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Tomoaki Nemoto
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Osaka, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Material for substrate mounting optical circuit-electrical circuit...
Patent number
8,073,295
Issue date
Dec 6, 2011
Panasonic Electric Works Co., Ltd.
Tooru Nakashiba
B32 - LAYERED PRODUCTS
Information
Patent Grant
Material for substrate mounting optical circuit-electric circuit mi...
Patent number
7,330,612
Issue date
Feb 12, 2008
Matsushita Electric Works, Ltd.
Tooru Nakashiba
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Chip package structure and process for fabricating the same
Patent number
7,230,331
Issue date
Jun 12, 2007
Industrial Technology Research Institute
Kai-Chi Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package structure
Patent number
7,061,103
Issue date
Jun 13, 2006
Industrial Technology Research Institute
Kai-Chi Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package structure
Patent number
7,057,277
Issue date
Jun 6, 2006
Industrial Technology Research Institute
Kai-Chi Chen
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
MATERIAL FOR SUBSTRATE MOUNTING OPTICAL CIRCUIT-ELECTRICAL CIRCUIT...
Publication number
20080113168
Publication date
May 15, 2008
MATSUSHITA ELECTRIC WORKS, Ltd.
Tooru Nakashiba
G02 - OPTICS
Information
Patent Application
MATERIAL FOR SUBSTRATE MOUNTING OPTICAL CIRCUIT-ELECTRICAL CIRCUIT...
Publication number
20080107881
Publication date
May 8, 2008
MATSUSHITA ELECTRIC WORKS, Ltd.
Tooru Nakashiba
G02 - OPTICS
Information
Patent Application
Material for substrate mounting optical circuit-electrical circuit...
Publication number
20070189661
Publication date
Aug 16, 2007
MATSUSHITA ELECTRIC WORKS, LTD.,
Tooru Nakashiba
G02 - OPTICS
Information
Patent Application
PROCESS FOR FABRICATING CHIP PACKAGE STRUCTURE
Publication number
20070072339
Publication date
Mar 29, 2007
Kai-Chi Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE STRUCTURE
Publication number
20060261499
Publication date
Nov 23, 2006
Industrial Technology Research Institute
Kai-Chi Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Material for substrate mounting optical circuit-electric circuit mi...
Publication number
20050238278
Publication date
Oct 27, 2005
Tooru Nakashiba
G02 - OPTICS
Information
Patent Application
Chip package structure and process for fabricating the same
Publication number
20050087852
Publication date
Apr 28, 2005
Kai-Chi Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
[CHIP PACKAGE STRUCTURE AND PROCESS FOR FABRICATING THE SAME]
Publication number
20040212080
Publication date
Oct 28, 2004
Kai-Chi Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
[CHIP PACKAGE STRUCTURE]
Publication number
20040212970
Publication date
Oct 28, 2004
Kai-Chi Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
[CHIP PACKAGE STRUCTURE]
Publication number
20040212056
Publication date
Oct 28, 2004
Kai-Chi Chen
H01 - BASIC ELECTRIC ELEMENTS