
THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE AND MULTILAYER P...
- Publication number 20180127547
- Publication date May 10, 2018
- Hitachi Chemical Company, Ltd.
- Takao TANIGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION, SUPPORT WITH RESIN LAYER, PREPREG, LAMINATE, MUL...
- Publication number 20180002485
- Publication date Jan 4, 2018
- Hitachi Chemical Company, Ltd.
- Takao TANIGAWA
- B32 - LAYERED PRODUCTS
Information Patent Application
POLYPHENYLENE ETHER DERIVATIVE HAVING N-SUBSTITUTED MALEIMIDE GROUP...
- Publication number 20170051109
- Publication date Feb 23, 2017
- Hitachi Chemical Company, Ltd.
- Yasuyuki MIZUNO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Prepreg for printed wiring boards, resin varnish, resin composition...
- Publication number 20030180536
- Publication date Sep 25, 2003
- Nozomu Takano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Incombustible resin composition, prepreg, laminated plate, metal-cl...
- Publication number 20020068173
- Publication date Jun 6, 2002
- HITACHI CHEMICAL CO., TLD
- Nozomu Takano
- B32 - LAYERED PRODUCTS
Information Patent Application
Method of producing prepreg for printed wiring boards, glass fiber...
- Publication number 20010053447
- Publication date Dec 20, 2001
- Nozomu Takano
- C03 - GLASS MINERAL OR SLAG WOOL

Tomio Fukuda

Person

Patents Grantslast 30 patents

Thermosetting resin composition, prepreg, laminate and multilayer p...

Resin composition, resin film, laminate, multilayer printed wiring...

Resin composition, support with resin layer, prepreg, laminate, mul...

Resin composition, prepreg, laminate and multilayer printed wiring...

Multilayer transmission line plate

Thermosetting resin composition, prepreg, laminated board, printed...

Thermosetting resin composition, prepreg, laminate and multilayer p...

Multilayer transmission line plate

Polyphenylene ether derivative having N-substituted maleimide group...

Incombustible resin composition, prepreg, laminated plate, metal-cl...

Prepreg for printed wiring boards, resin varnish, resin composition...

Prepreg for printed wiring boards, resin varnish, resin composition...

Method of producing prepreg for printed wiring boards, glass fiber...

Prepreg, metal-clad laminate, and printed circuit board obtained fr...

Epoxy resin compositions for printed circuit board and printed circ...

Epoxidized phenol-hydroxybenzaldehyde condensate, bisphenol-formald...

Epoxy composition for printed circuit boards

Method and apparatus for preparing photographic processing control...

Polyamino-bis-maleimide prepolymer, method for manufacture thereof,...

Polyamino-bis-maleimide prepolymer, method for manufacture thereof,...

Polyamino-bis-imide resin

Patents Applicationslast 30 patents

THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE AND MULTILAYER P...

RESIN COMPOSITION, RESIN FILM, LAMINATE, MULTILAYER PRINTED WIRING...

THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATED BOARD, PRINTED...

MULTILAYER TRANSMISSION LINE PLATE

RESIN COMPOSITION, PREPREG, LAMINATE AND MULTILAYER PRINTED WIRING...

MULTILAYER TRANSMISSION LINE PLATE

THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE AND MULTILAYER P...

RESIN COMPOSITION, SUPPORT WITH RESIN LAYER, PREPREG, LAMINATE, MUL...

POLYPHENYLENE ETHER DERIVATIVE HAVING N-SUBSTITUTED MALEIMIDE GROUP...

Prepreg for printed wiring boards, resin varnish, resin composition...

Incombustible resin composition, prepreg, laminated plate, metal-cl...

Method of producing prepreg for printed wiring boards, glass fiber...