Tomohiro Horio

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Buffer material for packing wafer carrier
- Patent number 9,455,168
- Issue date Sep 27, 2016
- Sumco Corporation
- Tomohiro Horio
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Damper system for transportation of a container
- Patent number 7,753,210
- Issue date Jul 13, 2010
- Sumco Corporation
- Tomohiro Horio
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL

Patents Applicationslast 30 patents

Information Patent Application
Damper system for transportation
- Publication number 20080296200
- Publication date Dec 4, 2008
- Tomohiro Horio
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
CUSHIONING FOR PACKING CASSETTE CASES
- Publication number 20080083643
- Publication date Apr 10, 2008
- SUMCO CORPORATION
- Tomohiro Horio
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
Damper system for transportation
- Publication number 20050016896
- Publication date Jan 27, 2005
- SUMITOMO MITSUBISHI SILICON CORPORATION
- Tomohiro Horio
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL