Tomoaki Hirokawa

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Schottky barrier field effect transistor large in withstanding volt...
- Patent number 6,703,678
- Issue date Mar 9, 2004
- NEC Compound Semiconductor Devices, Ltd.
- Tomoaki Hirokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold cap for semiconductor device mold package
- Patent number 6,340,792
- Issue date Jan 22, 2002
- NEC Corporation
- Tomoaki Hirokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 6,011,303
- Issue date Jan 4, 2000
- NEC Corporation
- Junichi Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrahigh-frequency electronic component and method of manufacturin...
- Patent number 5,970,322
- Issue date Oct 19, 1999
- NEC Corporation
- Seiji Ichikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame flash removing method and apparatus
- Patent number 5,956,574
- Issue date Sep 21, 1999
- NEC Corporation
- Seiji Ichikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hollow package manufacturing method
- Patent number 5,904,501
- Issue date May 18, 1999
- NEC Corporation
- Masatoshi Ohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold package for sealing a chip
- Patent number 5,905,301
- Issue date May 18, 1999
- NEC Corporation
- Seiji Ichikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrahigh-frequency electronic component
- Patent number 5,889,232
- Issue date Mar 30, 1999
- NEC Corporation
- Seiji Ichikawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Schottky barrier field effect transistor large in withstanding volt...
- Publication number 20020043697
- Publication date Apr 18, 2002
- NEC Corporation
- Tomoaki Hirokawa
- H01 - BASIC ELECTRIC ELEMENTS

Tomoaki Hirokawa

Person

Patents Grantslast 30 patents

Schottky barrier field effect transistor large in withstanding volt...

Mold cap for semiconductor device mold package

Electronic component

Ultrahigh-frequency electronic component and method of manufacturin...

Lead frame flash removing method and apparatus

Hollow package manufacturing method

Mold package for sealing a chip

Ultrahigh-frequency electronic component

Patents Applicationslast 30 patents

Schottky barrier field effect transistor large in withstanding volt...